Abstract: A method and system for providing a multi-bank memory is described. The method and system include providing a plurality of banks. Each of the plurality of banks includes at least one array including a plurality of memory cells and analog sensing circuitry. The method and system further include providing common digital sensing circuitry coupled with the plurality of banks.

Abstract: A read/verify circuit for multilevel memory cells includes: a read terminal selectively connectable to a plurality of array cells, having respective array threshold voltages; a plurality of reference cells, having respective reference threshold voltages; and a plurality of threshold-detection circuits, for detecting the array thresholds and the reference thresholds. In particular, the read terminal and the reference cells are each connected to a respective threshold-detection circuit. Each threshold-detection circuit is provided with a respective detector element of a resistive type, set so as to be traversed by a current response to turning-on of the respective array cell or reference cell associated thereto.

Abstract: A method for reading data from a memory module over a bi-directional bus is provided. The method initiates with writing data into a storage element asynchronously according to a first clock domain. Next, the data is read from the storage element synchronously according to a second clock domain. A microprocessor and a system wherein data is read over a bi-directional bus are included.

Abstract: A solid state magnetic memory system and method disposes an array of magnetic media cells in an array on a substrate. In an exemplary embodiment, drive electronics are fabricated into the substrate through conventional CMOS processing in alignment with associated cells of the array. The magnetic media cells each include a magnetic media bit and a magnetoresistive or GMR stack for reading the state of the media bit. Addressing lines are juxtaposed with the media bits to permit programming and erasing of selected ones of the bits. In at least some embodiments, sector erase may be performed.

Abstract: Source line bias is an error introduced by a non-zero resistance in the ground loop of the read/write circuits. During sensing the source of a memory cell is erroneously biased by a voltage drop across the resistance and results in errors in the applied control gate and drain voltages. This error is minimized when the applied control gate and drain voltages have their reference point located as close as possible to the sources of the memory cells. In one preferred embodiment, the reference point is located at a node where the source control signal is applied. When a memory array is organized in pages of memory cells that are sensed in parallel, with the sources in each page coupled to a page source line, the reference point is selected to be at the page source line of a selected page via a multiplexor.

Abstract: Source line bias is an error introduced by a non-zero resistance in the ground loop of the read/write circuits. During sensing the source of a memory cell is erroneously biased by a voltage drop across the resistance and results in errors in the applied control gate and drain voltages. This error is minimized when the applied control gate and drain voltages have their reference point located as close as possible to the sources of the memory cells. In one preferred embodiment, the reference point is located at a node where the source control signal is applied. When a memory array is organized in pages of memory cells that are sensed in parallel, with the sources in each page coupled to a page source line, the reference point is selected to be at the page source line of a selected page via a multiplexor.

Abstract: Regulating a program voltage value during multilevel memory device programming includes utilizing a program path duplicate in an output pump regulator circuit. Further, the output pump regulator circuit is utilized to provide a regulated program voltage for memory cell programming, the regulated program voltage correcting for a program path voltage drop.

Abstract: A semiconductor memory device includes a memory cell array to store data; a data input portion to output data to the memory cell array in response to a write control signal; a data output portion to output data from the memory cell array in response to a read control signal; a data I/O gate to transmit data outputted from the data input portion to the memory cell array in response to the write control signal, and transmitting data outputted from the memory cell array to the data output portion in response to the read control signal; and a data I/O controller to generate the read control signal and the write control signal having a smaller minimum cycle time than a minimum cycle time of the read control signal. The semiconductor memory device has an improved operation performance compared to one having a low operation frequency within an operable frequency range.

Abstract: In a dynamic random access memory device, an auto-refresh method comprises receiving a command for the memory device to operate in a half-density mode. This causes a remapping circuit to remap a first memory address bit to an unused memory address location. Using the new addressing scheme, an auto-refresh operation is performed on the memory array operating in the half-density mode without skipping refresh commands.

Abstract: In some embodiments, the invention provides a chip with at least one memory circuit that comprises a majority voter circuit with first and second digitally controlled variable delay elements. The first delay element is controlled by data bits that are to be written to a portion of the memory circuit. The majority voter circuit determines if the data bits are to be inverted prior to being written into the memory circuit portion.

Abstract: A circuit exhibits a signal input, means for determining a reference level on the basis of properties of a signal received at the signal input. In addition, the circuit further exhibits means for evaluating the signal on the basis of the reference level.

