Patents Examined by Paul McGee, III
  • Patent number: 9629242
    Abstract: Provided is an optically transparent electrode of which the visibility of the electrode pattern is low. The optically transparent electrode is produced by joining two optically transparent conductive materials each having, on one side of the optically transparent base material, a large lattice 11 formed of a grid-like conductive part and a connector 12 which has at least one connector lattice 16 and which electrically connects adjacent large lattices 11, and is characterized by that the two optically transparent conductive materials are overlapped so that the centers of the connectors 12 thereof approximately coincide, and by that at least one of the two optically transparent conductive materials has a broken lattice 31 where a part of a thin line is broken and electrical conductivity is lost at a position corresponding to the overlapped connectors 12 and/or to a portion surrounded by the large lattice 11 and the connector 12.
    Type: Grant
    Filed: July 19, 2012
    Date of Patent: April 18, 2017
    Assignee: MITSUBISHI PAPER MILLS LIMITED
    Inventor: Takenobu Yoshiki
  • Patent number: 9520210
    Abstract: Shielded twisted pair communication cables are described. A cable may include at least one twisted pair of insulated conductors, and an outer circumference may be defined by the twisted pair along a longitudinal length of the cable. A shield may be formed around the twisted pair, and a jacket may be formed around the shield. Additionally, a dielectric film may separate the insulated conductors of the twisted pair, and the dielectric film may extend beyond the outer circumference of the twisted pair and contact the shield.
    Type: Grant
    Filed: June 13, 2013
    Date of Patent: December 13, 2016
    Assignee: Superior Essex Communications LP
    Inventors: Paul E Neveux, Christopher W McNutt
  • Patent number: 9508461
    Abstract: An insulated electric conductor and method for making such a conductor are disclosed. The conductor comprises a copper core, a layer of aluminum formed over the copper core, an aluminum oxide dielectric layer formed over the layer of aluminum, and a thin polymeric layer formed over the aluminum oxide dielectric layer. The thin polymeric layer is preferably between about 30 microns (0.001?) and about 500 microns (0.02?) and is more preferably between about 45 microns (0.0015?) and about 250 microns (0.01?). The polymeric layer may be any polymeric material selected from the group consisting of acrylic resins, epoxy resins, polyurethane resins, and silicone resins. Other polymeric materials may be used. The polymeric layer may be formed by a variety of methods including, but not limited to, spraying, brushing, dipping, and powder coating.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: November 29, 2016
    Assignee: Ford Global Technologies, LLC
    Inventors: Larry Dean Elie, Allan Roy Gale, John Matthew Ginder, Clay Wesley Maranville
  • Patent number: 9497849
    Abstract: A printed wiring board includes a core substrate, first and second buildup structures on surfaces of the core, respectively, and first and second solder-resist layers on the first and second structures, respectively. The core includes insulative substrate, conductive layers on surfaces of the substrate and through-hole conductor connecting the conductive layers, the first structure includes interlayer insulation layer and conductive layer in the first structure, the second structure includes interlayer insulation layer and conductive layer in the second structure, a thickness between the outer surfaces of the first and second solder-resist layers is set in range of from 150 ?m or greater and less than 380 ?m, and at least one of the core, first and second structures, and first and second solder-resist layers includes reinforcing material in amount such that the board includes the material in amount in range of from 20 to 35 vol. %.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: November 15, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Takashi Kariya, Toshiki Furutani, Takeshi Furusawa
  • Patent number: 9491857
    Abstract: There is provided a wiring connection structure connecting a transparent conductive film formed on a main surface of a transparent substrate having the main surface and a metal wiring formed on the main surface and made of a metal material, wherein the metal wiring is formed to extend from the main surface onto the transparent conductive film and to cover the transparent conductive film.
    Type: Grant
    Filed: April 2, 2012
    Date of Patent: November 8, 2016
    Assignee: SHARP KABUSHIKI KAISHA
    Inventor: Katsunori Misaki
  • Patent number: 9484732
    Abstract: A wire insulator apparatus includes an insulator/separator member, a cap portion, a tube and potting material. The insulator/separator member has apertures formed therein for receiving a plurality of wires. By threading the wires through the insulator/separator member, the wires are spaced apart so that a potting material can be molded to provide a complete seal from the environment, particularly conductive liquids such as ammonia, which may cause short-circuiting between the wires. Individual wires are terminated in the cap portion, and the cap portion, the insulator/separator member and the wire ends are positioned within a tube or a mold portion depending on the application, and a potting epoxy is fluidly inserted within the tube. The epoxy surrounds or encases the wire ends within the tube or mold to insulate the wire ends in an airtight seal.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: November 1, 2016
    Assignee: Johnson Controls Technology Company
    Inventor: William Joseph Fox
  • Patent number: 9474167
    Abstract: Disclosed herein is a multilayered substrate including: a second insulating layer having a fine pattern layer formed on an upper surface thereof; and a third insulating layer having a circuit pattern layer formed on an upper surface thereof and formed of a material different from the second insulating layer, the circuit pattern layer having a pattern pitch larger than that of the fine pattern layer, thereby making it possible to solve a warpage problem and perform refinement and improvement in a degree of integration of an inner wiring.
