Abstract: The present disclosure relates to a polyimide-based block copolymer and a polyimide-based film including the same. The polyimide-based block copolymer according to the present disclosure makes it possible to provide a polyimide-based film having a large molecular weight and exhibiting colorless and transparent properties.

Abstract: The present invention is directed to a polypropylene composition (C) comprising a heterophasic propylene copolymer (RAHECO) and a propylene homopolymer (H-PP) as well as a process for the preparation of said polypropylene composition and a film obtained from said polypropylene composition (C).

Abstract: To provide prepreg having high thermostability and a molded body (fiber reinforced composite) obtained from the prepreg, the prepreg is formed by impregnating a reinforced fiber having an elastic modulus of 100 to 900 GPa with an epoxy resin composition including the following Components A to D so as to have a resin content within a range of 25 to 50 mass %: Component A: an epoxy resin having an oxazolidone ring structure in a molecule thereof; Component B: an epoxy resin that is liquid at 30° C.; Component C: a diblock copolymer having a B-M structure, wherein M is a block including at least 50 mass % of methyl methacrylate, B is a block immiscible with the epoxy resins and the block M, a glass transition temperature of the block B being 20° C. or lower; and Component D: dicyandiamide, or an amine curing agent that is a derivative of dicyandiamide.

Abstract: The present invention encompasses polymer compositions comprising aliphatic polycarbonate chains containing functional groups that increase the polymer's ability to wet or adhere to inorganic materials. In certain embodiments, chain ends of the aliphatic polycarbonates are modified to introduce silicon-containing functional groups, boron-containing functional groups, phosphorous-containing functional groups, sulfonic acid groups or carboxylic acid groups.

Abstract: A butene-1 polymer composition having MFR values of from 400 to 2000 g/10 min, measured according to ISO 1133 at 190° C. with a load of 2.16 kg, made from or containing A) a butene-1 homopolymer or a copolymer of butene-1 with a comonomer selected from the group consisting of ethylene and higher alpha-olefins, having a copolymerized comonomer content of up to 5% by mole; B) a copolymer of butene-1 with a comonomer selected from the group consisting of ethylene and higher alpha-olefins, having a copolymerized comonomer content of from 6% to 25% by mole; wherein the composition having a total copolymerized comonomer content from 5% to 18% by mole, referred to the sum of A) and B), and a content of fraction soluble in xylene at 0° C. of 65% by weight or more, determined on the total weight of A) and B).

Abstract: A method of forming a copolymer is provided, which includes (i) mixing a diamine and a diester to form a mixture, and heating the mixture to form a diamine compound, wherein the diamine compound has a chemical structure of (ii) mixing the diamine compound and a diacid to form a diamine-diacid salt, wherein the diamine-diacid salt has a chemical structure of and (iii) heating the diamine-diacid salt to polymerize the diamine-diacid salt for forming a copolymer, wherein the copolymer has a repeating unit with a chemical structure of wherein n=2-12, R is and m=2-12.

Abstract: The invention relates to the synthesis and process thereof of a Quorum Sensing (QS) based polymer formed by the process of ring opening polymerization/ring opening copolymerization. The formed homopolymer or heteropolymer or copolymer displays increased half-life, bioactivity and biostability in stimulating the microbial quorum sensing in a predetermined microbial population.

Abstract: [Means for solving problem] The resin composition of the present invention comprises 100 parts by mass of a specific ethylene/?-olefin/non-conjugated polyene copolymer (A) and 0.1 to 5 parts by mass of a peroxide (B), and the copolymer (A) comprises structural units derived from ethylene (a1), an ?-olefin (a2) having 3 to 20 carbon atoms, and a non-conjugated polyene (a3) including intramolecularly two or more partial structures in total selected from the group consisting of structures represented by the following formulae (I) and (II), [Effect] The resin composition of the present invention is excellent in crosslinking properties and the resin composition and its crosslinked shaped article of the present invention can be used, without any limitation, in various applications known as applications of rubber composition, and can be suitably used, for example, for interior and exterior parts for automobiles and applications requiring heat resistance.

Abstract: A polyimide precursor composition that exhibits excellent tensile strength and breaking elongation, and that provides a film containing an alicyclic polyimide resin; a method for producing a polyimide film using the polyimide precursor composition; and a permanent film that contains an alicyclic polyimide resin and that exhibits excellent tensile strength and breaking elongation. The polyimide precursor composition is a mixture of a resin precursor component which is a polyamic acid including an alicyclic backbone having a predetermined structure, a monomer component that includes an aromatic diamine compound having a predetermined structure or an alicyclic tetracarboxylic acid di-anhydride having a predetermined structure; an imidazole compound having a predetermined structure; and a solvent.

Abstract: The invention includes methods and materials for forming and manipulating aromatic-based polymers and copolymers using biomass compounds as starting materials. Embodiments of the invention can be used in processes designed to replace those used in the petro-chemical industry. Typical embodiments of the invention include methods and materials for forming and/or modifying compounds including dicarboxylic acid ester dimers, benzoxazines and dicarboxylic acid ether dimers. Embodiments of the invention further provide methods and materials for utilizing these compounds to form commercially desirable polymers having structures and physical properties akin to those found in polymers formed from petroleum products.

