Patents Examined by Pete Lee
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Patent number: 9762043Abstract: An impact-absorbing wire and/or cable fixture, system, and related methods are disclosed. The impact-absorbing wire fixture apparatus includes a substantially rigid bracket having at least a first arm and a second arm, wherein the first arm is connectable to a utility support structure. A twisted portion is positioned within the second arm, wherein the twisted portion is at least a 90° rotation of the second arm, wherein the twisted portion of the second arm has a width that exceeds a thickness. A fixturing portion is positioned at a distal end of the second arm.Type: GrantFiled: September 2, 2014Date of Patent: September 12, 2017Assignee: Marmon Utility LLCInventors: Ashish Munot, Edward Laughlin, Jared Argyle, Evan Moen, Bob Biddle, Brian Boisclair, Leonard P. Jean
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Patent number: 9763330Abstract: A circuit board for an optoelectronic semiconductor chip includes an electrically conductive first metal foil, a first electrically insulating foil, an electrically conductive second metal foil, wherein the first electrically insulating foil is applied to the first metal foil at a top side of the first metal foil and mechanically connects thereto, the first electrically insulating foil has a recess in which the first metal foil is exposed, the recess electrically conductively fixes the optoelectronic semiconductor chip to the first metal foil within the recess, the second metal foil is applied at a top side of the first electrically insulating foil, the top side facing away from the first metal foil, and mechanically connects to the electrically insulating foil, the first electrically insulating foil is free of the second metal foil at least in the region of the recess, and the second metal foil electrically contacts the optoelectronic semiconductor chip.Type: GrantFiled: January 28, 2014Date of Patent: September 12, 2017Assignee: OSRAM GmbHInventors: Martin Rudolf Behringer, Stefan Groetsch
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Patent number: 9754803Abstract: An electronic device includes: an electronic component including an external connection terminal; and a lead frame (metal member) connected to the external connection terminal. The lead frame is disposed with a pad. The pad overlaps the external connection terminal in plan view, and at least a portion of the pad is located outside the external shape of the electronic component in plan view. The pad and the external connection terminal are connected by means of a conductive bonding member. The pad and the electronic component are bonded together with a resin. The resin extends to a region of the pad located outside the external shape of the electronic component in plan view.Type: GrantFiled: March 18, 2014Date of Patent: September 5, 2017Assignee: SEIKO EPSON CORPORATIONInventor: Manabu Kondo
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Patent number: 9756728Abstract: Disclosed is a component-mounted structure including a first object having a plurality of first electrodes, a second object as an electronic component having second electrodes, a joint portion joining the plurality of first electrodes and the corresponding second electrodes to each other, and a resin-reinforcing portion. The joint portion has a core including at least one of a first metal and a resin particle, and a layer of an intermetallic compound of the first metal and a second metal having a low melting point. The resin-reinforcing portion includes a particulate matter including the core and the intermetallic compound, in a portion except between the first and second electrodes. An amount of the particulate matter included in the portion is 0.1 to 10 vol %.Type: GrantFiled: May 22, 2013Date of Patent: September 5, 2017Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Tadahiko Sakai, Hideki Eifuku, Koji Motomura
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Patent number: 9755414Abstract: An overhead electrical grounding mesh and mechanical grid structure for a data center includes a plurality of orthogonally arranged grid beams. Each of the grid beams is a rigid and electrically conductive grid beam to provide an overhead structure configured to be positioned over electronic equipment in the data center. The grid structure is configured to provide support for electronic equipment connected to the grid structure and to provide support for mechanical equipment in the data center that is connected to the grid structure. The grid structure is further adapted to be electrically coupled to the electronic equipment to provide an electrically conductive ground mesh for the electronic equipment in the data center.Type: GrantFiled: March 13, 2014Date of Patent: September 5, 2017Assignee: LEVITON MANUFACTURING CO.Inventors: Bryan Sparrowhawk, Jeffrey P. Seefried
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Patent number: 9748751Abstract: An electrical device mounting assembly adapted for mounting of power and low voltage components in a shallow wall cavity to supply a television or similar electronic device. The mounting assembly recesses all high and low voltage components behind the wall surface to render them unobtrusive and out of the way. The mounting assembly includes a mounting frame with a peripheral flange, sidewalls, and a rear wall. A corner of the mounting frame is adapted to mount a duplex receptacle at an oblique angle with respect to the sidewalls. The mounting frame includes cable tie-offs for routing cables and at least one low voltage mount for the mounting of low voltage components. The mounting assembly enables consolidation of all power and signal hookups for TV or home entertainment systems in a single assembly that is recessed within the wall and allows flush wall mounting of a flat panel TV.Type: GrantFiled: July 17, 2013Date of Patent: August 29, 2017Assignee: ARLINGTON INDUSTRIES, INC.Inventor: Thomas J. Gretz
