Abstract: A base assembly includes a first horizontal brace, a second horizontal brace, a first horizontal interconnection interconnecting front ends of the first and second horizontal braces, a second horizontal interconnection interconnecting rear ends of the first and second horizontal braces, and first, second, third and fourth vertical posts each releasably secured to the underside of the worktable and the rear ends of the first and second horizontal braces; a control switch secured to the front ends of the first and second horizontal braces, and the first interconnection; and a detachable worktable including first and second sliding rods, an opening, first and second bifurcations, a housing; a chute; first and second bossed holes, two opposite third bossed holes, two opposite fourth bossed holes, first and second C-shaped clamps, a transverse second threaded hole, and screws.

Abstract: A grinding apparatus includes a first grinding mechanism, a second grinding mechanism, and a third grinding mechanism for grinding wafers held on respective chuck tables. The first grinding mechanism and the second grinding mechanism are positioned with respect to the chuck tables such that a second ground mark produced on a wafer by second grindstones of the second grinding mechanism as it grinds the wafer extends across a first ground mark produced on the wafer by first grindstones of the first grinding mechanism as it grinds the wafer. The second grinding mechanism and the third grinding mechanism are positioned with respect to the chuck tables such that a third ground mark produced on the wafer by third grindstones of the third grinding mechanism as it grinds the wafer extends across the second ground mark produced on the wafer by the second grindstones.

Abstract: An attachment for a mobile handling device is configured for processing walls or ceilings. The attachment comprises a mounting unit that is arranged to be supported at a mounting interface of the handling device, a processing head that is arranged to be equipped with at least one tool for material-removing processing or smoothing processing, and a compensation arrangement that is arranged between the mounting unit and the processing head and that defines a longitudinal axis. The mounting unit provides at least two pivot positions for the attachment that are offset from one another. The processing head is movable relative to the mounting unit in a longitudinal direction along the longitudinal axis. The compensation arrangement is configured to provide a defined contact pressure force for the processing head in a defined operating range along the longitudinal axis towards the surface to be processed.

Abstract: A vertical barrel of an internal diameter to receive a pig having a selected uncompressible diameter, a reducer to compress the pig to a compressed diameter and a fluid system to introduce fluid pressure into the upper end of the barrel to drive the pig through the reducer.

Abstract: An optical film-thickness measuring apparatus capable of eliminating an influence of a fluid flow on optical fiber cables when the fluid, such as pure water, is flowing through a through-hole of a polishing pad, and capable of achieving highly accurate measuring of a film thickness is disclosed. The optical film-thickness measuring apparatus includes: a light-emitting optical fiber cable coupled to a light source; a light-receiving optical fiber cable arranged to receive light reflected from the workpiece; a cable housing surrounding the light-emitting optical fiber cable and the light-receiving optical fiber cable; and a flow-passage structure defining a fluid passage adjacent to the light-emitting optical fiber cable and the light-receiving optical fiber cable. The light-emitting optical fiber cable and the light-receiving optical fiber cable are supported by at least one of the cable housing and the flow-passage structure.

Abstract: A sanding machine, in particular for processing wood surfaces, includes a support and transport plane for the forwarding of the workpieces to be processed; and a belt sanding unit with a transverse abrasive belt inside which a pressure pad is arranged obliquely. The pressure pad is divided into a plurality of pressure elements which can be actuated individually and are controlled by respective sensors that constitute a control beam. Methods are described for compensating the different distances between sensor and respective pressure elements that avoid adaptations of the position of the workpiece to be processed, in particular if the machine contains further non inclined processing units. The sanding machine is particularly suitable even for the processing of large workpieces.

Abstract: A sawhorse includes a modular work surface supported by a frame. The modular work surface includes a first side portion, a second side portion and a central portion. The modular work surface is configured to move between a compact configuration and an expanded configuration. In the compact configuration the first side portion and the second side portion are adjacent to one another to provide a compact worktop and the central portion is positioned beneath the compact worktop. In the expanded configuration, the first side portion and the second side portion are distal to one another and the central portion is positioned therebetween to create an expanded worktop.

Abstract: A wafer processing method for processing a wafer having a chamfered portion formed at a periphery thereof includes a tape attaching step of attaching a protective tape to a front surface of the wafer and making a diameter of the protective tape coincide with a diameter of the wafer; a grinding step of grinding a back surface of the wafer held by a holding table with use of grinding stones so as to thin the wafer to a thickness thinner than half of an original thickness, to reduce the diameter of the wafer, and to form a protruding portion where the protective tape protrudes from the wafer; and a contracting step of heating and contracting the protruding portion of the protective tape after the grinding step is carried out.

Abstract: Polishing uniformity of a surface to be polished of a substrate is improved by appropriately according with a state of the surface to be polished during polishing. A substrate processing apparatus includes a table 100 for supporting a substrate WF, a pad holder 226 for holding a polishing pad 222 for polishing the substrate WF supported by the table 100, an elevating mechanism for elevating the pad holder 226 with respect to the substrate WF, a swing mechanism for swinging the pad holder 226 in a radial direction of the substrate WF, supporting members 300A and 300B for supporting the polishing pad 222 swung to outside the table 100 by the swing mechanism, and driving mechanisms 310 and 320 for adjusting at least one of a height and a distance to the substrate WF of the supporting member 300 while polishing the substrate WF.