Abstract: Provided is a liquid sealing material for copper bumps which is inhibited from suffering filler separation during thermal curing and thereby causing bump cracking. Also provided is a resin composition for use as the sealing material. The resin composition according to the present invention comprises (A) a liquid epoxy resin, (B) a hardener, and (C) an alumina filler having a surface treated with the silane coupling agent of the following formula (1).

Abstract: The present invention discloses modified epoxy acrylates and the solder resist containing the epoxy modified acrylates, belonging to the synthetic resin field. In this invention, modified epoxy acrylates are prepared by introducing long fatty hydrocarbon chain as the branched chain into the carboxylated epoxy acrylates. The as-prepared solder resist containing this modified epoxy acrylates maintains the excellent property of photosensitive solder resist such as good adhesion, hardness, solvent resistance and weather resistance which facilities sensitivity and alkaline development during exposure simultaneously. This has led to good water resistance, electrical insulation of the cured products. Furthermore, the cured product also shows good flexibility which improves its application in photosensitive imaging ink materials.

Abstract: A butene-1 polymer composition having MFR values of from 400 to 2000 g/10 min, measured according to ISO 1133 at 190° C. with a load of 2.16 kg, made from or containing A) a butene-1 homopolymer or a copolymer of butene-1 with a comonomer selected from the group consisting of ethylene and higher alpha-olefins, having a copolymerized comonomer content of up to 5% by mole; B) a copolymer of butene-1 with a comonomer selected from the group consisting of ethylene and higher alpha-olefins, having a copolymerized comonomer content of from 6% to 20% by mole; wherein the composition having a total copolymerized comonomer content from 4% to 15% by mole, referred to the sum of A) and B), and a content of fraction soluble in xylene at 0° C. of 60% by weight or less, determined on the total weight of A) and B).

Abstract: A cross-linkable composition can be provided in the present application. In one embodiment, the cross-linkable composition can allow a membrane formed of the cross-linkable composition to have an excellent interfacial adhesion with another membrane and prevent the occurrence of a detachment phenomenon or the like.

Abstract: As a pressure-sensitive adhesive polarizing plate, for example, a pressure-sensitive adhesive polarizing plate allowing a pressure-sensitive adhesive layer in the polarizing plate to have an excellent interfacial adhesion with another layer and have no detachment phenomenon can be provided in the present application.

Abstract: The present application relates to a cross-linkable composition, and for example, to a cross-linkable composition which can form a membrane having an excellent interfacial adhesion with other layers and cause no detachment phenomenon when forming a membrane in a structure of a pressure-sensitive adhesive optical member or the like.

Abstract: The present invention provides a heat-curable resin composition, which comprises (1) a heat-curable resin mixture comprising a heat-curable resin (a) and thickener particles (b) and exhibiting a viscosity (150° C.) after having been held at a temperature of 150° C. for 30 seconds that is a viscosity (S), and (2) a curing agent, and is characterized in that the heat-curable resin composition exhibits a lowest viscosity (R) at 80-120° C., the lowest viscosity (R) is 0.1-10 Pa·s, and the viscosity (S) and lowest viscosity (R) satisfy the relationship of formula (1): 5<S/R<200??formula (1).

Abstract: A method for synthesizing a polybutylene adipate terephthalate-polylactic acid (PBAT-PLA) copolyester, the method including: uniformly blending a first prepolymer PBAT and a second prepolymer PLA to yield a mixture, 0putting the mixture in a vacuum reactor with a vacuum degree of between 5 and 100 pascal, heating the vacuum reactor to a temperature of between 100 and 110° C., and allowing to react for between 0.5 and 1 hr; stepwise increasing the temperature to be between 145 and 155° C. in between 1 and 2 hrs, and allowing to react for between 5 and 10 hrs, to yield a PBAT-PLA copolyester with a weight-average molecular weight of between 100000 and 250000. The method for synthesizing the PBAT-PLA copolyester is eco-friendly, non-toxic and cost-efficient.

Abstract: An adhesive having water vapor barrier properties, comprising an adhesive base comprised of at least one epoxy syrup at least one elastomer at least one initiator optionally at least one tackifier resin and optionally at least one further reactive resin and optionally a solvent, wherein the adhesive base without solvent has a water vapor permeation rate after activation of the reactive resin component of less than 100 g/m2d, preferably of less than 60 g/m2d, in particular less than 30 g/m2d, wherein the epoxy syrup comprises bisepoxy monomers and high molecular weight uncrosslinked polyepoxies produced therefrom, exhibits good barrier properties and is also sufficiently pressure sensitive to achieve easy handleability.

Abstract: A modified nylon 66 fiber including a first repeating unit derived from adipic acid and hexamethylenediamine, a second monomer unit derived from a diacid or a diamine having a long carbon chain, a third monomer unit derived from a diacid or a diamine having a aromatic ring, and a fourth monomer unit derived from a cyclic diacid or a cyclic diamine is provided. The second monomer unit has 6 to 36 carbon atoms. The third monomer unit has 8 to 14 carbon atoms. The fourth monomer unit has 6 to 10 carbon atoms. Based on a total weight of the modified nylon 66 fiber, a content of the first repeating unit is 78 wt % to 94.8 wt %, a content of the second monomer unit is 0.1 wt % to 1 wt %, a content of the third monomer unit is 5 wt % to 20 wt %, a content of the fourth monomer unit is 0.1 wt % to 1 wt %.