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Patent number: 9742171Abstract: An electrical connection covering apparatus is designed to protect from moisture a connection between a plug of one extension cord and a socket of another extension cord. A compressible and elastic diaphragm is used to form a seal around the cables of the extension cords where they enter the apparatus. The apparatus includes a housing that has at least one aperture. The diaphragm extends across the aperture. The diaphragm projects inwardly with respect to an interior surface of the housing. The compressibility and elasticity of the diaphragm material is greater than that of the housing material.Type: GrantFiled: May 4, 2015Date of Patent: August 22, 2017Assignee: MIDWEST INNOVATIVE PRODUCTS, LLCInventors: Bryan Nooner, Robert B. Zajeski, Jr., Ben Lynch Zajeski
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Patent number: 9732949Abstract: A pole support system suitable for lighting fixtures. The system may include a lower support; a guide member interior to the lower support; a telescoping upper support inside the lower support and axially movable between an extended position and a retracted position, the upper support being at least partially received in an annular space between the lower support and the guide member; a biasing member biasing the upper support to the extended position; and a locking assembly partially surrounding the lower support at one end of the lower support. The locking assembly may include a body having a passage in which the upper support slides therethrough, and enclosing the passage at a first end while maintaining the passage in fluid communication with the interior of the lower support; and a lock configured to selectably engage the upper support to constrain axial motion of the upper support.Type: GrantFiled: February 7, 2014Date of Patent: August 15, 2017Assignee: EATON ENTERPRISES (HUNGARY) KFT.Inventors: Andrew James Grant, Allen Coogler, Michael Walton, Jeremy Kyne
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Patent number: 9734936Abstract: A cable is provided for suspending a down hole pump that has a core with at least one tube for the transport of fluid and at least one conductor covered with an insulation layer made of a high temperature resistant insulating material. The core is covered by a steel tape and a first layer of steel wires are positioned radially outside the steel tape in contact with the steel tape. The wires of the first layer of steel wires are positioned side by side around the core with no filler in between the steel wires and an outer layer made of heat resistant polymer covers the steel wires.Type: GrantFiled: October 6, 2014Date of Patent: August 15, 2017Assignee: NEXANSInventors: Arild Hassel, Robin Sangar, Jorn Wardeberg
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Patent number: 9730309Abstract: The invention relates to a ceramic printed circuit board comprising an upper side and a lower side, sintered metallization regions being arranged on the upper side, and the lower side being embodied as a cooling body. In order to improve the heat dissipation of components on the upper side of the printed circuit board, the lower side is also provided with sintered metallization regions to which a metal cooling body is soldered.Type: GrantFiled: March 30, 2012Date of Patent: August 8, 2017Assignee: CERAMTEC GmbHInventors: Alexander Dohn, Alfred Thimm
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Patent number: 9730325Abstract: A substrate with built-in passive element includes passive elements and a substrate. The passive elements include at least one of a capacitor, an inductor, a resistor, a signal transmission element or an optical waveguide element. The capacitor, the inductor, the resistor, the signal transmission element or the optical waveguide element has a functional element filled in a groove-like or hole-like element forming region provided in the substrate along a thickness direction thereof. The functional element has a Si—O bond region obtained by reacting Si particles with an organic Si compound.Type: GrantFiled: January 15, 2014Date of Patent: August 8, 2017Assignee: NAPRA CO., LTD.Inventors: Shigenobu Sekine, Yurina Sekine, Kazutoshi Kamibayashi
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Patent number: 9723767Abstract: On a circuit board configured to transmit a signal, a pulse transformer is provided on a path used for transmitting the signal of the circuit board. A shield member is provided on the circuit board to prevent noise, which is generated due to noise current flowing in a noise line pattern, from entering the pulse transformer. The shield member covers a part of a surface of at least one pulse transformer, the part intersecting concentric circles (which represent a magnetic field generated by the noise current) whose central axis extends along the direction in which the noise current flows.Type: GrantFiled: July 17, 2012Date of Patent: August 1, 2017Assignee: OMRON CORPORATIONInventors: Toshiyuki Kojima, Megumu Asano
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Patent number: 9723754Abstract: A ground structure of a controller that is mounted in a construction machine such as a dump truck and has a case having an upper surface on which a connector receiver hole for a receptacle connector to be received is provided includes: a cable harness that is provided by a plurality of cables including a ground cable and is connected to the receptacle connector; and a connecting portion for the ground cable to be connected, the connecting portion being provided near the connector receiver hole on the upper surface.Type: GrantFiled: October 29, 2012Date of Patent: August 1, 2017Assignee: Komatsu Ltd.Inventors: Tomohiro Saitou, Masahiko Hosaka
