Abstract: The present application discloses a chip socket, a testing fixture and a chip testing method thereof. The chip socket includes a pedestal, a plurality of conductive traces, a plurality of clamp structures, and a plurality of electrical contacts. The plurality of conductive traces are formed in the pedestal. The plurality of clamp structures are conductive and disposed on the first surface of the pedestal, and at least one of the plurality of clamp structures is coupled to a corresponding conductive trace and configured to clamp a solder ball of a chip to be tested. The plurality of electrical contacts are disposed on the second surface of the pedestal, and at least one of the plurality of electrical contacts is coupled to a corresponding clamp structure through a corresponding conductive trace.

Abstract: An arrangement for monitoring the operation of a machine intended to be tracked by a real-time locating system comprises: a tag intended to be arranged on the machine, the tag being configured to generate a wireless tag signal allowing determination of a position of the tag; and at least one detector intended to be arranged on the machine, the at least one detector being configured to detect at least one characteristic of a magnetic field generated by the machine. Detection of the at least one characteristic is indicative of the machine being operative. The arrangement makes it possible to obtain a detailed understanding of how the machine is used in a cost-effective manner. A real-time locating system comprising such an arrangement and a method for monitoring the operation of a machine are also disclosed.

Abstract: Provided is a semiconductor chip test socket configured to be coupled to a test circuit board for testing a semiconductor chip and provided with an integrated circuit (IC) chip having unique information and an algorithm for counting the number of times the semiconductor chip test socket is used, such that the number of times the semiconductor chip test socket is used may be exactly counted, and the IC chip may be easily installed and removed and securely protected from external impacts.

Abstract: The invention relates to a magnet assembly (10) for a sensor device for detecting a measurement variable characterizing a rotation state of a steering shaft of a motor vehicle, to a sensor device and to a motor vehicle, wherein the magnet assembly (10) has a sleeve (11) and a magnetic element (12), which is connected in a form-fitting manner to the sleeve (11), wherein the sleeve (11) is designed for connecting the magnet assembly (10) to a first part of the steering shaft and has at least one stop flange (11C), which extends outwards in the radial direction in a radial plane, for axially securing the magnetic element (12) in a first axial direction (A1), wherein the magnetic element (12) is arranged concentrically with respect to the sleeve (11) and, with its first end side (S1), is at least partially supported axially on the stop flange (11C) and is thereby secured in the first axial direction (A1).

Abstract: A contact probe includes a first plunger, a second plunger, a coil spring, and a pipe; the first plunger includes a first slide portion that slides along the inner periphery of the pipe; the second plunger includes a second slide portion that slides along the inner periphery of the pipe; and the coil spring includes: a first attachment portion that is attached to the first plunger and tightly wound; a second attachment portion that is attached to the second plunger and tightly wound; a coarsely wound portion; a first contact portion including one end connected to the first attachment portion and another end connected to the coarsely wound portion and contacting the pipe; and a second contact portion including one end connected to the coarsely wound portion and another end connected to the second attachment portion and contacting to the pipe.

Abstract: A system and method are disclosed for automatically operating a high voltage resonance circuit. An embodiment of the system includes one or more coils each coil can be an alternating current (AC) coil or a direct current (DC) coil. Ari embodiment of the system further includes a microprocessor that issues commands to control amplitude and frequency of pulses of the one or more coils to reach and maintain a resonant condition for water treatment. The microprocessor determines whether a coil is an AC coil or a DC coil by detecting whether a capacitor is connected in series with the coil. An embodiment of the system further includes one or more sensors that measure the quality of water and provide feedback to the microprocessor.

Abstract: The particle measurement device includes: an acquiring unit configured to acquire pad surface shape data indicating a surface shape of an electrode pad including a probe needle mark where a probe needle has contacted; a roughness calculating unit configured to calculate volume of a recessed portion recessed from a pad reference surface and volume of a protruding portion protruding from the pad reference surface based on the pad surface shape data; and a particle quantity calculating unit configured to calculate a particle quantity from a volume difference between the volume of the recessed portion and the volume of the protruding portion.

