Abstract: A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes that include a system of conduits supplying cooling liquid through the node enclosure and including a supply conduit extending from a node inlet coupling and a return conduit terminating in a node outlet coupling. The node inlet port and the node outlet port are positioned in an outward facing direction at a rear of the node enclosure and aligned to releasably seal to the respective inlet liquid port and outlet liquid port in the node-receiving slot for fluid transfer through the system of conduits. An air-spring reducer conduit is in fluid communication with the system of conduits and shaped to trap an amount of compressible fluid that compresses during sealing engagement between the node inlet coupling and node outlet coupling and the inlet liquid port and outlet liquid port, respectively.

Abstract: Each knuckle is molded in and/or around a coupling structure that is either welded to or is an integral part of the section. The coupling structure can be a bracket that is welded to an inner surface of a section, and the bracket is constructed to have a cross-section that minimizes capacitance. In one embodiment, a first bracket can be welded to a first conductive section, and a second bracket can be welded to a second conductive section. A knuckle constructed from an insulating material that is overmolded within and around the first and second brackets such that the first and second conductive sections are coupled together. The first and second conductive sections and their respective brackets are spaced a predetermined distanced apart, thereby ensuring the conductive sections are electrically isolated.

Abstract: A chassis supporting a plurality of circuit cards in an electronic and/or optical system includes one or more fans at an output of an exhaust air plenum, wherein the one or more fans are configured to enhance airflow from an intake air plenum to the output; and an airflow divider disposed in the exhaust air plenum and attached or disposed to the chassis, wherein the airflow divider is dimensioned and located in the exhaust air plenum to segment the exhaust air plenum into multiple sections causing balanced airflow from the intake air plenum to the output and over the circuit cards disposed in the chassis for cooling thereof.

Abstract: A heatsink structure cools a first electronic chip and a second electronic chip that are positioned serially and in-line to one or more cooling fan, such that cooling air from the cooling fan(s) passes above the first electronic chip before passing above the second electronic chip. The heatsink structure includes a first heatsink and a second heatsink, which are identical to each other, and which fit adjacent to one another when a first heatsink is rotated 180 degrees relative to the second heatsink.

Abstract: A subsea unit includes a housing containing a dielectric liquid, a first heat generating component and a second heat generating component. The first heat generating component is arranged in thermal connection with the housing and the second heat generating component is arranged at a distance from the housing. A method of cooling heat generating components contained in a housing of a subsea unit is also presented.

Abstract: A heatsink to be mounted on a circuit board including a plurality of electronic parts is constituted of a conductive and rectangular plate-shaped member, and mounted on the circuit board such that a main surface of the heatsink blocks an airflow generated on the circuit board, the heatsink being electrically grounded. The main surface includes a contacting portion disposed in contact with the circuit board and an isolated portion separated from the circuit board, the isolated portion being cut into two parts along a straight line extending in a direction away from the circuit board. The two parts are each bent such that an end portion on a side of the straight line is oriented to a downstream side of the airflow, so that an opening is defined between the respective end portions of the two parts on the side of the straight line.

Abstract: A settlement processing apparatus as an information processing apparatus includes a first substrate, a second substrate which is provided so as to face the first substrate, a frame member which supports the first substrate and the second substrate on the inner surface side of a wall surface portion surrounding the external forms of the first substrate and the second substrate, and a tamper detection circuit which is disposed within a secure region surrounded by the first substrate, the second substrate, and the frame member and detects the release of blocking of the secure region. An information processing apparatus which is small, secures the degree of freedom in design, and has high tamper resistance is provided.

Abstract: A connector providing both an electrical and mechanical connection and an electronic device utilizing the connector. The connector includes a rigid body, a head connected to the rigid body, and a flexible conductor coupled to the body. The rigid body and the flexible conductor define an electrically conductive path to the head. An electronic device includes a housing defining at least one sidewall, an interior component, and a connector passing through at least one sidewall and mechanically contacting the interior component. The connector defines an electrically conductive path from the interior component to an exterior of the housing.

Abstract: A heat-dissipating structure mounted on the back of a display unit is disposed at a rear portion of a high-brightness display unit.

Abstract: With respect to a stack unit in which a plurality of power cards and a plurality of coolers are stacked, each of the plurality of power cards housing semiconductor element, a technique for improving the fitting of a stack unit to a housing is taught. A stack unit is a unit that coolers and power cards are stacked. An outer frame binds a stack of the power cards and the coolers. The outer frame pressurizes the stack along with the stacked direction. Each of the coolers comprises a main body and a metal plate. The main body includes a flow channel of coolant and an opening provided at a position facing the power card. The metal plate has one surface closing the opening. A seal between the opening and the metal plate is secured by pressure of the outer frame.