    Type: Grant
    Filed: October 23, 2013
    Date of Patent: October 18, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yee Na Shin, Seung Eun Lee, Yul Kyo Chung, Doo Hwan Lee
  • Patent number: 9466957
    Abstract: A wire harness includes a tubular sheathing member that covers at least one conduction path, and at least one path-maintaining member that is formed in flat plate shape corresponding to a bent part formed by bending the sheathing member. A tape is wrapped around the path-maintaining member while the path-maintaining member is placed along the bent part.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: October 11, 2016
    Assignee: YAZAKI CORPORATION
    Inventors: Hidehiro Ichikawa, Masahiro Takamatsu, Shigemi Hashizawa
  • Patent number: 9458708
    Abstract: A radio frequency (RF) coaxial transmission line to be positioned within a wellbore in a subterranean formation may include a series of coaxial sections coupled together in end-to-end relation. Each coaxial section may include an inner conductor, a dual-wall outer conductor surrounding the inner conductor, and a dielectric therebetween. Each of the dual-wall outer conductors may include an outer wall and an inner wall spaced apart therefrom defining a fluid passageway. Each coaxial section may further include a threaded endpiece coupled to each opposing end of the dual-wall outer conductor and having threads to define an overlapping mechanical threaded joint and an electrical joint with an adjacent threaded endpiece.
    Type: Grant
    Filed: August 7, 2012
    Date of Patent: October 4, 2016
    Assignee: HARRIS CORPORATION
    Inventors: Brian Wright, Raymond Hewit, Keith Nugent
  • Patent number: 9455557
    Abstract: A cable protector for connection to an aircraft electrical cable raceway, comprising a flexible conductive body defining a conduit through which an electrical cable can pass and an electrically conductive connection arrangement configured to enable connection of the body of the protector to a raceway in an electrically conductive manner.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: September 27, 2016
    Assignee: AIRBUS OPERATIONS LIMITED
    Inventors: Jack Blanchard, Anthony Bryant
  • Patent number: 9446484
    Abstract: Provided are a conductive particle and a conductive material which are capable of decreasing the connection resistance and suppressing generation of voids in a connection structure when the connection structure is obtained by electrically connecting electrodes. The conductive particle according to the present invention has a solder at a conductive surface, wherein a group including a carboxyl group is covalently bonded to the surface of the solder; and the conductive material according to the present invention includes the conductive particles and a binder resin.
    Type: Grant
    Filed: February 19, 2013
    Date of Patent: September 20, 2016
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Ryohei Masui, Takashi Kubota, Hideaki Ishizawa
  • Patent number: 9445502
    Abstract: A flexible circuit connecting device is disclosed, including a base layer having a first surface and a second surface, and conductive traces having a grid-like structure and formed on the first surface and/or the second surface. The conductive traces of the above flexible circuit connecting device are nearly aligned with the base layer, and thus the probability of damage under a stress is reduced. Designed to be a grid-like structure, the conductive traces become more transparent, while satisfying a function of a connector. Besides, the above flexible circuit connecting device has a high density circuit trace, so that the size of the connector can be reduced and the interior space of the electronic components can be saved. In a manufacture process of the above flexible circuit connecting device, the manufacture process can be simplified, manufacture efficiency and production yield can be improved, and manufacture cost can be efficiently reduced.
    Type: Grant
    Filed: August 15, 2013
    Date of Patent: September 13, 2016
    Assignees: NANCHANG O-FILM TECH CO., LTD., SUZHOU O-FILM TECH CO., LTD., SHENZHEN O-FILM TECH CO., LTD.
    Inventors: Sheng Zhang, Ying Gu, Shengbo Guo, Peiting Ma, Yunliang Yang
  • Patent number: 9443643
    Abstract: An insulated wire, containing: a conductor; a foamed insulating layer; and an unfoamed filled layer on the outer circumference of the foamed insulating layer, in which the filled layer contains a partial discharge resistant material, which insulated wire has all of high partial discharge inception voltage, resistance to partial discharge, heat resistance, and abrasion resistance (scratch resistance).
    Type: Grant
    Filed: August 14, 2014
    Date of Patent: September 13, 2016
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.