Abstract: A ratchet wrench (1) has a flexible clutch ring (500) that forms the mid part of a laminate-like structure comprising a wrench head (200), the clutch ring (500) and a drive element (40). When under load, the compression forces applied to the clutch ring (500) are substantially dissipated around its circumference (508) and inner surface (509), this inward force clamping upon the inherently strong drive outer surface (45). The laminate-like construction enables a reduction in the width or depth of the wrench head without a loss in strength.

Abstract: A method includes polishing a wafer on a polishing pad, performing conditioning on the polishing pad using a disk of a pad conditioner, and conducting a heat-exchange media into the disk. The heat-exchange media conducted into the disk has a temperature different from a temperature of the polishing pad.

Abstract: An abrasive belt is provided which comprises a textile fabric being formed of interconnected yarns, and a coherent abrasive area formed on one side of the textile fabric, wherein the abrasive belt further comprises a plurality of regularly distributed openings in the form of through holes. The abrasive belt allows for a homogenous distribution of the abrasive material and thus an even sanding finish as well as for an appropriate dust removal and appropriate mechanical properties.

Abstract: The machine tool (1) having a work head (9) adapted to support a tool (21), a workpiece holder (30) having a two substantially parallel beams (31) arranged at a distance adjustable orthogonally to the longitudinal extension of the beams, a carriage (35) on each beam (31) movable along the longitudinal extension of the beam (31), on each carriage (35) a suction cup (39) for blocking the workpieces (P) to be machined. The position of each suction cup (39) with respect to the carriage (35) onto which the cup is mounted is adjustable by rotating around an axis (D-D) which is substantially orthogonal to a blocking surface, for blocking the workpieces, defined by the suction cups (39). To each suction cup (39) an actuator (46, 48) is associated, controlling the rotation of the suction cup (39) with respect to the carriage (35) onto which the cup is mounted.

Abstract: Automatic fixture replacement mechanism for machine tool, wherein includes multiple sets of fixtures for installing work pieces to be processed and a movable manipulator for loading fixture; the movable manipulator is installed on a two-dimensional movable mechanism; the movable manipulator is provided with a pull nail that is fastened to the clamp and the fixture is provided with a pin hole matching with the pin. For batch processing of a large number of work pieces with multiple fixtures, the use of movable manipulator to automatically install and unload fixtures can greatly improve the efficiency of processing. The structure of the mechanism and the operation are simple so that it is reliable and easy to be implemented. Hence, it can be widely used in various types of CNC machining centers.

Abstract: A technological equipment for tank track moving supports is provided and includes a zero-point positioning system, a workpiece identifying system and a clamping apparatus in cooperation with the moving support, the clamping apparatus includes a tooling plate, a clamp and a pressing device for pressing the moving support are detachably connected to the tooling plate, the moving support is located between the clamp and the pressing device, and the pressing device abuts against the moving support. The moving support with different shapes and sizes can be clamped, and the clamping is stable and convenient to operate.

Abstract: Systems and methods for mounting a robotic arm for use in robotic-assisted surgery, including a mobile shuttle that includes a support member for mounting the robotic arm that extends at least partially over a gantry of an imaging device. Further embodiments include a mounting apparatus for mounting a robotic arm to a base or support column of an imaging device, to a patient table, to a floor or ceiling of a room, or to a cart that extends over the top surface of the patient table.

Abstract: A substrate processing apparatus includes: a holding part for holding a substrate; a rotating part for rotating the holding part to rotate the substrate together with the holding part; a liquid supply part for supplying a cleaning liquid to a main surface of the substrate; a polishing head for polishing the main surface; a moving part for scanning the polishing head in a radial direction of the substrate while pressing the polishing head against the main surface; and a controller for controlling the rotating part, the liquid supply part, and the moving part. The controller sets a division line that divides the main surface into plural areas in the radial direction, and controls the liquid supply part to supply the cleaning liquid for each area and controls the moving part to scan the polishing head for each area while a subsequent supply of the cleaning liquid is stopped.

Abstract: A polishing pad useful in chemical mechanical polishing can comprise a base pad having a top surface and surface, a plurality of polishing elements each having a top polishing surface and a bottom surface, and wherein each of the plurality of polishing elements is connected to the top surface of the base pad to the polishing element by three or more supports wherein the bottom surface of the polishing element, the top surface of the base pad and the supports define a region comprising at least one void and there are openings between the three or more supports. Such pad can be used in a method by providing a substrate and polishing the substrate with the pad, optionally, with a polishing medium.

Abstract: Apparatus and method for removing material from the susceptor of a batch processing chamber are described. The apparatus comprises a polishing tool including a rotatable platen positioned above the susceptor. A method comprises contacting material deposited on the susceptor with the rotatable platen to remove the material from the susceptor.

Abstract: A wind power blade multi-robot cooperative grinding and roller coating operation assembly line system is provided and includes: a working platform; a blade tip transfer and tooling turning system and a blade root transfer and tooling turning system arranged on a middle of the working platform and configured to support and adjust a head and a tail of the wind power blade respectively; wind power blade automatic grinding robots and wind power blade automatic roller coating robots symmetrically arranged on the working platform and located on two sides of the wind power blade. An automatic processing of grinding and roller coating of wind power blades is realized, which can reduce labor intensity. An integration of omnidirectional transfer and weight of the wind power blades is realized, which can detect the weight in real-time. A blade sprain is avoided effectively, and a layout of an assembly line is more flexible.