Abstract: A polymer of a ring-opened functionalized epoxide is formed by the polymerization of a functionalized epoxide monomer having the structure E-CHR-G wherein E represents an epoxide group, R is hydrogen or an alkyl group, and G is a derivatizable group such as an unsaturated functionality or ester substituent.

Abstract: Flexible epoxy-based adhesive compositions which remain Theologically stable at room temperature in an uncured state comprise: (a) at least one flexible polyepoxide resin having a hardness not exceeding a durometer Shore D reading of 45 when cured with a stoichiometric amount of diethylene triamine (“DETA”); and (b) a substantially stoichiometric amount of at least one latent epoxy resin curing agent. Optionally, the adhesive composition may also incorporate one or more semi-flexible resins. Other optional components include fillers, thixotropic agents, and flexibilizers. The adhesive composition provicdes an epoxy-based adhesive composition that is storable for weeks as a single component mixture at room temperature, curable at temperatures ranging from about 100° C. to 125° C. in less than two hours, and flexible upon curing to temperatures as low as minus 50° C., exhibiting a durometer Shore A of less than about 95.

Abstract: A method of producing a stain-resistant and soil-resistant polyamide yarn comprises the steps of (a) melt compounding a sulfonated aromatic acid with a thermoplastic polyester or polyamide carrier resin to form a concentrate; (b) adding said concentrate to a fiber-forming polyamide to form a fiber-forming polyamide composition; (c) melt extrusion spinning said fiber-forming polyamide composition to form a yarn; and (d) drawing said yarn.

Abstract: Binders for aqueous corrosion protection systems, comprising products A′ABC of reaction of epoxy resins, fatty acids, and amines, having a number average molar mass Mn of at least 5000 g/mol, obtained by reacting epoxide compounds A′ containing at least two epoxide groups per molecule and reaction products ABC of epoxide compounds A, fatty acids B, and amines C, wherein, where appropriate, the epoxide compounds A′ and/or the epoxide compounds A have been modified prior to further reaction, in whole or in part, by reaction with compounds D containing at least one acid group or hydroxyl group reactive toward epoxide groups, and wherein, where appropriate, the amines C have been modified prior to further reaction, in whole or in part, by reaction with aliphatic or aromatic monoepoxide compounds A″ or mixtures thereof.

Abstract: A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

Abstract: The present invention provides an epoxy resin composition that has both a rapidly-curability and an excellent storage stability and is useful in the field of electronic and electric materials. That is, the present invention is an epoxy resin composition comprising a compound (A) having two or more epoxy groups in the molecule, a co-condensation product (B) having two or more phenolic hydroxyl groups in the molecule, and a molecular association product (C) of a tetra-substituted phosphonium (X), a compound (Y) having two or more phenolic hydroxyl groups in the molecule, and a conjugate base of the compound (Y) having two or more phenolic hydroxyl groups in the molecule, said conjugate base being a phenoxide type compound obtained by removing a hydrogen atom from the aforesaid compound (Y) having two or more phenolic hydroxyl groups in the molecule.

Abstract: Epoxy-modified, two-part acrylic structural adhesives are disclosed. These adhesives are not inhibited by oxygen. Representative embodiments include 2-part acrylic structural adhesives comprising, in a first package from about 10 to about 90 percent by weight of at least one methacrylate selected from C3-C10 alkyl monosubstituted-, C1-C6 alkyl disubstituted-, C1-C4 alkyl tri-substituted, and F1-C4 alkyl tetra-substituted cyclohexyl methacrylate. The ring substituents are prefereably in the 3, 4, and/or 5 ring position, and linear or branched C4-C10 branched alkyl methacrylates; from about 10 to about 80 percent by weight of a toughener, and an adhesion promotor; and in a second package, a bonding activator, and optional epoxy resin.

