Abstract: A power electronic conversion system includes a first electronic component that generates heat; a mounting plate comprising a horizontal plate and a first vertical riser with vertical configuration, wherein the first vertical riser is configured to mount the first electronic component; a first thermal pad disposed between the first electronic component and the first vertical riser to reduce a contact resistance; and a cold plate coupled to the mounting plate and comprised at least one cooling medium passage defined by a plurality of internal fins.

Abstract: An electrical switchgear system includes a switchgear enclosure. The switchgear enclosure has a plurality of compartments housing switchgear components. The electrical switchgear system also includes a vent box. The vent box is in fluid communication with selected compartments of the plurality of compartments. The vent box is disposed on a side of the switchgear enclosure.

Abstract: An air-cooling heat dissipation device is provided for removing heat from an electronic component. The air-cooling heat dissipation device includes a supporting substrate, an air pump and a heat sink. The supporting substrate includes a top surface, a bottom surface, an introduction opening and a thermal conduction plate. The thermal conduction plate is located over the top surface of the supporting substrate and aligned with the introduction opening. The electronic component is disposed on the thermal conduction plate. The air pump is fixed on the bottom surface of the supporting substrate and aligned with the introduction opening. The heat sink is attached on the electronic component. When the air pump is enabled, an ambient air is introduced into the introduction opening to remove the heat from the thermal conduction plate.

Abstract: An electrical system includes modules and a frame structure for mechanically supporting the modules successively in an arrival direction of cooling air. Each module includes a cooling element in heat conductive relation with one or more electrical components. The frame structure mechanically supports the modules so that the cooling elements are substantially in the same attitude and successively in the arrival direction of the cooling air. The cooling elements are shaped so that, when the modules are mechanically supported by the frame structure, the cooling elements conduct cooling air in a direction deviating from the arrival direction of the cooling air. Furthermore, at least a part of a flank of the heat transfer portion of each cooling element is oblique with respect to the arrival direction of the cooling air. Thus, each of the cooling elements receives a fresh portion of the cooling air.

Abstract: An electronic device is provided. The electronic device includes a heat emitting element, and the heat emitting element is disposed on a circuit board PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.

Abstract: An electronic apparatus having a cooling device that can reduce size and cost thereof while maintaining sufficient cooling performance of cooling a portable information apparatus is disclosed. The electronic apparatus includes a portable information apparatus and a cooling device. The portable information apparatus includes a heat-dissipation heat sink thermally connected to a heating body. The cooling device includes a cooling unit for absorbing heat from the heating body. The cooling unit includes a heat-receiving heat sink that is thermally connected to a heat-dissipation heat sink when the portable information apparatus is connected to the cooling device, and a radiator that dissipates heat absorbed in the heat-receiving heat sink to outside. The radiator is disposed on an exhaust path from an air outlet of the portable information apparatus while the portable information apparatus is connected to the cooling device.

Abstract: A circuit structure that includes: an insulating heat transfer member that transfers heat from a bus bar to a heat dissipating member, is insulating, and is provided between the bus bar and the heat dissipating member; and a restricting member that restricts movement of the insulating heat transfer member that is caused by an increase in the temperature of the insulating heat transfer member, and is provided between the bus bar and the heat dissipating member. The restricting member is provided with heat transfer openings for bringing the insulating heat transfer member into contact with the bus bar, and, the insulating heat transfer member 80 has a smaller area than an opening area of the heat transfer openings, in a state of being in contact with the bus bar.

Abstract: A handheld computing device that includes an enclosure having structural walls formed from a glass material that can be radio-transparent. The enclosure can be formed from a hollow glass tube or two glass members bonded together. A laser frit bonding process may be used to hermetically seal the two glass members together to create a water resistant electronic device.

Abstract: Provided is a cooling device, and methods of fabricating and operating such cooling devices, for electromagnetic induction (EMI) filters. Specifically, a cooling device is provided which comprises a housing enclosing the electromagnetic induction filter. The housing may comprise one or more of the following: one or more exterior chambers, one or more central flow channels, and peripheral flow channels. The one or more exterior chambers surround an exterior surface of the EMI filter. The one or more central flow channels extend the length of the center of the EMIR filter. The peripheral flow channels extend the length of the exterior of the electromagnetic induction filter. The peripheral flow channels may be disposed between one or more exterior chambers and open into the one or more exterior chambers. The one or more central flow channels, the peripheral flow channels, and the one or more exterior chambers are interconnected.

Abstract: The object is to provide a technology capable of enhancing a cooling performance of a semiconductor device. The semiconductor device includes a fin portion including a plurality of projecting portions that are connected to a lower surface of a heat-transfer base plate, a cooling member covering the fin portion and being connected to an inlet through which coolant to flow toward the fin portion flows in and an outlet through which coolant flowing from the fin portion flows out, and a header being a water storage chamber that is provided between the inlet and the fin portion and is partitioned from the fin portion so as to be capable of allowing coolant to flow through from the inlet to the fin portion.

