Patents Examined by Michael D. Switzer
  • Patent number: 5420744
    Abstract: A multilayered ceramic capacitor having internal electrodes comprising a substantially single-crystal metallic powder as a conductor, the powder having been produced by spraying a solution containing at least one metal salt to form droplets and heating the droplets to a temperature higher than the decomposition temperature of the metal salt and the melting point of the metal. When the metal salt forms an oxide at a temperature not higher than the melting point of the metal, the droplets are heated to a temperature higher than the decomposition temperature of the oxide. The multilayered capacitor is free from generated cracks in the ceramic material.
    Type: Grant
    Filed: September 21, 1993
    Date of Patent: May 30, 1995
    Assignee: Shoei Chemical Inc.
    Inventors: Eiichi Asada, Kazurou Nagashima
  • Patent number: 5420746
    Abstract: A solid state electronic device using single electrons to convey informat. A cluster of pure carbon atoms, commonly known as a fullerene, is used to trap a single electron tunneling through an insulating material located between conductive layers of the device.
    Type: Grant
    Filed: April 13, 1993
    Date of Patent: May 30, 1995
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventor: Doran C. Smith
  • Patent number: 5418681
    Abstract: A capacitive micro-sensor includes a sandwich of at least two silicon plates. A peripheral stripe of each side of one plate is assembled to a corresponding stripe of the opposing surface of an adjacent plate through an insulating layer. The lateral sides of the sandwich are provided with notches partially penetrating in each of the insulating layers, and are thicker than the thickness of the insulating layers.
    Type: Grant
    Filed: February 19, 1993
    Date of Patent: May 23, 1995
    Assignee: Sextant Avionique
    Inventors: Isabelle Thomas, Pierre O. Lefort, Christophe Legoux
  • Patent number: 5414589
    Abstract: The present invention provides a capacitor having a changeable dielectric capacity which has advantages in changing the dielectric capacity and increasing the maximum dielectric capacity. The capacitor having a changeable dielectric capacity comprises ceramic main body part 1 in which a first and second internal electrodes 2a and 2b are formed. Four terminal electrodes 3 are formed apart on a face of the ceramic main body part 1. A common terminal electrode 4 is formed on the ceramic main body part 1 so that it connects with the internal electrodes 2a and 2b. To these terminal electrodes 3 and 4 are connected their respective lead wires 5 for wiring.
    Type: Grant
    Filed: June 7, 1993
    Date of Patent: May 9, 1995
    Assignee: Rohm Co., Ltd.
    Inventors: Koshi Amano, Satoru Yatake
  • Patent number: 5414240
    Abstract: An electrically heatable windshield with a hidden bus bar configuration. A border of opaque ceramic material, preferably a lead borosilicate enamel, is bonded to an interior surface of the transparency about its periphery. Opposing electroconductive bus bars, preferably a low frit content silver-containing ceramic material, are bonded to the ceramic material so that the entire inner edge of the bus bar overlays a portion of the ceramic material and is spaced from the inner edge of the border, providing an intermediate portion of the border between the bus bars and transparency surface that is not covered by the bus bars. An electro-conductive coating is applied to the transparency to interconnect the bus bars and covers to the inner surface of the transparency, the bus bars and the intermediate portion of the ceramic material border so that electric current flowing between the bus bars must flow through the portion of the coating that covers the intermediate portion of the border.
    Type: Grant
    Filed: December 27, 1988
    Date of Patent: May 9, 1995
    Assignee: PPG Industries, Inc.
    Inventors: Thomas M. Carter, Charles R. Coleman, Russell C. Criss, Frank H. Gillery, Pamela L. Martino, Amy M. Roginski, John A. Winter, Terry L. Wolfe, James J. Finley
  • Patent number: 5412533
    Abstract: A solid electrolytic capacitor is constructed by a capacitor element body, a metal rod extended through the central part of the element body, an anode member, and an insulating layer placed between the flange part of the anode member and the element body. The capacitor element body consists of a chip-like porous solid formed by shaping and sintering rectifying metal particles, the porous solid having a dielectric layer and a solid electrolytic layer both being formed thereon. The anode member includes a protruded part and a flange part, the end face of the protruded part being brought into contact and connected with one of the end faces of the metal rod. A method of manufacturing solid electrolytic capacitors thus constructed is also disclosed.
    Type: Grant
    Filed: June 21, 1994
    Date of Patent: May 2, 1995
    Assignee: Rohm Co., Ltd.
    Inventors: Tomohiro Murayama, Yasuo Kanetake
  • Patent number: 5412532
    Abstract: A polygonal capacitor including a polygonal capacitor case having an engaging portion at an inner surface thereof; a capacitor element accommodated in the polygonal capacitor case; a plurality of terminals respectively connected to a plurality of electrodes of the capacitor element through a base portion of each terminal; an insulating terminal base to which the terminals are fixed; and a resin filled in the polygonal capacitor case. An engaging member formed at the insulating terminal base is in pressure contact with the engaging portion of the polygonal capacitor case.
