Abstract: A camera mount for mounting a camera inside a windshield of a vehicle. The camera includes a lens mount and a camera housing. The front tip of the lens mount is constrained to be in close proximity to or constrained to contact the inside of the windshield for different rake angles of the windshield.

Abstract: In one embodiment of an enclosure device, a camera casing and light source casing are secured to a plate frame, and the enclosure device is configured to be mounted to an arm, such as a robotic welding arm. A shutter mounting arm may also be secured to the plate frame. A flap may be pivotally mounted to the distal end of the shutter mounting arm, such that the flap may be actuated between a first and second position by an actuator cooperatively engaged with the flap. The first position may be defined as to protect a camera lens positioned in the camera casing and a light source lens positioned in the light source casing. The second position may be defined as to not obscure a line-of-sight from either the light source and/or the camera to the work piece on the arm.

Abstract: Apparatus, systems and methods for windows integration with cover glass and for processing cover glass to provide windows for electronic devices are disclosed. Transparent windows such as a transparent camera window, a transparent illuminator window and/or a transparent display window can be integrated into the cover glass. The apparatus, systems and methods are especially suitable for cover glasses, or displays (e.g., LCD displays), assembled in small form factor electronic devices such as handheld electronic devices (e.g., mobile phones, media players, personal digital assistants, remote controls, etc.). The apparatus, systems and methods can also be used for cover glasses or displays for other relatively larger form factor electronic devices (e.g., portable computers, tablet computers, displays, monitors, televisions, etc.).

Abstract: A seamless lens cover, and methods of forming such a seamless lens cover. The cap structure that covers a camera of a rotating panoramic camera system includes a seamless lens cover through which images are obtained by the camera. The cap structure may be injection molded at an initial lens cover thickness, and then a portion of the as molded initial lens cover thickness may be removed (e.g., by machining away) to achieve the final desired thickness. By such a method, the lens cover may be injection molded at thicknesses suitable for injection molding (e.g., about 0.06 to about 0.1 inch), after which most of the thickness may be machined away, to provide a seamless lens cover having a thickness of less than about 0.015 inch, exhibiting at least 60% transmittance to the thermal spectrum, no lensing characteristics, and no curvature effect.

Abstract: A fiber optic sensor system for measuring electric currents, such as the associated with geomagnetic disturbances and electromagnetic pulses. A fiber optic sensor system is disclosed including at least one light source, one or more first optical fibers having a first end arranged to receive light from the light source(s) and transmit the light to at least one of the sensor, and one or more second optical fibers arranged to receive reflected light from the fiber optic sensors and transmit the reflected light to a light sensing element. Using the sensors and the system, it is possible to measure currents within a structure of interest, such as upon the grounded neutral of an electric power transformer, take multiple measurements of current at the same piece of equipment or at multiple locations, or measure current and other physical phenomena on separate materials or structures.

Abstract: A probe card includes a circuit substrate to transmit an electrical signal for testing a semiconductor device, a probe block on a lower surface of the circuit substrate, the probe block having a plurality of probes, and a thermal insulation cover assembly on an upper surface of the circuit substrate, the thermal insulation cover assembly covering at least a portion of the circuit substrate and defining a heat receiving space, the thermal insulation cover assembly retaining heat applied to the circuit substrate within the heat receiving space.

Abstract: A testing apparatus for a wafer having a plurality of semiconductor chips, each including one or more vias, includes an electron beam discharging unit, a detecting unit, and a controller. The electron beam discharging unit is configured to discharge an electron beam to a via of one of the semiconductor chips. The detecting unit generates a detection signal corresponding to a current flowing through the via. The controller is configured to record a value of the detection signal in association with a position of the semiconductor chip.

Abstract: An example assembly includes a top ring, a bottom ring, and a brace connected to the top and bottom rings. The brace spaces the top ring from the bottom ring, such as along a longitudinal axis of the assembly. The assembly further includes a sidewall extending from the top ring to the bottom ring and defining at least part of an interior space of the assembly. The assembly also includes at least one mirror disposed external to the interior space and opposite the sidewall. The mirror is moveable, and is configured to direct ambient light to the interior space via the sidewall.

Abstract: A magnetometer comprising a resonating structure which is naturally resonant in at least three resonant modes, a resonant frequency of the three modes being sufficiently separated to allow of detection of same, the resonating structure having two sense electrodes disposed on opposing major surfaces of the resonating structure and having a conductive path formed as a loop, the loop being disposed near or at edges of the resonating structure and the two sense electrodes being formed inwardly of the edges of the resonating structure and also inwardly of the loop.

Abstract: Method for detecting an electric arc in a photovoltaic installation, which includes measurement (E6) of voltage values at at least one site of the electrical circuit of the photovoltaic installation; digitization (E8) of the measured voltage values so as to form voltage data; formation (E11) of a window of n recent digitized voltage data; computation (E12) of a test value associated with the said window of the n voltage data; analysis (E13) of a test vector comprising m test values associated with m recent windows generating a quantity arising from this analysis representative of a risk of electric arc; comparison (E15) of this quantity arising with at least one threshold so as to deduce therefrom the presence or otherwise of an electric arc within the photovoltaic installation.

