Abstract: An integrated circuit package that contains a multi-layer printed circuit board that is coupled to a plurality of external mounting pins and an integrated circuit. The multi-layered circuit board has a plurality of inner bonding pads that are coupled to the integrated circuit and routed directly to the pins without use of any vias. The printed circuit board has multiple voltage/ground layers so that different power levels can be supplied to the integrated circuit board. The integrated circuit is mounted and electrically grounded to a heat slug that is also coupled to the printed circuit board. The heat slug provides the dual function of a ground plane and a thermal sink for the package. The pins and package are typically configured in a conventional PPGA package arrangement.

Abstract: A miniaturized surface mountable tombstoning resistant electronic component is disclosed. The terminals of the component are respectively L and J shaped conductive metal portions. The portions of the terminations covering the ends of the components are formed of a non-solder, wettable conductive metal, whereas the portions of the terminations underlying the bottom surface of the component are comprised of solder wettable metal. The disclosure further relates to a method of manufacturing the described termination structures.

Abstract: A micromodule includes a slotted metal strip and a perforated dielectric strip having a thickness of less than 70 micrometers, preferably between 30 and 50 micrometers. The metal strip is bonded to the dielectric strip so as to overlie the slots in the metal strip. A chip is bonded to the dielectric strip and connected to the metal strip through the perforations in the dielectric strip. An insulating resin layer encapsulates the chip and is bonded to the dielectric strip. The micromodule may be used, for example, in a smart card, as a radiating antenna, or as an identification label.

Abstract: Housing for an electrical system for controlling operations includes a housing wall, at least one connection arrangement provided at the housing wall for connecting a control circuit disposed inside the housing to circuits located outside the housing, and a base forming a unitary body with the housing, the connection arrangement including contact members forming a non-detachable part of the housing wall, the control circuit disposed inside the housing being directly connected to the contact members.

Abstract: A single stacked semiconductor package has at least two semiconductor chips densely mounted via a lead on chip method for attaching leads of a lead frame by alternately arranging the leads over or under the semiconductor chips. A tape automated bonding method using thin metal leads formed on insulating tapes, and an adhesive coated on the lower portions of the leads to mount at least two semiconductor chips can also be used. A stacked semiconductor device manufacturing method and the semiconductor package according thereto are suitable for use in large scale integration circuits.

Abstract: A modified lead frame is provided for use with electrical component test handlers. A conventional multiple-parallel-conductor lead frame is modified to include two broad, electrically conductive shields positioned on opposite sides of the lead frame. Each shield covers a major portion of one side of the lead frame. Such lead frames are designed for mounting in a predetermined orientation on a lead frame holder, with one side facing toward, and the other side facing away from, the major mass of the holder. The conductive shield positioned on the side facing away from the holder on the modified lead frame of the present invention is electrically coupled to one or more selected conductors on the lead frame. The one or more selected conductors include the power or ground conductor which supplies power to a test component during tests. The shield which faces toward the holder is electrically isolated from all the conductors on the lead frame by an intermediate insulating layer.

Abstract: An environmentally sealed electronic test instrument having a three-part case enclosing an electronic testing circuit of conventional design. The three parts are open-ended top and bottom parts, and an end part covering the open ends of the top and bottom parts. The top and bottom parts have adjoining sidewalls between which is positioned a first resilient seal. Respective inwardly extending flanges are formed at the open ends of the top and bottom parts. The flanges are received by a second, U-shaped seal that is, in turn, received by a U-shaped channel formed along a marginal edge of the end plate. A pair of fingers integrally formed in the second gasket project into the U-shaped channel and are positioned between the first seal and top part of the case. The side marginal edge of the bottom part of the case are recessed within the sidewall of the top part of the case to enclose the first gasket.

Abstract: A cover unit is constituted such that a conductive member is provided on the entirety of the inner wall of a hollow cover, and the periphery of the conductive member is fixed to the cover.

