Patents Examined by Rhonda E Sands
  • Patent number: 6101712
    Abstract: A connector assembly useful in grounding applications is provided which includes an insulative housing and a conductive ground shell. The insulative housing includes a passage into which a contact and a cable may be inserted, and a passage which provides access to an inserted contact and cable to facilitate electrical and mechanical connection thereof. Passages in the insulative housing are also provided for inserting legs of the conductive ground shell into the insulative housing to electrically engage the ground wire braid of the cable. The insulative housing and conductive ground shell are constructed and arranged so that the various components readily mate with one another.
    Type: Grant
    Filed: March 16, 1999
    Date of Patent: August 15, 2000
    Assignee: Osram Sylvania Inc.
    Inventor: John O. Wright
  • Patent number: 6098277
    Abstract: A tool for removing a part, such as stand-off, associated with a circuit board includes a generally cylindrical elongated housing which includes open top and bottom ends and defines a recess therein. An elongated punch member is slidably disposed in the recess. First and second stopper members are positioned in the recess adjacent top and bottom ends, respectively, and a third stopper member is positioned in the recess between the first and second stopper members. A spring member is biased between the first and third stopper members. The second and third stopper members are fixedly attached to the punch member and the first stopper member is fixedly attached to the housing.
    Type: Grant
    Filed: January 28, 1999
    Date of Patent: August 8, 2000
    Inventors: William C. Hess, Alan D. Slayton
  • Patent number: 6095928
    Abstract: Capturing the path of an object moving through a sensing volume defined by a three-dimensional (3D) coordinate system. First, second, and third angle detectors are mounted in a common housing positionable at a vertex of a sensing cone encompassing the sensing volume, said first, second, and third detectors being separated from one another by known, fixed distances. Each detector receives a respective light beam from the object having a respective angle relative to a respective reference line of the 3D coordinate system, and provides a signal corresponding to said respective angle. At successive samples, successive coordinate positions of the object within the sensing volume are determined, given the first, second, and third angles at each said sample to determine said path, and the path is displayed.
    Type: Grant
    Filed: December 10, 1998
    Date of Patent: August 1, 2000
    Inventor: Kurt A. Goszyk
  • Patent number: 6096255
    Abstract: The present invention provides a golf ball and a method for making the ball. Two cups are molded from an elastomer separately from a center. In one embodiment of the method, the cups are molded on both sides of a center mold plate with hemispherical protrusions. The protrusions force the elastomer cup material into cavities in outer mold plates on either side of the center mold plate, thus forming cups with cavities. The solid or fluid-filled center is placed within the cup cavities, and the cups are joined, preferably by raising the temperature of the mold above the cure activation temperature of the cup material. In some embodiments of the cups, the cups can be formed with non-planar mating surfaces that mesh with each other. The non-planar mating surfaces preferably have a pattern that is symmetrical about the cavities, such as concentric ridges or a tongue and a groove.
    Type: Grant
    Filed: November 10, 1998
    Date of Patent: August 1, 2000
    Assignee: Acushnet Company
    Inventors: Robert A. Brown, Christopher Cavallaro
  • Patent number: 6035530
    Abstract: A method for manufacturing an interconnect. A substrate having a first dielectric layer and a barrier layer formed thereon is provided. A plurality of conductive wires is formed on the barrier layer. A second dielectric layer is formed on the barrier layer exposed by the conductive wires, wherein the second dielectric layer has a surface level between the top surfaces and the bottom surfaces of the conductive wires. A spacer is formed on each portion of the sidewalls of the conductive wires exposed by the second dielectric layer, wherein there is a gap between two adjacent spacers. The second dielectric layer is removed. A third dielectric layer is formed on the conductive wires, the spacer, the sidewalls of the conductive wires and the portion of the barrier layer exposed by the conductive wires and fills the gap to form an air cavity between the conductive wires under the spacer.
    Type: Grant
    Filed: May 6, 1999
    Date of Patent: March 14, 2000
    Assignee: United Semiconductor Corp.
    Inventor: Gary Hong