Abstract: A control system for a battery includes a current sensor and an electronic control unit. The electronic control unit is configured to calculate a first error and a second offset error of the current sensor respectively based on outputs of the current sensor just before a stop of the electronic control unit and at startup of the electronic control unit. The electronic control unit is configured to correct an output of the current sensor by using a first error when a temperature of the current sensor at startup of the electronic control unit is higher than or equal to a threshold temperature, and correct the output of the current sensor by using a second error when the temperature of the current sensor at startup of the electronic control unit is lower than the threshold temperature.

Abstract: Apparatus, systems and methods for camera integration with cover glass and for processing cover glass to provide a camera window for an electronic device are disclosed. A camera window can be integrated into the cover glass. The apparatus, systems and methods are especially suitable for cover glasses, or displays (e.g., LCD displays), assembled in small form factor electronic devices such as handheld electronic devices (e.g., mobile phones, media players, personal digital assistants, remote controls, etc.). The apparatus, systems and methods can also be used for cover glasses or displays for other relatively larger form factor electronic devices (e.g., portable computers, tablet computers, displays, monitors, televisions, etc.).

Abstract: A capacitive position sensor system for determining the position of an object, in particular on a surface of a contactless smartcard, is provided. The object is positioned within a sensitive area of the capacitive position sensor system and changes the capacitance of capacitors being arranged underneath the object. The capacitive position sensor system comprises a set of sensing elements being arranged in the form of a column. Each sensing element includes a first capacitor having a first electrode and a second electrode and a second capacitor having a first electrode and a second electrode. A specific weighting factor is assigned to each capacitor. A control unit is adapted to determine the position of the object in one dimension by analyzing the results of a plurality of sensed voltage levels for the first capacitors and the second capacitors of a plurality of integration cycles.

Abstract: A diagnostic system for a DC-DC voltage converter is provided. The diagnostic system includes a first temperature sensor generating a first output voltage indicating a temperature level of a high voltage bi-directional MOSFET switch. The diagnostic system includes a microcontroller that samples the first output voltage at a first sampling rate utilizing a first channel in a first bank of channels to obtain a first predetermined number of voltage samples. The microcontroller determines a first number of voltage samples in the first predetermined number of voltage samples in which the first output voltage is greater than a first threshold voltage. The microcontroller sets a first temperature diagnostic flag equal to a first fault value if the first number of voltage samples is greater than a first threshold number of voltage samples indicating the high voltage bi-directional MOSFET switch has an over-temperature condition.

Abstract: A monitoring apparatus, and method of use, that is capable of determining the joint characteristics by means of waveforms shifts at zero-crossing angular distortions through predictive failure algorithm specific to circuit under test.

Abstract: The invention relates to a method for producing a high temperature sensor, in particular a high temperature sensor for measuring the exhaust gas temperature of motor vehicles, comprising a sensor element and a protective tube which at least partially surrounds the sensor element. Said protective tube is closed on the hot side of the high temperature sensor by a shaping method, in particular molding.

Abstract: The level sensor system includes a level sensor label configured to be associated with a container containing a material whose level is to be sensed, the level sensor label arrangement having a circuit which includes an inductive element electrically connected to a capacitive structure configured to be associated with the container.

Abstract: Disclosed herein is a pre space transformer including: a substrate having a first surface and a second surface, which is an opposite surface to the first surface; individual electrodes disposed on the first surface; and common electrodes disposed in the substrate, wherein the individual electrodes are repeatedly disposed while configuring a unit pattern.

Abstract: A periscope module includes a mounting ring for mounting the periscope module over a camera lens of a mobile phone. A first periscope end is for attachment to the mobile phone at the mounting ring. A second periscope end is for capturing images. A periscope tube is connected between the first periscope end and the second periscope end. A light tube is configured for attachment to a light source from the mobile phone. The light tube is configured to receive light into the first periscope end, the light exiting the second periscope end so as to provide illumination for capturing intra-oral images.

Abstract: A detection method and detection device of buried metal which are capable of detecting singular points, in horizontal and vertical directions, of metal tubes, telecommunication cables, and electric power cables, or the like buried in the ground. A magnetic field component of the direction of 3 axes of a XYZ axis is detected by two or more magnetic sensors installed in the detectable direction, and detects a magnetic field induced to buried metal. While carrying out synchronous detection of these magnetic field components and calculating for each amplitude and each phase of a magnetic field component of the direction of 3 axes, image processing is carried out and it is outputted to a display. While calculating for the position of a singular point, a singular point distinguishes whether it is an over-crossing state, it is an under-crossing state, or it is a branched state from these image data.