Abstract: In a semiconductor memory in which redundancy repair is carried out on a block basis, when a defective block of memory cells is replaced by a first redundant block, the adjacent normal block of memory cells closest to the defect, or a part of that normal block, is also replaced by memory cells in a second redundant block. This repair strategy provides a simple way to isolate a defective memory cell so that the defect does not affect non-replaced memory cells.

Abstract: A memory device includes a plurality of memory cells each one for storing a value, at least one reference cell, biasing means for biasing a set of selected memory cells and the at least one reference cell with a biasing voltage having a substantially monotone time pattern, means for detecting the reaching of a threshold value by a current of each selected memory cell and of each reference cell, and means for determining the value stored in each selected memory cell according to a temporal relation of the reaching of the threshold value by the currents of the selected memory cell and of the at least one reference cell. The biasing means includes means for applying a controlled biasing current to the selected memory cells and to the at least one reference cell.

Abstract: A method for column redundancy re-use includes arranging the memory array into a plurality of addressable first array columns and a plurality of addressable second array columns. The column redundancy structure is also arranged into an addressable first redundancy column and an addressable second redundancy column. A first column array which is found to be defective is replaced by mapping its address to the first redundancy column. In a similar manner, a second column array which is found to be defective is replaced by mapping its address to the second redundancy column.

Abstract: A synchronous dynamic random access memory (SDRAM) integrated circuit (IC) configured to receive an external Reset signal for resetting the IC includes an input buffer configured to generate a buffered reset signal RST from the external Reset signal. The SDRAM IC further includes a reset circuit is configured to generate an internal reset signal Reset_En from (a) the RST signal, (b) a clock enable signal CKE which indicates a time when the SDRAM is ready to receive an external command, and (c) a mode register programming signal MRSP which indicates a time when a mode register is to be loaded with data.

Abstract: A static ram cell is described. The cell includes a pair of cross-coupled transistors and a pair of diode-connected transistors operated from a wordline that provides power to the cell. The cell has three main operating modes, reading, writing, and data retention. Reading is performed by sensing current flowing from a powered-up wordline through a conductive one of the cross-coupled transistors. Writing is performed by pulsing the source of the conductive one of the cross-coupled transistors with a positive voltage to flip the conductive states of the cross-coupled transistors. Data retention is performed by using leakage currents to retain the conductive states of the cross-coupled transistors. A decoder for an array of static ram cells may be operated synchronously and in a pipelined fashion using a rotary traveling wave oscillator that provides the clocks for the pipeline. The cell is capable of detecting an alpha particle strike with suitable circuitry.

Abstract: A dual port memory implemented using a single port memory core. In an embodiment, the access requests from the two ports are processed in a single memory clock cycle. In one implementation, the access request corresponding to the first port is processed in the high logic state of the memory clock cycle, and the access request corresponding to the second port is processed in the low logic state of the memory clock cycle. A single port memory core may provide multiple memory enable signals and corresponding strobe signals, with each combination of memory enable signal and strobe signal facilitating the memory access request from a corresponding port. An alternative embodiment uses the duration of each clock cycle of the memory clock signal more efficiently by starting the second memory access soon after completion of the first memory access (without waiting for the logic low of memory clock signal).

Abstract: A circuit generates a qualified data read strobe signal from a start burst signal and a bidirectional data strobe signal in a DDR memory control module. The circuit includes a delay module that receives the start burst signal and that generates a delayed start burst signal. An enable signal generator receives the delayed start burst signal and generates an enable signal. A first circuit generates the qualified data read strobe signal based on the enable signal and the bidirectional data strobe signal.

Abstract: A data storage device such as a DRAM memory having a plurality of data storage cells 10 is disclosed. Each data storage cell 10 has a physical parameter which varies with time and represents one of two binary logic states. A selection circuit 16, writing circuits 18 and a refreshing circuit 22 apply input signals to the data storage cells to reverse the variation of the physical parameter with time of at least those cells representing one of the binary logic states by causing a different variation in the physical parameter of cells in one of said states than in the other.

Abstract: Each of a plurality of memory blocks arranged for 1 bit data is divided into two subarrays. A separate local data line is provided for each subarray and coupled to a sense amplifier via an isolation gate. A memory cell is selected in a selected subarray of a selected memory block, and a bit line of the selected memory cell is coupled to a corresponding local data line. Only a local data line of the selected subarray is coupled to the sense amplifier to perform a sense operation, and a global read data line is driven via a read driver in accordance with an output signal of the sense amplifier. A load of a sense node of the sense amplifier in a semiconductor memory device is reduced to implement high-speed reading of internal data.