Patents Examined by P. Gordon
  • Patent number: 11986350
    Abstract: An imaging system includes: a transceiver cell for generating a pressure wave and converting an external pressure wave into an electrical signal; and a control unit for controlling an operation of the transceiver cell. The transceiver cell includes: a substrate; at least one membrane suspending from the substrate; and a plurality of transducer elements mounted on the at least one membrane. Each of the plurality of transducer elements has a bottom electrode, a piezoelectric layer on bottom electrode, and at least one top electrode on the piezoelectric layer. Each of the plurality of transducer element generates a bending moment in response to applying an electrical potential across the bottom electrode and the at least one top electrode and develops an electrical charge in response to a bending moment due to the external pressure wave.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: May 21, 2024
    Assignee: Exo Imaging, Inc.
    Inventors: Sandeep Akkaraju, Haesung Kwon, Yusuf Haque, Janusz Bryzek
  • Patent number: 11990890
    Abstract: A resonator includes a base; and at least three vibrating arms having first ends connected to a front end of the base and second ends that are open ends spaced away from the front end. Each vibrating arm includes an arm portion having a part that extends from the fixed end in a direction toward the open end with a constant width and a mass-adding portion that is connected to a tip of the arm portion and has a larger width than the arm portion. An interval between the mass-adding portions is larger than an interval between the arm portions for any two vibrating arms that are adjacent to each other.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: May 21, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihisa Inoue, Ryota Kawai, Yuichi Goto
  • Patent number: 11973488
    Abstract: A resonator for testing, a method for manufacturing a resonator for testing, and a method for testing a resonator are provided. The resonator for testing includes: a testing substrate, a testing bottom electrode, a testing piezoelectric layer, a testing top electrode, at least one first testing electrode, and at least one second testing electrode. The first testing electrode is connected to the testing bottom electrode, the second testing electrode is connected to the testing top electrode, a spacing region is arranged between the first testing electrode and the second testing electrode, and a thickness between the testing piezoelectric layer and at least one of the first testing electrode and the second testing electrode is greater than a predetermined thickness to insulate the first testing electrode and the second testing electrode.
    Type: Grant
    Filed: September 26, 2023
    Date of Patent: April 30, 2024
    Assignee: SUZHOU HUNTERSUN ELECTRONICS CO., LTD.
    Inventors: Zhiguo Lai, Qinghua Yang
  • Patent number: 11973485
    Abstract: Provided is a micromechanical resonator including a support beam including a first portion supported on a support member and a second portion spaced apart from the first portion in a length direction of the support beam, and a piezoelectric sensing portion provided between the first portion and the second portion and connecting the first portion to the second portion.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: April 30, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yongseop Yoon, Sungchan Kang, Cheheung Kim, Choongho Rhee
  • Patent number: 11973484
    Abstract: An acoustic resonator with a reinforcing structure is provided according to the present disclosure. The acoustic resonator includes a substrate and a cavity formed on the substrate, a piezoelectric layer is arranged above the substrate and an opening passing through the piezoelectric layer is formed in a peripheral region of the piezoelectric layer. The reinforcing structure includes a reinforcing layer, part of the reinforcing layer is formed at the edge of the opening with being fitted to the edge, to reinforce a resonant functional layer near the edge of the opening, which can reduce a change in stress of the piezoelectric layer and the lower electrode near the edge of the opening after the cavity is released, so that the piezoelectric layer and the lower electrode do not easily collapse due to stress, thereby ensuring the performance of a device. A method for manufacturing the same is further provided.
    Type: Grant
    Filed: December 19, 2022
    Date of Patent: April 30, 2024
    Assignee: HANGZHOU XINGHE TECHNOLOGY CO., LTD.
    Inventors: Linping Li, Jinghao Sheng, Zhou Jiang
  • Patent number: 11967940
    Abstract: Techniques for improving Bulk Acoustic Wave (BAW) resonator structures are disclosed, including filters, oscillators and systems that may include such devices. A first layer of piezoelectric material having a piezoelectrically excitable resonance mode may be provided. The first layer of piezoelectric material may have a thickness so that the bulk acoustic wave resonator has a resonant frequency. The first layer of piezoelectric material may include a first pair of sublayers of piezoelectric material, and a first layer of temperature compensating material. A substrate may be provided.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: April 23, 2024
    Assignee: Qxonix Inc.
    Inventors: Dariusz Burak, Kevin J. Grannen, Jack Lenell
  • Patent number: 11950589
    Abstract: An ultrasonic transducer for wind turbine applications. The transducer includes a housing with a central diaphragm portion, a peripheral wall thereabout, and a flexure portion supporting the diaphragm portion relative to the peripheral wall. The apex of a cone is secured to the housing central diaphragm portion and the cone has a peripheral rim secured to the metal housing peripheral wall. A driver such as a piezoelectric element is secured to the housing central diaphragm portion opposite the cone apex.