    Type: Grant
    Filed: September 3, 1993
    Date of Patent: May 2, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiyuki Nishimori, Akinori Asahara
  • Patent number: 5410445
    Abstract: A solid electrolytic capacitor is provided which comprises a capacitor element including a chip and an anode wire projecting from the chip, an anode lead electrically connected to the anode wire, a cathode lead electrically connected to the chip, and a resin package enclosing the capacitor element together with part of the anode and cathode leads. The resin package has a first end face from which the cathode lead projects out, and a second end face located adjacent to the anode lead. Each of the anode and cathode leads is bent outside the package toward the underside thereof. The resin package includes a larger width portion adjacent to the first end face and a smaller width portion adjacent to the second end face. The anode lead extends transversely of the anode wire and projects laterally from the smaller width portion.
    Type: Grant
    Filed: April 29, 1994
    Date of Patent: April 25, 1995
    Assignee: Rohm Co., Ltd.
    Inventor: Yasuo Kanetake
  • Patent number: 5406448
    Abstract: A hanger for a power factor capacitor and method of attachment by brazing reduces metallurgical changes that can lead to cracks in the tank wall from welding. The hanger has a base plate with a circular opening and a raised shoulder that provides a single ring of contact between the tank wall and hanger. A ring of brazing alloy is placed within the opening on the tank wall. Through induction of electric current, the brazing alloy melts and flows resulting in a complete braze between the hanger and the tank wall which is accomplished at a much lower temperature than other welding techniques.
    Type: Grant
    Filed: January 21, 1993
    Date of Patent: April 11, 1995
    Assignee: Cooper Power Systems, Inc.
    Inventors: David W. Anderson, David W. Morrison, James E. Hart, Richard A. Ashley, James R. Bannister, Jr., Claudus E. McNure, Jerry L. Crawford
  • Patent number: 5406049
    Abstract: The mirror assembly uses a non-reflective conductive coating as a heating element for preventing fog formation on a mirror exposed to a humid environment such as is found in a bathroom. As compared to conductive reflective mirror coatings, the non-reflective conductive coatings used in this invention have a relatively high resistance, which allows high reflectivity mirrors to be made fog-free. The conductive coatings may be split into separate conductive elements with one or more scribe lines in order to control the length of the conductive path from inlet bus to outlet bus. The buses may be made from an ultra thin foil tape, which can be adhered to the conductive coatings, and which is solderable for securement of power lines thereto. Such a bus tape possesses both in plane and through plane conductive characteristics and can easily be cut to any length desired for the mirror sizes being produced.
    Type: Grant
    Filed: May 23, 1994
    Date of Patent: April 11, 1995
    Inventors: Carl Reiser, Richard Sawyer
  • Patent number: 5406445
    Abstract: A NaCl oxide thin layer oriented to (100) face or a spinel oxide thin layer oriented to (100) face, a perovskite dielectric thin layer oriented to (100) face and a metal electrode are sequentially laminated on a metal electrode, thus providing a thin film capacitor. Or alternatively, a thin film capacitor is manufactured by sequentially laminating a NaCl oxide thin layer oriented to (100) face or a spinel oxide thin layer oriented to (100) face, a platinum thin layer as a lower electrode oriented to (100) face, a perovskite dielectric thin layer oriented to (100) face and a metal thin layer as an upper electrode on a substrate. A plasma-enhanced CVD method is applied to form a NaCl oxide thin layer, a spinel oxide thin layer and a perovskite dielectric thin layer while a vacuum deposition method, a sputtering method, a CVD method or a plasma-enhanced CVD method is applied for the formation of a metal electrode.
    Type: Grant
    Filed: March 24, 1994
    Date of Patent: April 11, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Eiji Fujii, Atsushi Tomozawa, Hideo Torii, Masumi Hattori, Ryoichi Takayama, Satoru Fujii
  • Patent number: 5406446
    Abstract: A thin-film bypass capacitor is fabricated by forming a plurality of through holes through the thickness of a nonconductive base substrate and filling the through holes with a conductive material to form ground vias and power vias. A sequence of back side metalization layers are applied to the back side surface of the base substrate. A sequence of bottom contact layers are applied to the front side surface of the base substrate. A bottom contact power terminal is formed and a bottom contact metalization layer is applied to the surface of the bottom contact layers. A portion of the metalization layer is removed and an insulating layer is formed on the surface of the bottom contact metalization layer. A ground metalization feedthrough and a power metalization feedthrough are formed at the surface of the insulating layer. A sequence of top contact layers are applied to the surface of the insulating layer and a front side ground terminal and front side power terminal are formed.