Abstract: A voltage contrast defect analysis method including the following steps is provided. A voltage contrast defect detection is performed on a die to be tested by using an electron beam inspection machine to find out a defect address of a voltage contrast defect. A first scanning electron microscope image at the defect address of the die to be tested is obtained by using a scanning electron microscope. A first critical dimension of the first scanning electron microscope image at the defect address of the die to be tested is measured. The first critical dimension on the die to be tested is compared with a corresponding second critical dimension on a reference die where no voltage contrast defect occurs at the defect address to determine whether the first critical dimension and the second critical dimension are the same.

Abstract: A capacitive measuring system includes capacitive sensors and an evaluation circuit having a multiplexer, a synchronous rectifier, a sinusoidal signal generator, and a reference voltage divider. The capacitive sensors are acted on by a mono-frequency voltage signal generated by the sinusoidal signal generator, output signals of the capacitive sensors are transmitted in alternation to the synchronous rectifier via the multiplexer, and signal amplification of output signals of the synchronous rectifier are calibrated as a function of an activatable reference impedance. The synchronous rectifier is formed by a MOS semiconductor switch. A source-drain section of the MOS semiconductor switch forms a shunt that is controlled by the mono-frequency voltage signal. A channel of the multiplexer is provided for transmitting a calibration signal, generated by the reference voltage divider, to the synchronous rectifier alternately with the output signals of the capacitive sensors.

Abstract: An underground investigation device includes a transmission unit configured to transmit a pulse wave, a reception unit configured to receive a reflected signal, a memory configured to store time waveform data of the reflected signal, a storage device having a larger capacity than a capacity of the memory, a control unit configured to transfer the time waveform data from the memory to the storage device, and a signal processing unit configured to generate underground investigation data based on the time waveform data in the storage device. The reception unit sets a measurement span for sampling the reflected signal by using, as a trigger, transmission of the pulse wave or reception of a reflected signal resulting from reflection by a ground surface, samples the reflected signal in the measurement span, and stores the time waveform data in the memory. The control unit transfers the time waveform data from the memory to the storage device after the measurement span.

Abstract: A contact assembly for a testing system for testing integrated circuit devices is disclosed. The contact assembly includes a first blade, a second blade, and an elastomer configured to retain the first blade and the second blade. The first blade and the second blade are electrically conductive. The first blade and the second blade are arranged in a cross configuration so that the first blade and the second blade form a substantially X-shape when assembled. The elastomer is at least columnar in part and non-conductive.

Abstract: A magnetic sensor includes a magnetic field converter, a magnetic field detector, and a plurality of shields aligned in a Y direction. The magnetic field converter includes a plurality of yokes. Each yoke has a shape elongated in the Y direction, and is configured to receive an input magnetic field component in a direction parallel to a Z direction and to output an output magnetic field component in a direction parallel to an X direction. The magnetic field detector includes a plurality of trains of elements. Each train of elements includes a plurality of MR elements that are aligned in the Y direction along one yoke and connected in series. Each shield has such a shape that its maximum dimension in the Y direction is smaller than its maximum dimension in the X direction.

Abstract: A measuring device includes a substrate disposed on a substrate support of a plasma processing apparatus, a transmission circuit, a transmitting antenna, a receiving antenna, a reception demodulation circuit, and a calculator which are provided in the substrate. The transmission circuit generates a microwave. The transmitting antenna transmits the microwave generated by the transmission circuit as a transmission wave. The receiving antenna receives a reflected wave of the transmission wave by plasma above the substrate support as at least one reception wave. The reception demodulation circuit generates a signal that reflects a thickness of a sheath between the substrate and the plasma, from the reception wave. The calculator obtains the thickness of the sheath from the signal generated by the reception demodulation circuit.

