Abstract: A device for removal of a semiconductor chip interconnected to a substrate package via solder ball connections, for instance, includes an ultrasonic transducer for providing lateral ultrasonic vibration. A converter is coupled between the ultrasonic transducer and semiconductor chip for converting the lateral ultrasonic vibration to a torsional ultrasonic vibration, wherein the torsional ultrasonic vibration is perpendicular to the lateral ultrasonic vibration. The lateral-to-torsional converter further applies the torsional ultrasonic vibration to the chip for facilitating its removal from the substrate package. A method for removal of a semiconductor chip interconnected to a substrate package is also disclosed.
Type:
Grant
Filed:
January 6, 1997
Date of Patent:
July 21, 1998
Assignee:
International Business Machines Corporation