Patents Examined by Michael A Band
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Patent number: 11967493Abstract: It is difficult for a Cr—Si-based sintered body composed of chromium silicide (CrSi2) and silicon (Si) to have high strength. Provided is a Cr—Si-based sintered body including Cr (chromium) and silicon (Si), in which the crystal structure attributed by X-ray diffraction is composed of chromium silicide (CrSi2) and silicon (Si), a CrSi2 phase is present at 60 wt % or more in a bulk, a density of the sintered body is 95% or more, and an average grain size of the CrSi2 phase is 60 ?m or less.Type: GrantFiled: November 18, 2019Date of Patent: April 23, 2024Assignee: TOSOH CORPORATIONInventors: Hiroyuki Hara, Hideto Kuramochi, Kenichi Itoh
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Patent number: 11961723Abstract: Embodiments of a process kit are provided herein. In some embodiments, a process kit includes a deposition ring configured to be disposed on a substrate support, the deposition ring including an annular band configured to rest on a lower ledge of the substrate support, the annular band having an upper surface and a lower surface, the lower surface including a step between a radially inner portion and a radially outer portion; an inner lip extending upwards from the upper surface of the annular band and adjacent an inner surface of the annular band, wherein a depth between an upper surface of the annular band and a horizontal portion of the upper surface of the inner lip is between about 6.0 mm and about 12.0 mm; a channel disposed radially outward of and beneath the annular band; and an outer lip extending upwardly and disposed radially outward of the channel.Type: GrantFiled: December 17, 2018Date of Patent: April 16, 2024Assignee: APPLIED MATERIALS, INC.Inventors: David Gunther, Cheng-Hsiung Tsai, Kirankumar Neelasandra Savandaiah
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Patent number: 11952655Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a physical vapor deposition processing chamber comprises a chamber body defining a processing volume, a substrate support disposed within the processing volume and comprising a substrate support surface configured to support a substrate, a power supply configured to energize a target for sputtering material toward the substrate, an electromagnet operably coupled to the chamber body and positioned to form electromagnetic filed lines through a sheath above the substrate during sputtering for directing sputtered material toward the substrate, and a controller operably coupled to the physical vapor deposition processing chamber for controlling the electromagnet based on a recipe comprising a pulsing schedule for pulsing the electromagnet during operation to control directionality of ions relative to a feature on the substrate.Type: GrantFiled: May 5, 2022Date of Patent: April 9, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Kevin Kashefi, Xiaodong Wang, Suhas Bangalore Umesh, Zheng Ju, Jiajie Cen
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Patent number: 11948784Abstract: Apparatus and methods for improving film uniformity in a physical vapor deposition (PVD) process are provided herein. In some embodiments, a PVD chamber includes a pedestal disposed within a processing region of the PVD chamber, the pedestal having an upper surface configured to support a substrate thereon, a first motor coupled to the pedestal, a lid assembly comprising a first target, a first magnetron disposed over a portion of the first target, and in a region of the lid assembly that is maintained at atmospheric pressure, a first actuator configured to translate the first magnetron in a first direction, a second actuator configured to translate the first magnetron in a second direction, and a system controller that is configured to cause the first magnetron to translate along at least a portion of a first path by causing the first actuator and second actuator to simultaneously translate the first magnetron.Type: GrantFiled: October 21, 2021Date of Patent: April 2, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Harish Penmethsa, Hong S. Yang, Suresh Palanisamy
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Patent number: 11929242Abstract: The present disclosure provides a shielding mechanism and a thin-film-deposition equipment using the same, wherein the shielding mechanism includes two shield members and a driver. The driver includes a motor and a shaft seal. The motor interconnects the two shield members via the shaft seal, and such that to drive the two shield members to sway in opposite directions and to switch between an open state and a shielding state. Furthermore, each of the two shield members is formed with at least one cavity, for reducing weights thereof and loading of the motor and the driver.Type: GrantFiled: November 12, 2021Date of Patent: March 12, 2024Assignee: SKY TECH INC.Inventor: Jing-Cheng Lin
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Patent number: 11915917Abstract: Methods and apparatus for physical vapor deposition are provided herein. In some embodiments, a process kit shield for use in a physical vapor deposition chamber may include an electrically conductive body having one or more sidewalls defining a central opening, wherein the body has a ratio of a surface area of inner facing surfaces of the one or more sidewalls to a height of the one or more sidewalls of about 2 to about 3.Type: GrantFiled: June 15, 2020Date of Patent: February 27, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Alan Ritchie, John C. Forster, Muhammad Rasheed