    Type: Grant
    Filed: February 11, 2021
    Date of Patent: April 9, 2024
    Assignee: MIDE Technology Corporation
    Inventor: Robert Carter
  • Patent number: 11949397
    Abstract: The invention discloses a bulk acoustic wave resonator and a manufacturing method thereof, the bulk acoustic wave resonator comprising: an air gap arranged at the external of the effective piezoelectric region, the air gap being formed between the upper electrode and the piezoelectric layer and/or between the piezoelectric layer and the substrate, and covering the end part, proximal to the air gap, of the lower electrode or connecting to the end part of the lower electrode, wherein the air gap is provided with a first end proximal to the effective piezoelectric region, and at least a portion of the upper surface, starting from the first end, of the air gap is an arch-shaped upper surface. The bulk acoustic wave resonator of the present invention capable of increasing a quality factor (Q) and an effective electromechanical coupling coefficient (K2t,eff) and improving the electrostatic discharge (ESD) immunity.
    Type: Grant
    Filed: February 2, 2019
    Date of Patent: April 2, 2024
    Assignee: ROFS Microsystem (Tianjin) Co., Ltd
    Inventors: Wei Pang, Menglun Zhang, Chen Sun
  • Patent number: 11944999
    Abstract: A vibration device includes a bimorph type piezoelectric element having a first main surface and a second main surface facing each other and a vibration member bonded to the second main surface of the piezoelectric element. The piezoelectric element has a first active region disposed closer to the first main surface between the first and second main surfaces and a second active region disposed closer to the second main surface than the first active region between the first and second main surfaces. When a force generated in the first active region is F1, a force generated in the second active region is F2, and a force by which the vibration member restrains the second active region is Fr, F2?F1?Fr is satisfied.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: April 2, 2024
    Assignee: TDK CORPORATION
    Inventors: Yoshiki Ohta, Hideya Sakamoto, Kazushi Tachimoto, Yoshikazu Shimura, Tetsuyuki Taniguchi, Akihiro Takeda
  • Patent number: 11950511
    Abstract: A device for emitting an ultrasound acoustic wave in a propagation medium, comprising: a package including a base substrate and a cap coupled to the base substrate and defining therewith a chamber in the package; a semiconductor die, coupled to the base substrate in the chamber, comprising a semiconductor body; a micromachined ultrasonic transducer (MUT) integrated at least in part in the semiconductor body and including a cavity in the semiconductor body and a membrane suspended over the cavity; and an actuator, operatively coupled to the membrane, which can be operated for generating a deflection of the membrane. The membrane is designed in such a way that a resonance frequency thereof matches an acoustic resonance frequency that, during operation of the MUT, develops in said chamber of the package.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: April 2, 2024
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Francesco Procopio, Fabio Quaglia
  • Patent number: 11949401
    Abstract: A method for manufacturing a film bulk acoustic resonator (FBAR) package with a thin film sealing structure includes: forming an FBAR having a bottom electrode, a piezoelectric layer, and a top electrode on a substrate; forming a plurality of inner pad electrodes electrically connected to the top electrode and the bottom electrode of the FBAR; attaching a PR (photo-resist) film to tops of the inner pad electrodes; etching the PR film to expose the inner pad electrodes to the outside; and forming a sealing layer on top of the PR film and tops of the exposed inner pad electrodes.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: April 2, 2024
    Assignee: WISOL CO., LTD.
    Inventors: Jin Nyoung Jang, Ivoyl P Koutsaroff
  • Patent number: 11942917
    Abstract: The present disclosure provides a film bulk acoustic resonator and its fabrication method. The fabrication method includes providing a first substrate, and sequentially forming a first electrode layer, a piezoelectric material layer, and a second electrode layer, on the first substrate; forming a support layer on the second electrode layer and forming a cavity with a top opening in the support layer, where the cavity passes through the support layer; providing a second substrate and bonding the second substrate with the support layer; removing the first substrate; and patterning the first electrode layer, the piezoelectric material layer, and the second electrode layer to form a first electrode, a piezoelectric layer, and a second electrode.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: March 26, 2024
    Assignee: Ningbo Semiconductor International Corporation
    Inventor: Guohuang Yang
  • Patent number: 11942919
    Abstract: A strain compensated heterostructure comprising a substrate comprising silicon carbide material; a first epitaxial layer comprising single-crystal aluminum nitride material formed on a top surface of the substrate; a second epitaxial layer formed on the first epitaxial layer opposite the top surface of the substrate, the second epitaxial layer comprising single-crystal scandium aluminum nitride material; and a third epitaxial layer formed on the second epitaxial layer opposite the first epitaxial layer, the third layer comprising single-crystal aluminum nitride material.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: March 26, 2024
    Assignee: Raytheon Company
    Inventors: John A. Logan, Jason C. Soric, Adam E. Peczalski, Brian D. Schultz, Eduardo M. Chumbes
  • Patent number: 11942915
    Abstract: A bulk acoustic wave resonator device comprises bottom and top electrodes (120, 360). A piezoelectric layer (355) sandwiched therebetween has a thickness in the active resonator area different from the thickness in the surrounding area. A method of manufacturing the device comprises a bonding of a piezoelectric wafer to a carrier wafer and splitting a portion of the piezoelectric wafer by an ion-cut technique. Different thicknesses of the piezoelectric layer in the active area and the surrounding area are achieved by implanting ions at different depths.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: March 26, 2024
    Assignee: RF360 Singapore Pte. Ltd.