    Inventors: Daisuke Muto, Makoto Oya, Satoshi Naka
  • Patent number: 9440273
    Abstract: Apparatus for use with two or more supplies of strip metal comprises, for each supply, a strip feeder and a bending head, the feeder being adapted to receive metal from said each supply and deliver same to the head which is adapted to receive and curl metal from the feeder to produce a strip part encircling a central axis in a coiling manner. The heads and feeders are adapted such that the part axes are coincident and the parts are axially offset from one another, with axially adjacent parts being positioned relative to one another throughout their lengths to define a metal strip which encircles the coincident axes in a coiling manner, the metal strip defining a tubular arrangement which can be used at least for armor cable. The parts can have cross sections such that they interlock throughout their lengths and the strip interlocks with itself throughout its length.
    Type: Grant
    Filed: May 2, 2011
    Date of Patent: September 13, 2016
    Inventor: Paul McMillen
  • Patent number: 9438020
    Abstract: It is aimed to improve soundproofing of a wiring module. The wiring module is provided with a sheet-shaped first soundproofing member; a wire harness which contains at least one wire and is disposed at least partially along one main surface of the first soundproofing member, and a second soundproofing member. The second soundproofing member is provided partially to one main surface of the first soundproofing member and holds the wire harness interposed between the first soundproofing member and the second soundproofing member.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: September 6, 2016
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Tomohiro Shimada, Tetsuya Sonoda, Isamu Hamamoto, Yusuke Kobayashi
  • Patent number: 9433096
    Abstract: A wiring board includes a resin substrate in which reinforcement members are arranged horizontally, a through electrode filled in a through hole penetrating the substrate in a thickness direction, and wiring layers respectively formed on both surfaces of the substrate and electrically connected to each other via the through electrode. The reinforcement members are arranged such that reinforcement members arranged in a middle region of the substrate in the thickness direction has higher density than reinforcement members arranged in the regions other than the middle region of the substrate.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: August 30, 2016
    Assignee: Shinko Electric Industries Co., LTD.
    Inventor: Satoshi Fujii
  • Patent number: 9431800
    Abstract: A gas-insulated electric device, by which a cross-sectional area of a central conductor can be reduced. The gas-insulated electric device includes an insulation tube that ranges to portions facing to ground potential portions for a central conductor and to upper-lower portions along the grounding potential portions, and is coaxially arranged along the central conductor in a state where a gap intervenes between the central conductor and the insulation tube; a conductive layer that is formed on an inner surface of an insulation tube and is electrically connected to the central conductor; and a ground layer that is formed on an inner surface or an outer surface of the insulation tube and is grounded; in which heat generated from the central conductor is radiated by convecting the insulation gas through the gap between the central conductor and insulation tube.
    Type: Grant
    Filed: September 13, 2010
    Date of Patent: August 30, 2016
    Assignee: Mitsubishi Electric Corporation
    Inventors: Tadahiro Yoshida, Kazuki Takahashi, Katsushi Nakada, Masahiro Arioka
  • Patent number: 9424963
    Abstract: Premise cables for installation in indoor environments, such as risers and plenums, are described. A premise cable may include an outer jacket and at least one twisted pair of individually insulated conductors positioned within a cable core defined by the jacket. Moisture mitigation material is positioned between an outer surface of the jacket and the twisted pair(s), for example, within the cable core. The moisture mitigation material is configured to absorb water vapor that penetrates the jacket, thereby improving electrical performance of the cable. However, the moisture mitigation material does not provide water blocking for the cable.
    Type: Grant
    Filed: December 9, 2013
    Date of Patent: August 23, 2016
    Assignee: Superior Essex Communications LP
    Inventors: Christopher W. McNutt, Wayne Patrick Cheatle
  • Patent number: 9424965
    Abstract: An electrical conductor includes a base substrate of at least one of copper, copper alloy, nickel or nickel alloy and a layered structure applied to the base substrate. The layered structure includes a foil and a graphene layer deposited on the foil. The layered structure is applied to the base substrate after the graphene layer is deposited on the foil. A method of manufacturing the electrical conductor includes providing a base substrate, providing a foil, depositing a graphene layer on the foil to define a layered structure, and depositing the layered structure on the base substrate.
    Type: Grant
    Filed: February 5, 2013
    Date of Patent: August 23, 2016
    Assignee: Tyco Electronics Corporation
    Inventor: Rodney I. Martens
  • Patent number: 9426886
    Abstract: The formation of substrate electrical connections on thin film heads is one source of resulting surface topography. In accordance with one implementation, such topography can be reduced by a process that includes depositing a first layer of basecoat, creating electrical recessed vias in one or more plating processes, and depositing a second layer of basecoat on top of the electrical vias and on top of the first layer of basecoat. In one implementation, the first and second layers of basecoat have a combined height that is substantially equal to the height of the electrical recessed vias. In one implementation, the resulting topographical features are small enough that they can be planarized without creating a lack of uniformity in the total basecoat thickness across the wafer.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: August 23, 2016
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventors: Carolyn Pitcher Van Dorn, Lily Horng Youtt, Daniel Boyd Sullivan