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Patent number: 9704793Abstract: A substrate includes a plurality of through electrodes. The through electrode has a nanocomposite structure including a nm-sized carbon nanotube and is a casting formed by using a via formed in the substrate as a mold.Type: GrantFiled: December 7, 2011Date of Patent: July 11, 2017Assignee: NAPRA CO., LTD.Inventors: Shigenobu Sekine, Yurina Sekine
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Patent number: 9698497Abstract: A repair sleeve has first and second end portions, each of which has a substantially cylindrical outer surface. The end portions are bored to receive a cable of a particular diameter. The inner surface of each end portion may be stepped or tapered. The center portion of the repair sleeve, between the two end portions, has an interior diameter substantially larger than the nominal diameter of the cable so that the repair sleeve can be use on a frayed cable or a cable with a failing splice. The repair sleeve is split longitudinally into two interlocking portions, which, when separated, allows the damaged cable or failing splice under repair to be inserted into a first one of the portions in a radial direction. The other portion is then inserted into the first portion and the repair sleeve is swaged onto the cable.Type: GrantFiled: September 10, 2013Date of Patent: July 4, 2017Assignee: DMC POWER, INC.Inventors: Eyass Khansa, Luis Sosa
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Composite tower for power transmission lines of power grid and composite cross arm structure thereof
Patent number: 9698585Abstract: A composite power transmission tower, and a composite cross arm structure of a composite tower for power grid transmission line is provided, including two sets of cross arm insulators arranged into a V-shaped arrangement horizontally, wherein a first end of each of the two sets of cross arm insulators is connected to the tower body of the composite tower at an opening of the V-shaped arrangement; and a set of oblique-pulling insulators, corresponding to each of the sets of cross arm insulators respectively, has one end connected to a second end of each of the two sets of cross arm insulators at an apex of the V-shaped arrangement, and the other end connected to the tower body over the two sets of cross arm insulators.Type: GrantFiled: October 24, 2013Date of Patent: July 4, 2017Assignee: Jiangsu Shenma Electric Co., Ltd.Inventors: Bin Ma, Yong Zhu, Jie Yu, Weidi Cao, Xizhong Liu -
Patent number: 9699901Abstract: A golden finger and a board edge interconnecting device are disclosed. The golden finger includes a printed circuit board (PCB) surface layer and at least one PCB inner layer, where a metal foil of the PCB inner layer is connected to a metal foil of the PCB surface layer through a current-carrying structure, so that a current-carrying channel of the golden finger passes through the PCB surface layer and the PCB inner layer. The board edge interconnecting device includes the foregoing golden finger. In the embodiments, a current-carrying capacity of a PCB in the golden finger is increased without increasing a size and thickness of a copper foil of the PCB in the golden finger, thereby effectively improving the current-carrying capacity of the PCB in the golden finger.Type: GrantFiled: September 3, 2013Date of Patent: July 4, 2017Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Kai Yao, Yongfa Zhu, Yingpei Huang
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Patent number: 9698538Abstract: Ribbon assembly includes first and second contact modules that each include signal and ground contacts that are configured to engage electrical contacts of a corresponding mating connector. The ribbon assembly also including a plurality of cables that are coupled to and extend between the first and second contact modules. The cables electrically couple the signal and ground contacts of the first contact module to the signal and ground contacts, respectively, of the second contact module. The cables extend parallel to one another and are coplanar at the first contact module and at the second contact module. The ribbon assembly also includes a cable organizer that is coupled to the plurality of cables at a location between and separate from the first and second contact modules. The cables extend parallel to one another and are coplanar as the cables extend through the cable organizer.Type: GrantFiled: March 2, 2015Date of Patent: July 4, 2017Assignee: TE CONNECTIVITY CORPORATIONInventor: Joshua Tyler Sechrist
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Patent number: 9693460Abstract: A wiring board includes a plurality of wiring layers, a plurality of insulating layers, and an electrode member made of a conductive material, the electrode member being incorporated in the wiring board in a state in which the electrode member includes exposed sections on side surfaces that cross the plurality of wiring layers and the plurality of insulating layers.Type: GrantFiled: September 4, 2013Date of Patent: June 27, 2017Assignee: Olympus CorporationInventor: Noriyuki Fujimori
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Patent number: 9693466Abstract: The present invention is to provide a wiring board which can prevent whitening. The wiring board is made of a fiber reinforced resin plate, and has a through hole and a whitening prevention portion. The whitening prevention portion is made only with matrix resin forming the fiber reinforced resin plate, and is integrally formed in the fiber reinforced resin plate. Furthermore, the whitening prevention portion is arranged around the through hole.Type: GrantFiled: February 16, 2012Date of Patent: June 27, 2017Assignee: Yazaki CorporationInventors: Akira Harao, Mototatsu Matsunaga, Yusuke Takagi, Akinori Saneto