    Type: Grant
    Filed: February 25, 1994
    Date of Patent: April 11, 1995
    Assignee: Fujitsu Limited
    Inventors: Michael G. Peters, William T. Chou, Wen-chou V. Wang, Michael G. Lee, Solomon I. Beilin
  • Patent number: 5404265
    Abstract: A bypass capacitor for use with an integrated circuit module, and method of making the same, are shown. The integrated circuit module comprises an integrated circuit "chip" mounted in opposing relationship to a carrier substrate and having a plurality of interconnects, such as solder bumps or wire interconnects, for providing signal lines and supplying power to the chip. Some of the interconnects are, instead, used to form capacitors such that bypass capitance is placed in close proximity to the chip, while not using up valuable real estate on the chip or on the carrier substrate. Various embodiments of such bypass capacitors are shown.
    Type: Grant
    Filed: August 28, 1992
    Date of Patent: April 4, 1995
    Assignee: Fujitsu Limited
    Inventors: Larry L. Moresco, David G. Love, Wen-Chou V. Wang
  • Patent number: 5401911
    Abstract: An improved connection through a substrate layer is formed by embedding a conductive element such as a pin on one or more balls or spheres in a thermoplastic material which is preferably a liquid crystal polymer. The substrate may be heated to facilitate the embedding process in which material of the substrate layer is reflowed under pressure to retain the conductive element by means of a preload force. The formation of such connections with either pins or plural conductive elements allows independence of aspect ratio of the connection and, hence, feature size of conductive patterns on the substrate and the thickness of the substrate layer.
    Type: Grant
    Filed: April 3, 1992
    Date of Patent: March 28, 1995
    Assignee: International Business Machines Corporation
    Inventors: Herbert Anderson, Arthur Bross, Julian G. Cempa, Robert O. Lussow, Donald E. Myers, Thomas J. Walsh
  • Patent number: 5402306
    Abstract: An electrode separator for electrochemical energy storage devices, such as a high energy density capacitor incorporating a variety of carbon foam electrodes. The separator is derived from an aquagel of resorcinol-formaldehyde and related polymers and containing ionically conducting electrolyte in the pores thereof.
    Type: Grant
    Filed: May 4, 1993
    Date of Patent: March 28, 1995
    Assignee: Regents of the University of California
    Inventors: Steven T. Mayer, James L. Kaschmitter, Richard W. Pekala
  • Patent number: 5400210
    Abstract: In a substrate having built-in capacitor which is incorporated in and united with an insulator, the capacitor has a dielectric layer made of a silicon nitride-based ceramic containing silicon carbide in an amount of from 13 to 30% by weight.
    Type: Grant
    Filed: June 23, 1993
    Date of Patent: March 21, 1995
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Noriyasu Sugimoto, Yukihiro Kimura, Masaharu Seto
  • Patent number: 5398155
    Abstract: A pair of electrode plates each having a lead terminal, which are disposed on opposite polar faces of a stacked electric double layer capacitor element, are made of a stainless steel plate or 42% nickel-iron steel plate, whereby a thickness of the electrode plate is reduced as compared with that in SPCC and thus a thickness of the capacitor is shrunk.
    Type: Grant
    Filed: May 25, 1993
    Date of Patent: March 14, 1995
    Assignee: NEC Corporation
    Inventors: Kazuhiko Sato, Munekazu Aoki
  • Patent number: 5392191
    Abstract: High energy density aqueous pseudocapacitors may be achieved by providing such devices with dissimilar transition metal oxide electrodes. The transition metal oxide electrodes are particularly adapted for use as the anode (20) of a pseudocapacitor device (10).
    Type: Grant
    Filed: August 4, 1994
    Date of Patent: February 21, 1995
    Assignee: Motorola, Inc.
    Inventors: George Thomas, Sathya Prasad, John E. Nerz
  • Patent number: 5388024
    Abstract: A ceramic capacitor and method of making same is disclosed. The capacitor is trapezoidal in longitudinal section with the electrodes exposed at the angled ends of the trapezoid. The ends face generally in the same direction such that both ends may be simultaneously exposed to a sputtering or vapor deposition procedure and thus sputtered in a single operation without requiring re-masking. The sputtering step, in addition to providing terminations, functions to mechanically couple a multiplicity of capacitors into a compact grouping from which one or more capacitors may be readily extracted.
    Type: Grant
    Filed: August 2, 1993
    Date of Patent: February 7, 1995
    Assignee: AVX Corporation
    Inventor: John Galvagni
  • Patent number: 5388025
    Abstract: A rechargeable electrical energy storage device (20). The cell has two electrodes (28, 36) constructed from a similar organometallic compound (30), and the electrodes are electrically connected by an ion carrying electrolyte (32). The electrodes are also physically separated from each other by a barrier (34) that will pass ions but not electrons. In one embodiment of the invention, the electrodes are ferrocene, and the electrolyte is sulfuric acid.
    Type: Grant
    Filed: September 1, 1992
    Date of Patent: February 7, 1995
    Assignee: Motorola, Inc.
    Inventors: James L. Davis, John K. Arledge, Thomas J. Swirbel, Melanie Williams