Abstract: A photovoltaic, PV, module level monitoring system (1) comprising a photovoltaic array (PVA) including at least one photovoltaic string (PVS) comprising photovoltaic modules, PVM, (5) each having a module level device, MLD, (4) adapted to monitor and/or to control the associated photovoltaic module, PVM, (5), wherein each module level device, MLD, (4) comprises a transceiver adapted to communicate with a transceiver of a base station (2) of an inverter (6) connected to said photovoltaic array (PVA), wherein the transceivers are coupled by associated duplexer circuits (7) to a DC power network comprising power cables (3) connecting the photovoltaic modules, PVM, (5) of the at least one photovoltaic string (PVS) of said photovoltaic array (PVA) with the base station (2) of the inverter (6), wherein a signal amplitude of a communication signal, CS, transmitted by a transceiver via its associated duplexer circuit (7) is adjusted automatically depending on a monitored impedance, ZPV, of the respective photovoltaic

Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays. In the various embodiments, probes include at least two springs separated by a movable stop while in other embodiments, three or more springs may be included with two or more movable stops. Movable stops interact with fixed stops that are either part of the probes themselves or part of separate elements that engage with the probes (such as array frame structures) that provide for the retention, longitudinal and/or lateral positioning of probes and possibly for orientation of the probes about a longitudinal axis. Fixed stops provide for controlled limits for movement of the movable stops which in turn allow for enhanced compliant or elastic performance of the probes upon increased probe compression in either one direction, in the order of tip compressions, or in both directions or tip compression orders (e.g.

Abstract: A probe pin cleaning pad including a release layer or composite plate, an adhesive layer, a substrate layer, a cleaning layer, and a polishing layer is provided. The adhesive layer is disposed on the release layer or composite plate. The substrate layer is disposed on the adhesive layer. The cleaning layer is disposed on the substrate layer. The polishing layer is disposed on the cleaning layer. A cleaning method for a probe pin is also provided.

Abstract: This anisotropic conductive sheet includes: a plurality of conductive paths; and an insulation layer which is disposed to fill the space between the plurality of conductive paths and has a first surface and a second surface. Each of the conductive path extends in a thickness direction of the insulation layer and has a first end part on the first surface side and a second end part on the second surface side. When the conductive paths are seen through so that the center of the first end part overlaps the center of the second end part, at least a portion of the conductive paths does not overlap the first end part and the second end part.

Abstract: A method for evaluating a Hot Carrier Injection (HCI) effect of a device is provided. The method includes, a ratio of a substrate current to a drain current of a first device at different gate-source voltages is acquired, and recorded as a first current ratio; a ratio of a substrate current to a drain current of a second device at different gate-source voltages is acquired, and recorded as a second current ratio, the second device is subjected to process parameter adjustment or device parameter adjustment relative to the first device; and an influence of the process parameter adjustment or the device parameter adjustment on an HCI effect of the device is determined based on the second current ratio and the first current ratio.

Abstract: It is possible to make the free length of a contactor uniform even when the contactor is joined to a position that deviates from a joint position in a high-frequency conducting path and make contact with an electrode with stability, which improves measurement quality. A probe unit according to the present disclosure includes: a coaxial connector that is attached to a main body and gives and receives an electrical signal to and from a tester via a coaxial cable; a high-frequency conducting path that is connected to the coaxial connector and transmits an electrical signal; a plurality of contactors, each having a tip portion that makes electrical contact with an electrode of an object to be inspected and giving and receiving an electrical signal to and from the high-frequency conducting path; and a pedestal that is interposed between the contactor and the high-frequency conducting path, and the pedestal is provided in each contactor such that a free length of the contactor is a predetermined length.

Abstract: Proposed are a probe head and a probe card having the same. According to the present disclosure, the probe head of the probe card includes: an upper guide plate having an upper guide hole; a lower guide plate having a lower guide hole; and an intermediate guide plate having an intermediate guide hole and provided between the upper guide plate and the lower guide plate, wherein each of a plurality of probes sequentially passes through the upper guide hole, the intermediate guide hole, and the lower guide hole, and the intermediate guide plate is made of an anodic oxide film.