    Inventors: Ulrike Roesler, Willi Aigner, Maximilian Schiek, Giuseppe Toscano
  • Patent number: 11931776
    Abstract: Provided are an actuator, method for manufacturing the actuator, and acoustic transmitter having the actuator. The actuator includes: an elastic metal member having a plurality of curved segments and a plurality of connection segments which constitute a ring structure with a long-axis direction and a short-axis direction; a multilayer piezoelectric member disposed within the ring structure and having a plurality of stacked piezoelectric units along the long-axis direction; and a plurality of coupling members disposed within the ring structure, wherein the multilayer piezoelectric member has two ends in the long-axis direction that are coupled to the connection segments of the elastic metal member in the long-axis direction. A preload stress is imparted to the elastic metal member. A plurality of coupling members having a size corresponding to the preload stress are disposed between the elastic metal member and the multilayer piezoelectric member.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: March 19, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chia-Hsin Lin, Ching-Iuan Sheu, Yu-Tsung Chiu, Chun-Ti Chen
  • Patent number: 11936360
    Abstract: Techniques for improving Bulk Acoustic Wave (BAW) mass loading of resonator structures are disclosed, including filters, oscillators and systems that may include such devices. First and second layers of piezoelectric material may be acoustically coupled with one another to have a piezoelectrically excitable resonance mode. The first layer of piezoelectric material may have a first piezoelectric axis orientation, and the second layer of piezoelectric material may have a second piezoelectric axis orientation that substantially opposes the first piezoelectric axis orientation of the first layer of piezoelectric material. An acoustic reflector electrode may include a first pair of top metal electrode layers electrically and acoustically coupled with the first and second layer of piezoelectric material to excite the piezoelectrically excitable resonance mode at a resonant frequency of the BAW resonator.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: March 19, 2024
    Assignee: Qxonix Inc.
    Inventors: Dariusz Burak, Kevin J. Grannen, Jack Lenell
  • Patent number: 11929730
    Abstract: An acoustic wave element includes: a substrate; a bonding structure on the substrate; a support layer on the bonding structure; a first electrode including a lower surface on the support layer; a cavity positioned between the support layer and the first electrode and exposing a lower surface of the first electrode; a piezoelectric layer on the first electrode; and a second electrode on the piezoelectric layer, wherein at least one of the first electrode and the second electrode includes a first layer and a second layer that the first layer has a first acoustic impedance and a first electrical impedance, the second layer has a second acoustic impedance and a second electrical impedance, wherein the first acoustic impedance is higher than the second acoustic impedance, and the second electrical impedance is lower than the first electrical impedance.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: March 12, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Ta-Cheng Hsu, Wei-Shou Chen, Chun-Yi Lin, Chung-Jen Chung, Wei-Tsuen Ye, Wei-Ching Guo
  • Patent number: 11929729
    Abstract: A wafer level package comprises a functional wafer with a first surface, device structures connected to device pads arranged on the first surface. A cap wafer, having an inner and an outer surface, is bonded with the inner surface to the first surface of the functional wafer. A frame structure surrounding the device structures is arranged between functional wafer and cap wafer. Connection posts are connecting the device pads on the first surface to inner cap pads on the inner surface. Electrically conducting vias are guided through the cap wafer connecting inner cap pads on the inner surface and package pads on the outer surface of the cap wafer.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: March 12, 2024
    Assignee: RF360 Singapore Pte. Ltd.
    Inventor: Markus Schieber
  • Patent number: 11911793
    Abstract: A low frequency underwater sound electro-mechanical transduction bender apparatus for radiating sound at deep submergence depths and including at least one piezoelectric bilaminar or trilaminar beam or disc having opposed support ends; a pair of piezoelectric structures that each have sides that are respectively connected at the opposed support ends of the beam or disc. The piezoelectric bilaminar or trilaminar beam or disc is driven by the pair of piezoelectric structures. The apparatus further includes a housing that contains the piezoelectric bilaminar or trilaminar beam or disc and the pair of piezoelectric structures, as well as an internal fill of a fluid substance.
    Type: Grant
    Filed: September 14, 2023
    Date of Patent: February 27, 2024
    Assignee: Image Acoustics, Inc.
    Inventors: John L. Butler, Frank D. Fratantonio, Jethro H. Tannis
  • Patent number: 11911062
    Abstract: A transducer for an ultrasonic scalpel, which comprises, from distal end to proximal end of a connecting feature, a fixing feature, a horn, a piezoelectric converting body, a rear-end ring, and a connecting member. By following a design principle of constraints in the parameter relationships between the piezoelectric converting body and the horn in the transducer, a transducer having both appropriate gain and stable performance can be achieved.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: February 27, 2024
    Assignee: INNOLCON MEDICAL TECHNOLOGY (SUZHOU) CO., LTD.
    Inventors: Zhongyu Yan, Lei Wang, Wei Luo