Abstract: Curable thermoset resin compositions are described which are useful for imparting water and/or solvent resistance to gel coated fiber-reinforced polymers. Those compositions contain at least 5 weight-percent of an at least partially end-capped unsaturated polyetherester resin, an unsaturated polyester resin in a specified amount having a specified range of unsaturation, about 10 to about 70 weight-percent of at least one vinyl monomer and a curing agent. Methods and intermediates for making those compositions, use of the curable thermoset resin compositions to make fiber-reinforced polymer composites and skin laminate intermediates for the same, and articles manufactured using the same are also described. These compositions, methods and uses improve the chemical and/or water resistance of resin compositions, particularly composite materials having a gel coat.

Abstract: A method for forming a coated film comprises (1) applying a water or solvent based coating composition on an undercoated or intercoated substrate to form a base coating, (2) applying a clear coating composition thereon to form a clear coating without curing the base coating, and (3) heating and curing both the base coating and clear coating, wherein the clear coating composition comprises as a binder (a) from 10-70% by weight of an acrylic polycarboxylic acid having on average 2 or more carboxyl groups per molecule obtained by copolymerizing an acid anhydride group-containing ethylenically unsaturated monomer with an ethylenically unsaturated monomer having no acid anhydride group, then reacting the resulting copolymer with a monoalcohol; (b) from 5-70% by weight of a polyester polycarboxylic acid having an acid value of from 50-350 mg KOH/g (solid) obtained by reacting a polyester polyol having 3 or more hydroxyl groups with an acid anhydride group-containing compound; (c) from 10-80% by weight of a po

Abstract: Disclosed is a coating composition for metal coating, said coating composition containing (A) at least one of an epoxidized polybutadiene resin and an epoxy group-containing polyhydric phenol-modified epoxidized polybutadiene resin, and (B) at least one of a capped epoxy resin and a methylol group-containing capped epoxy resin.

Abstract: A novel method for preparing a thermosetting imide resin composition which consists of chemically reacting a liquid mixture of a carboxy-(CTBN) or vinylidene-(VTBN) polybutadiene/acrylonitrile and a co-reactant comprisinga. at least one N,N'-bisimide of an unsaturated carboxylic acid of general formula I ##STR1## wherein B represents a divalent radical containing a carbon-carbon double bond and A represents a divalent radical having at least two carbon atoms, orb. the imide resin reaction product of an least one N,N'-bisimide of general formula I and at least one primary organic diamine or organic hydrazide, orc. the imide resin reaction product of at least one N,N'-bisimide of general formula I, at least one monoimide, and at least one organic hydrazide,to yield a thermosetting imide resin composition containing copolymerized CTBN or VTBN and co-reactant. A resin composition prepared by this method may be cured at a temperature between 100.degree. C. and 350.degree. C.

Abstract: Non-gelled amine-epoxide reaction products are obtained by co-reacting a secondary amine, a polyoxyalkylene polyamine, a polyepoxide and optionally a monoepoxide. The products are crosslinkable and are useful in aqueous coating compositions, particularly when applied to a substrate by cathodic electrodeposition.

Abstract: This invention relates to epoxy vinyl ethers having the formula: ##STR1## where R is a polyvalent linear, branched or cyclic hydrocarbon radical having from 2 to 20 carbon atoms, optionally substituted with alkyleneoxy; A is branched or linear C.sub.1 to C.sub.4 alkylene; B is halogen or lower alkyl; m has a value of from 0 to 4; n has a value of from 0 to 20; p has a value of from 1 to 5; and T is ##STR2## when p is one, and is ##STR3## or a mixture of ##STR4## and ##STR5## when p is greater than one.

Abstract: A chlorosulfonated ethylene.multidot..alpha.-olefin copolymer composition is disclosed, comprising(a) 100 parts by weight of a chlorosufonated ethylene.multidot..alpha.-olefin copolymer containing from 25 to 32% by weight chlorine and from 0.3 to 2.5% by weight sulfur,(b) from 1 to 4 parts by weight of a metal oxide or a metal hydroxide,(c) from 3 to 15 parts by weight of an epoxy compound,(d) from 0.5 to 5 parts by weight of a thiuram, and(e) from 0.5 to 5 parts by weight of a maleimide. The chlorosulfonated ethylene.multidot..alpha.-olefin copolymer of the invention provides vulcanized products having excellent heat resistance, cold resistance and water resistance.

