Abstract: A system and method for detecting an endpoint during a chemical mechanical polishing process is disclosed that includes illuminating a first portion of a surface of a wafer with a first broad beam of light. A first reflected spectrum data is received. The first reflected spectrum of data corresponds to a first spectra of light reflected from the first illuminated portion of the surface of the wafer. A second portion of the surface of the wafer with a second broad beam of light. A second reflected spectrum data is received. The second reflected spectrum of data corresponds to a second spectra of light reflected from the second illuminated portion of the surface of the wafer. The first reflected spectrum data is normalized and the second reflected spectrum data is normalized. An endpoint is determined based on a difference between the normalized first spectrum data and the normalized second spectrum data.

Abstract: Apparatus for optical analysis of a sample, including an energy source, which generates a pulse of energy that is incident on the sample, causing the sample to emit radiation characteristic of the composition of the sample, and a detector assembly, which receives and analyzes the radiation emitted by the excited sample. An optical assembly conveys the emitted radiation from the sample to the detector assembly, the optical assembly including an optic proximal to the sample, on which optic the radiation is incident along a beam path thereof between the sample and the detector assembly. A moving mechanical element moves in synchronization with the pulse from the energy source so as to substantially prevent matter ejected from the sample responsive to the incident energy from accumulating on the optic.

Abstract: Color measuring systems and methods are disclosed. Perimeter receiver fiber optics are spaced apart from a central source fiber optic and receive light reflected from the surface of the object being measured. Light from the perimeter fiber optics pass to a variety of filters. The system utilizes the perimeter receiver fiber optics to determine information regarding the height and angle of the probe with respect to the object being measured. Under processor control, the color measurement may be made at a predetermined height and angle. Various color spectral photometer arrangements are disclosed. Translucency, fluorescence and/or surface texture data also may be obtained. Audio feedback may be provided to guide operator use of the system. The probe may have a removable or shielded tip for contamination prevention.

Abstract: A multi-slit type spectrometer includes a light diffracter which diffracts an incident light according to wavelengths; an optical shutter array member including a plurality of optical shutter elements arranged in correspondence with wavelength bands diffracted by the light diffracter, operable to transmit an incident ray according to an applied voltage, and made of PLZT. A zone of a given number of adjacent optical shutter elements is applied with a voltage corresponding to the wavelength bands of the rays incident upon the zone of adjacent optical shutter elements at a specified timing so that the rays respectively pass through or are reflected at the optical shutter elements. A signal processor receives the ray which has passed through or has been reflected at each optical shutter element and outputs an electrical signal according to the intensity of the received ray.

Abstract: The inspection method, in order to detect and locate defects (5) included within the thickness of the transparent material (2) to be inspected, consists in uniformly illuminating a bright background (7) placed relative to the camera (4) behind the material (2) in order to be viewed by transparency through the material (2), covering the field of view of the camera (4) and serving as contrast reference, in laterally illuminating the surface of the material (2) in order to distinguish defects (5) included within the material (2) from parasitic elements (11) deposited on its surface, in viewing by transparency, by the camera (4), placed in the vertical to the surface of the material (2), a sequence of contrasted images reproducing the thickness of the material (2), and in processing information acquired by the successive images which are representative of the material (2) seen in its thickness in order to detect and locate the defects (5) included within the thickness of the material (2).