Patents Examined by Matthew Dzierzynski
  • Patent number: 10978833
    Abstract: An electromagnetic interference (EMI) grounding protection method for a connector assembly using a conductive housing. The method includes the steps of: conducting the EMI generated by a source towards a metallic braided shield, the metallic braided shield being secured and mounted onto the conductive housing by a metallic clamp; conducting the EMI from the metallic braided shield to the metallic clamp and to the conductive housing, the conductive plastic housing being mounted onto a metallic device by at least a metallic bolt and the bolt being accommodated within a corresponding metallic compression limiter; and thereafter, conducting the EMI: (1) from the conductive housing through the metallic compression limiters and through their respective bolts, and ultimately to the metallic device, and (2) from the conductive housing directly through conductive pads thereof, and ultimately to the metallic device.
    Type: Grant
    Filed: July 7, 2019
    Date of Patent: April 13, 2021
    Assignee: J.S.T. CORPORATION
    Inventor: Vikas Azad