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Patent number: 11913109Abstract: A magnet assembly is disclosed for steering ions used in the formation of a material layer upon a substrate during a pulsed DC physical vapour deposition process. Apparatus and methods are also disclosed incorporating the assembly for controlling thickness variation in a material layer formed via pulsed DC physical vapour deposition. The magnet assembly comprises a magnetic field generating arrangement for generating a magnetic field proximate the substrate and means for rotating the ion steering magnetic field generating arrangement about an axis of rotation, relative to the substrate. The magnetic field generating arrangement comprises a plurality of magnets configured to an array which extends around the axis of rotation, wherein the array of magnets are configured to generate a varying magnetic field strength along a radial direction relative to the axis of rotation.Type: GrantFiled: August 15, 2019Date of Patent: February 27, 2024Assignee: SPTS TECHNOLOGIES LIMITEDInventors: Tony Wilby, Steve Burgess, Adrian Thomas, Rhonda Hyndman, Scott Haymore, Clive Widdicks, Ian Moncrieff
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Patent number: 11894221Abstract: Provided is a sputtering target, comprising: from 0.001 mol % to 0.5 mol % of Bi; from 45 mol % or less of Cr; 45 mol % or less of Pt; 60 mol % or less of Ru; and a total of 1 mol % to 35 mol % of at least one metal oxide, the balance being Co and inevitable impurities.Type: GrantFiled: May 23, 2019Date of Patent: February 6, 2024Assignee: JX Metals CorporationInventors: Yasuyuki Iwabuchi, Manami Masuda, Takashi Kosho
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Patent number: 11875980Abstract: A method is for depositing a dielectric material on to a substrate in a chamber by pulsed DC magnetron sputtering with a pulsed DC magnetron device which produces one or more primary magnetic fields. In the method, a sputtering material is sputtered from a target, wherein the target and the substrate are separated by a gap in the range 2.5 to 10 cm and a secondary magnetic field is produced within the chamber which causes a plasma produced by the pulsed DC magnetron device to expand towards one or more walls of the chamber.Type: GrantFiled: December 31, 2020Date of Patent: January 16, 2024Inventors: Stephen R Burgess, Rhonda Hyndman, Amit Rastogi, Eduardo Paulo Lima, Clive L Widdicks, Paul Rich, Scott Haymore, Daniel Cook
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Patent number: 11862444Abstract: An electrically conductive, oxidic target material includes a proportion of substoichiometric molybdenum oxide phases of at least 60% by volume, an MoO2 phase in a proportion of 2-20% by volume, and optionally an MoO3 phase in a proportion of 0-20% by volume. The substoichiometric molybdenum oxide phase proportion is formed by one or more substoichiometric MoO3-y phase(s), where y is in each case in a range from 0.05 to 0.25. A process for producing the target material and a process for using the target material are also provided.Type: GrantFiled: September 5, 2018Date of Patent: January 2, 2024Assignee: Plansee SEInventors: Enrico Franzke, Harald Koestenbauer, Joerg Winkler, Dominik Lorenz, Thomas Leiter
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Patent number: 11842889Abstract: A device, a method, and a use for coating lenses are proposed, wherein the lenses to be coated are arranged in pairs over parallel, tubular targets. The distance of the targets to each other and/or to the lenses is varied for individual adaption. Further, the lenses are coated from both sides.Type: GrantFiled: November 16, 2017Date of Patent: December 12, 2023Assignee: SCHNEIDER GMBH & CO. KGInventors: Gunter Schneider, Markus Fuhr
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Patent number: 11837450Abstract: Provided is a sputtering target or a film which is characterized by containing 0.1 to 10 mol % of an oxide of one or more types selected from FeO, Fe3O4, K2O, Na2O, PbO, and ZnO, 5 to 70 mol % of Pt, and the remainder being Fe. The present invention addresses the issue of providing a sputtering target capable of considerably reducing the particles caused by nonmagnetic materials and significantly improving the yield during deposition. It is thereby possible to deposit a quality magnetic recording layer and improve yield of a magnetic recording medium.Type: GrantFiled: January 4, 2017Date of Patent: December 5, 2023Assignee: JX Metals CorporationInventor: Takashi Kosho
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Patent number: 11823880Abstract: A target structure includes a target, a cooling jacket having a flow path through which a heat exchange medium flows, and a backing plate. The target is bonded to one surface of the cooling jacket. A remaining surface of the cooling jacket and the backing plate are bonded in a peripheral portion, and are not bonded in a non-bonding region inside the peripheral portion.Type: GrantFiled: July 15, 2020Date of Patent: November 21, 2023Assignee: TOKYO ELECTRON LIMITEDInventor: Einstein Noel Abarra
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Patent number: 11821069Abstract: A method of making a decorative article (1) such as a jewellery piece, the article comprising a body (2) having a decorative layer (5) and an element (3) set into the body. The method comprises: providing an element that is at least partially coated with a removable layer (4), setting the element into the body, coating the element and the body with the decorative layer, and removing the removable layer and the decorative layer from the element.Type: GrantFiled: May 17, 2019Date of Patent: November 21, 2023Assignee: D. Swarovski KGInventors: Alexander Rief, Thomas Rauch, Jan Woerdenweber