Abstract: A component carrier for carrying and cooling at least one heat generating electronic component is presented. The component carrier comprising includes an outer layer structure, an electrically insulating layer arranged adjacent to the outer layer structure, and a heat conducting structure arranged adjacent to the electrically insulating layer on a side opposite to the outer layer structure. The heat conducting structure is thermally coupled to the at least one heat generating electronic component such that the outer layer structure receives thermal radiation irradiated by the heat conducting structure and transports corresponding heat away from the component carrier via convection by a heat transfer medium surrounding the component carrier.

Abstract: A heat dissipation device includes a heat dissipation piece, heat conduction plates, a rod piece and a switch. The heat conduction plates are connected to the heat dissipation piece and spaced apart from and arranged parallel to each other so as to define accommodating spaces. Each heat conduction plate has a free end away from the heat dissipation piece, and the free end has a through hole. The rod piece has a first end and a second end opposite to each other, the rod piece penetrates through the through holes, and the second end has a limitation portion. The switch has a cam portion pivoted to the first end. When the switch is pivoted with respect to the heat conduction plates, the cam portion drives the rod piece to move among the through holes, making the limitation portion to press against or be separated from the heat conduction plates.

Abstract: The disclosed system may include a group of information technology racks, where (1) each of the information technology racks stores information technology device modules, (2) the group of information technology racks are arranged such that interior faces of the information technology racks define a vertical column of space enclosed by the group of information technology racks, and (3) the information technology racks ventilate air heated by the information technology device modules from the interior faces of the information technology racks into the vertical column of space such that the heated air is contained within the vertical column of space.

Abstract: A heat exchanger for cooling an electronic component includes a heat transfer chamber containing a heated substance having a first density and a liquid coolant having a second density. The heat exchanger can also include a circulation circuit that recirculates the heated substance through the heat transfer chamber for mixing with the liquid coolant.

Abstract: A server heat dissipation system is provided, comprising a liquid cooling server cabinet comprising a cabinet body and multiple liquid cooling servers provided inside the cabinet body, wherein it is provided with a liquid cooling device to perform direct liquid cooling to the liquid cooling servers, and with an auxiliary heat dissipation device to perform auxiliary heat dissipation to the liquid cooling servers. The present invention provides high density cooling, high heat exchange efficiency, no local overheating, small space occupied, high reliability, low noise, and long life.

Abstract: A system for immersion cooling computing system equipment includes a container, a volume of cooling liquid disposed in the container, a computing system equipment holder disposed in the volume of cooling liquid and a liquid-liquid heat exchanger attached to and supported by the computing system equipment holder. The liquid-liquid heat exchanger is disposed in the volume of cooling liquid.

Abstract: An air-cooling heat dissipation device is provided for removing heat from an electronic component. The air-cooling heat dissipation device includes a supporting substrate, an air pump and a heat sink. The supporting substrate includes a top surface, a bottom surface, an introduction opening and a thermal conduction plate. The thermal conduction plate is located over the top surface of the supporting substrate and aligned with the introduction opening. The electronic component is disposed on the thermal conduction plate. The air pump is fixed on the bottom surface of the supporting substrate and aligned with the introduction opening. The heat sink is attached on the electronic component. When the air pump is enabled, an ambient air is introduced into the introduction opening to remove the heat from the thermal conduction plate.

Abstract: A circuit board, on which a packaged semiconductor integrated circuit is to be mounted, includes a substrate, a heat-dissipating connection pad, and a first open area. The substrate includes a substrate body having a main surface, a metal layer located on the main surface, and an insulating layer located on the metal layer. In the heat-dissipating connection pad, the metal layer is exposed from an opening in the insulating layer. The heat-dissipating connection pad is connectable to a heat-dissipating unit of the semiconductor integrated circuit via a bond. In the first open area, the metal layer is exposed from an opening in the insulating layer located outboard with respect to a periphery of the heat-dissipating connection pad.

Abstract: A flame retardant structure for electronic component includes a printed circuit board, an electronic component, a metal heat dissipation module, a first plastic part and a receiving space formed by the printed circuit board and the metal heat dissipation module. The metal heat dissipation module has an opening, or the metal heat dissipation module and the printed circuit board form an opening. The electronic component is located in the receiving space. When the electronic component is heated, the first plastic part melts and enters into the receiving space through the opening, and the first plastic part melts to cover and protect the electronic component. The first plastic part is offered with different structures to match with different metal heat dissipation module for flexible use, low cost and high fire retardant effect.

Abstract: Thermal energy exposed at the outer surface of an information handling system housing is managed by spreading the thermal energy across the housing X and Y axes while restricting heat transfer from the housing at the Z axis. For example, a graphene outer surface couples to an aerogel substrate strengthened by a carbon fiber laminate. The graphene spreads thermal energy that escapes through the housing across the housing outer surface to limit the impact of thermal energy at any particular location, such as proximate to the location of a processor.