Abstract: A weathertight and EMI shielded door configuration for a cabinet (10) includes at least one door opening defined by an upper, a lower, and two vertical frame members (34, 36, 38, 40, 42, 56). An upper, a lower and two vertical door skin members (90, 102, 94, 106, 110, 111) are bonded to door frame members (34, 36, 38, 40, 42, 56). The door skin members (90, 102, 94, 106, 110, 111) are formed to substantially cover the upper, lower, and vertical frame members, and defines a door recess having a depth and a substantially vertical and planar door-frame mating surface. A door (16, 18) having a thickness substantially equal to the depth of the door recess is hung in the door opening. The perimeter of the doors interior surface meets the upper, lower and two vertical door skin members (90, 102, 94, 106, 110, 111) at the planar door-frame mating surface. An EMI and environmental gasket (98) is positioned at the door-frame mating surface.

Abstract: A weathertight and EMI shielded cabinet (10) for housing electronic equipment is disclosed. The cabinet (10) is structurally supported and framed by a tubular frame (30) which defines a generally rectangular structure having upper horizontal frame members (34, 36), lower horizontal frame members (38, 40), and vertical corner posts (42). The tubular frame (30) may include internal cross members (60, 62) to further reinforce the structure. Door openings are further defined by vertical door frame members (56). A plurality of outer skins (80, 84, 110, 111, 112, 90, 102) are welded to the tubular frame (30) and substantially enclosing it and hiding it from view. The outer skins also define the door frames (90, 92, 94, 102, 104, 106) welded to the vertical door frame members (36) and upper and lower horizontal frame members (34, 36, 38, 40), forming a generally vertical door-frame mating plane.

Abstract: The invention is an electronic component device in the form of an envelope including a glass cover and a glass shell bonded together for hermetically sealing a surface acoustic filter inside the envelope. Electrical connections are provided from the filter's electrodes to the outside of the envelope by means of through holes in the cover. Each through hole has an electrode disposed around its periphery on the upper and bottom surfaces of the cover and a conductive layer disposed on the internal surface of the hole. A metal foil is formed on the bottom electrode sealing the hole and pressed downward and deformed against a filter electrode to complete a connection between the filter electrode, the metal foil, the conductor layer and the electrodes disposed around the periphery of the hole, and to hermetically seal the hole.

Abstract: An electrical assembly includes a housing containing a plurality of electrical components constituted by blocks, each block having a bus-bar and a protruding electrical connection. The electrical connections coincide substantially at the centre of the housing in a stack and are fastened together to directly connect the bus-bars. Preferably, the electrical connections are connected by a screw and bolt fastener passing through aligned apertures of the connections.

Abstract: As for an electric apparatus having a case formed of electro-magnetic wave passing-through material, in order to provide an electro-magnetic wave shielding structure being capable to effectively prevent the leakage therefrom of an electro-magnetic wave generated therein, an electro-magnetic wave reflecting layer, namely, a conductive layer is formed on an inner face of the case and further, on a surface of the conductive layer, a magnetically losing layer containing Mn--Mg--Zn group soft ferrite particles having 1 to 20 .mu.m average diameter by 70 to 90 weight % at a thickness exceeding 80 .mu.m is formed, so as to repeatedly absorb the inner generated undesired electro-magnetic wave therein through repeated reflection between the conductive layer and the absorbing layer.

Abstract: A radiation shield is fashioned from a kit having a plate of electrically conductive material with a grid of troughs cut therein. The grid is used to trace the dimensions of a portion of the electrically conductive plate needed to fashion a particular radiation shield. The troughs are cut to a sufficient depth to allow material to be snapped back and broken off by hand along the troughs. Material is bent at 90 degree angles along the troughs to form walls for a radiation shield. Thus, radiation shields in the form of various rectilinear boxes comprising a wide variety of shapes and dimensions may be fashioned from a kit according to the present invention.

Abstract: A semiconductor package includes a package body, a semiconductor chip disposed on the surface of the package body, external lead terminals disposed on two opposite side surfaces of the package body, a lid hermetically sealing and shielding the semiconductor chip in the package body, a package substrate having a metallized region on which the package body is mounted, and a metal layer disposed on the rear surface of the package body and connected to the metallized region of the package substrate with solder. The metal layer includes material having a good adhesion to the solder and has a pattern in which stripe-shaped metal portions abut two opposite side surfaces of the package body where the external lead terminals are absent, and stripe-shaped openings that abut the respective metal portions. Therefore, when the package body is soldered to the package substrate, unwanted flow of the melted solder is stopped at the openings in the metal layer.