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Patent number: 11823859Abstract: A method of sputtering a layer on a substrate using a high-energy density plasma (HEDP) magnetron includes positioning the magnetron in a vacuum with an anode, cathode target, magnet assembly, substrate, and feed gas; applying unipolar negative direct current (DC) voltage pulses from a pulse power supply with a pulse forming network (PFN) to a pulse converting network (PCN); and adjusting an amplitude and frequency associated with the plurality of unipolar negative DC voltage pulses causing a resonance mode associated with the PCN. The PCN converts the unipolar negative DC voltage pulses to an asymmetric alternating current (AC) signal that generates a high-density plasma discharge on the HEDP magnetron.Type: GrantFiled: December 18, 2020Date of Patent: November 21, 2023Assignee: IonQuest Corp.Inventor: Bassam Hanna Abraham
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Patent number: 11810770Abstract: Methods and apparatus for processing substrates are disclosed. In some embodiments, a process chamber for processing a substrate includes: a body having an interior volume and a target to be sputtered, the interior volume including a central portion and a peripheral portion; a substrate support disposed in the interior volume opposite the target and having a support surface configured to support the substrate; a collimator disposed in the interior volume between the target and the substrate support; a first magnet disposed about the body proximate the collimator; a second magnet disposed about the body above the support surface and entirely below the collimator and spaced vertically below the first magnet; and a third magnet disposed about the body and spaced vertically between the first magnet and the second magnet. The first, second, and third magnets are configured to generate respective magnetic fields to redistribute ions over the substrate.Type: GrantFiled: September 30, 2021Date of Patent: November 7, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Xiaodong Wang, Joung Joo Lee, Fuhong Zhang, Martin Lee Riker, Keith A. Miller, William Fruchterman, Rongjun Wang, Adolph Miller Allen, Shouyin Zhang, Xianmin Tang
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Patent number: 11784033Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a method for processing a substrate comprises applying a DC target voltage to a target disposed within a processing volume of a plasma processing chamber, rotating a magnet disposed above the target at a default speed to direct sputter material from the target toward a substrate support disposed within the processing volume, measuring in-situ DC voltage in the processing volume, the in-situ DC voltage different from the DC target voltage, determining if a measured in-situ DC voltage is greater than a preset value, if the measured in-situ DC voltage is less than or equal to the preset value, maintaining the magnet at the default speed, and if the measured in-situ DC voltage is greater than the preset value, rotating the magnet at a speed less than the default speed to decrease the in-situ DC voltage.Type: GrantFiled: May 28, 2021Date of Patent: October 10, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Mengxue Wu, Siew Kit Hoi, Jay Min Soh, Yue Cui, Chul Nyoung Lee, Palaniappan Chidambaram, Jiao Song
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Patent number: 11781211Abstract: In a method for coating on a surface of a medical PEEK material with titanium to have a microporous structure, titanium is coated on a surface of polyether ether ketone (PEEK) via magnetron sputtering. The surface of the titanium coated on the surface of PEEK is polished via an electromagnetic polishing apparatus. A thin-film with titanium dioxide (TiO2) having a microporous structure is formed on the polished surface of the titanium via an anodic oxidation treatment.Type: GrantFiled: July 19, 2018Date of Patent: October 10, 2023Assignee: OSONG MEDICAL INNOVATION FOUNDATIONInventors: Tae Gon Jung, Yong Hoon Jeong, Su Won Lee, Kwang Min Park, Jae Woong Yang, Jae Young Jung, Kwan Su Kang
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Patent number: 11761077Abstract: Systems and methods for forming probes for a biosensor. In the systems and methods disclosed herein, a base substrate is provided; and a platinum layer is formed on the base substrate by sputtering platinum in the absence of oxygen. The platinum layer is formed using a sputtering pressure of at least 30 mtorr.Type: GrantFiled: August 1, 2018Date of Patent: September 19, 2023Assignee: MEDTRONIC MINIMED, INC.Inventors: Kelly Lu, Lea Ann Nygren
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Patent number: 11718908Abstract: A method of depositing a film on a substrate is provided. The method includes positioning the substrate on a substrate support in a chamber and depositing the film on the substrate using a DC magnetron sputtering process in which an electrical bias signal causes ions to bombard the substrate. The substrate support includes a central region surrounded by an edge region, the central region being raised with respect to the edge region, and the substrate is positioned on the central region so that a portion of the substrate overlays the edge region and is spaced apart therefrom.Type: GrantFiled: April 27, 2021Date of Patent: August 8, 2023Assignee: SPTS TECHNOLOGIES LIMITEDInventors: Scott Haymore, Amit Rastogi, Rhonda Hyndman, Steve Burgess, Ian Moncrieff