Abstract: A moisture-hardening flocking adhesive composition for application to elastomers. The adhesive contains an isocyanate terminated polyurethane prepolymer, an aromatic dinitroso compound and an essentially hydroxyl-free epoxy resin having an epoxide value of from about 0.45 to about 0.75. The composition is essentially free of highly volatile organic solvents. The composition is characterized as having improved storage stability and provides excellent adhesion between elastomeric substrates and flocking fibers, even after exposure to water.

Abstract: A new thermocurable composition is disclosed which comprises a Bisphenol A-type epoxy resin having a number average molecular weight of 650-1300, 10-40% by weight of the Bisphenol A-type epoxy resin having an epoxy equivalent of 180-195; and a curing agent capable of cross-linking the epoxy resin. The curing agent is preferably a compound represented by the following general formula: ##STR1## wherein X is --CR.sub.1 R.sub.2 --, --CO--, --COO--, --SO.sub.2 --, --SO--, --S--, --O--, --NR.sub.1 --, --SiR.sub.1 R.sub.2 -- or --POR.sub.1 -- where R.sub.1 and R.sub.2 each stands for hydrogen, a lower alkyl or a phenyl; Y and Y' each stands for hydrogen, a lower alkyl or an electron attractive group; R is a lower alkyl; and m and n each is an integer of 1-4, or a mixture thereof with a primary amine, a phenolic compound or an acid anhydride.

Abstract: A composition for a cross-linkable hot melt adhesive is provided and is formed by an ethylene-vinyl acetate copolymer containing primary hydroxyl functions and a blocked polyisocyanate. This composition when associated with a tackifying resin, which can also serve as blocking agent of the polyisocyanate, is a cross-linkable hot melt adhesive. The adhesive is used at a temperature at least equal to splitting temperature of the isocyanate functions of the polyisocyanate. The temperature at which such adhesives retains adherence can reach about 200.degree.-220.degree. C.

Abstract: Curable compositions which comprise:(i) an acid-functional compound having an average of at least two carboxylic acid groups per molecule; and(ii) an anhydride-functional compound having an average of at least two cyclic carboxylic acid anhdyride groups per molecule; and(iii) an epoxy-functional compound having an average of at least one epoxy group per molecule; and(iv) a hydroxy-functional compound having an average of at least two hydroxyl groups per molecule;wherein at least one of the compounds (i), (ii), (iii) or (iv) comprises a film forming polymer.

Abstract: Disclosed is a process for the preparation of water-thinnable, hydrolytically stable, thermosettable, cationic coating compositions, with process comprises blending:(1) 5-35 weight percent of a carboxylated crosslinking compound, and(2) 65-95 weight percent of an amino group-containing resin binder, which binder comprises the reaction product of ammonia and a blend of(a) a polyglycidyl ether having n epoxy groups per molecule, wherein 1<n<1.9, said polyglycidyl ether being the reaction product of a multifunctional polyglycidyl ether having x epoxy groups per molecule, wherein x>2, and (x-n) mol of a monofunctional phenol per mole of the multifunctional polyglycidyl ether, and(b) a diglycidyl ether having an epoxy group concentration in the range of from 1000 to 5500 mmol/kg,the average molar epoxy functionality of the glycidyl ethers, present in the blend of polyglycidyl ether and digylcidyl ethers, being <1.75.and wherein (1) and (2) are blended before or after neutralization of (2).

Abstract: A hydroxy functional epoxy-polyester graft copolymer and solvent-based thermosetting coating composition comprising said copolymer and blocked polyisocyanate crosslinking agent. The coating composition may be formulated as a hot sprayable, high solids coating composition suitable for use as a chip resistant automotive vehicle primer adapted for use on body panel areas subject to chipping by stones, gravel and other road debris. Alternatively, the composition may be formulated as a high solids composition sprayable with conventional spraying equipment. The hydroxy-functional epoxy-polyester graft copolymer is prepared by polymerization of lactone monomers in the presence of hydroxy functional epoxy ester resin precursor. Such precursor resin is formed by reaction of diepoxide chain extended with dicarboxylic acid and chain terminated with acid component comprising primary hydroxy functional acid.