Abstract: In a blast mechanism for optimizing an air blast in the main scanning direction and an air blast in the sub-scanning direction so as not to affect reading accuracy of an image, a first blast path for sending air in the main scanning direction and a second blast path for sending air in the sub-scanning direction are formed inside the housing, and collection efficiencies of air filters of the blast paths are set so that the efficiency in the main scanning direction is high than that in the sub-scanning direction. The blast mechanism includes a casing, first and second blast paths in the main and sub-scanning directions disposed in the casing, and air filters disposed in the respective blast paths. The dust collection efficiencies of the air filters are set so that the filter of the first blast path is higher than the filter of the second blast path.

Abstract: This invention discloses a device comprising multiple functional layers formed on substrates, wherein at least one functional layer comprises an electrical energy source. In some embodiments, the present invention includes a component for incorporation into ophthalmic lenses that has been formed by the stacking of multiple functionalized layers.

Abstract: A controller integrated fuel pump module may include a receiving part formed on an outer surface of a flange assembled in a fuel tank, a PCB assembly configured by mounting elements of a controller to a PCB, wherein the PCB assembly is molded by a molding part while being received in the receiving part, and a convexo-concave portion having a shape in which recesses and bosses, the convexo-concave portion being repeatedly formed on an inner surface of the receiving part, such that a bonding force between the receiving part and the molding part is increased by the convexo-concave portion.

Abstract: An IHS chassis defines an IHS housing that houses a plurality of IHS components. The IHS chassis includes an outer surface located opposite the IHS chassis from the IHS housing. A first layer of the IHS chassis provides the outer surface of the IHS chassis. The first layer includes a first layer oxidized surface located opposite the first layer from the outer surface of the chassis base. A second layer of the chassis base is located immediately adjacent the IHS housing. The second layer includes a carbide-based composite material that provides a thermal conductivity of less than 1 watt per meter-kelvin in a direction that is generally perpendicular to the outer surface of the IHS chassis, while providing a thermal conductivity of at least 100 W/mK in directions that are generally parallel to the outer surface of the IHS chassis.

Abstract: An electronic device includes a chassis having a plurality of sides, a bezel located at an end of the chassis, two fixing members fastened to opposite sides of the chassis, and two slide members. Each slide member is respectively slidably attached to the corresponding fixing member. The bezel is slidably sandwiched between the two slide members. The bezel is configured to rotate relative to the slide members. The bezel includes a pair of hooks formed at two opposite ends thereof and configured to be releasably latched by the two fixing members.

Abstract: A device for cooling at least two distinct heat sources comprises a closed circuit in which a diphasic fluid flows. At least one capillary evaporator is configured to be placed in thermo contact with one of the heat sources, referred to as the primary heat source. Each other heat source referred to as a secondary heat source that is to be cooled. At least one exchanger configured to be placed in thermal contact with the secondary heat source. At least one first condenser positioned downstream of the evaporator, and upstream of the at least one exchanger. At least one last condenser positioned upstream of the evaporator and downstream of the at least one exchanger.

Abstract: An assembly of subsea equipment and a plurality of subsea devices each of which is individually mountable on and separable from the subsea equipment wherein each device includes a respective stab connector for establishing electrical connection with the equipment and further has a respective terminal connector for a jumper lead, each device having at least dual redundancy whereby connection through the respective jumper terminal can substitute for the connection though the respective stab connector.

Abstract: In a circuit card chassis, a backplane system includes card guides that are slideable on rails to provide any selected spacing between adjacent circuit cards. A backplane connector assembly extends between each pair of slideable top and bottom card guides. Signal cables can be configured to connect any two backplane connector assemblies to each other.

Abstract: In various embodiments, a high-density solid-state storage unit includes a base section and a cassette section having plurality of flash cards. The cassette section can be removably attached to the base section to provide security of data stored on the plurality of flash cards. The cassette section provides for physical security of the flash cards in part through packaging of the enclosure and energy transfer to the base station. The cassette section further provides for security of the data stored on the flash cards in part through a trusted platform module (TPM) embodied as a removable module connected to a universal serial bus (USB) style connector.

Abstract: This invention relates to a solid-state drive housing, a solid-state disk using the same and an assembling process thereof. The present invention is capable of preventing the unauthorized disassembly of the consumer. The solid-state drive housing comprising a upper cover and a basement, where the lower casing has a plurality of first hollows, the upper cover has a second base and a plurality of fastening structures one pieced formed therewith, part of the end of the fastening structures are bent and disposed in the corresponding first hollows so as to secure the second member with the first member. By the novelty assembling process provided by the present invention, the user may secures the upper cover and the lower casing without the screw liked fasteners and completes the assembly in only a few quick steps, meanwhile, the present invention is also capable of preventing the unauthorized disassembly of the consumer.