Abstract: A power distribution box is disclosed. The power distribution box may include a housing including one or more panels. The one or more panels may define a cavity. The power distribution box may include one or more outlets coupled to one or more portions of the one or more panels of the housing. The power distribution box may include one or more output plugs configured to receive one or more power distribution whips. The one or more output plugs may be configured to couple to one or more portions of the one or more panels of the housing. The power distribution box may include one or more circuit breakers coupled to one or more portions of the one or more panels of the housing. The power distribution box may include at least one power whip coupled to an output plug of the one or more output plugs.

Abstract: A cooling device includes a frame structure housing an internal channel and an inlet port coupled to the frame structure. The inlet port is to receive a coolant fluid and to direct the coolant fluid to the internal channel. The cooling device includes one or more contactless cooling ports disposed on the frame structure and at a predetermined distance from an electronic chip. A contactless cooling port accelerates a stream of coolant fluid across a surface of the electronic chip to transfer heat from the electronic chip to the stream of coolant fluid. The cooling device includes a separator for segregating and diverging streams of coolant fluid. The cooling device includes a mounting structure secured to the frame structure, where the mounting structure is mounted to a server chassis or a server board.

Abstract: A grounding switch for grounding a high voltage cable in underground switchgear. The switch includes a solid insulation housing and a fixed electrode extending into one end of the housing and being encapsulated in the solid insulation housing. The switch also includes a ground electrode positioned at an opposite end of the housing from the fixed electrode, an air gap formed in the solid insulation housing between the fixed electrode and the ground electrode, and a movable electrode slidable positionable within the air gap to electrically connect and disconnect the fixed electrode to and from the ground electrode. An annular shielding electrode having a ridge is electrically coupled to the fixed electrode proximate the air gap, and shapes an electric field generated by the fixed electrode to be mostly confined within the solid insulation housing.

Abstract: A support bracket assembly for supporting a pair of bushing well interrupter devices provided within a transformer enclosure that encloses a transformer. The support bracket assembly includes a mounting bracket assembly rigidly secured to a parking stand on the enclosure and including a plurality of mounting bosses. The support bracket assembly further includes support brackets, a first adjustable link secured to one of the mounting bosses on the mounting assembly and a mounting boss on a support bracket, a second adjustable link secured to another one of the mounting bosses on the mounting assembly and a mounting bosses on a support bracket, and a third adjustable link secured to mounting bosses on two support bracket, where the first, second and third adjustable links form a triangular configuration.

Abstract: No consideration is given to heat transferred from a semiconductor module to a capacitor via a bus bar module. The heat generated by a semiconductor module (1) is transferred to a bus bar module (3) via a DC terminal (1A) of the semiconductor module (1). As illustrated in FIG. 4(B), the heat transferred to the bus bar module 3 is then transferred to the pressing member 5 via the annular conductor 8 and the bolt 5A. Since the pressing member 5 is in close contact with the second cooler 2B, the heat transferred to the pressing member 5 is cooled by the second cooler 2B. On the other hand, the heat transferred to the convex portion 6A of the housing 6 is transferred to the first cooler 2A via the housing 6 and cooled. As a result, in the configuration in which a capacitor (4) is connected to the semiconductor module (1) via the bus bar module (3), the heat transferred from the semiconductor module (1) to the capacitor (4) can be suppressed.

Abstract: A split enclosure apparatus for fan-less cooling may be provided. The apparatus may comprise a device and a housing. The device may comprise a plurality of components. The housing may enclose the device and may comprise a first external surface, a second external surface, and a joint between the first external surface and the second external surface. The first external surface may be dedicated to cooling a first one of the plurality of components. The second external surface may be dedicated to cooling a second one of the plurality of components. The joint between the first external surface and the second external surface may be electrically conductive and thermally resistive.

Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.

Abstract: An electrical enclosure includes a main cabinet and a modular cabinet removably secured to the main cabinet. The main cabinet includes a bus compartment that includes a busbar assembly, and the bus compartment is located between an end wall of the main cabinet and a partition opposite the end wall. The modular cabinet is comprised of interlocking compartment modules. Each compartment module interlocks with an adjacent compartment module. Each compartment module includes first and second side panels. Each side panel includes an alignment member that engages an alignment member of a respective side panel of the adjacent compartment module. Each compartment module also includes a base that extends between the first and second side panels and a terminal wall that joins the first and second side panels. The terminal walls of the interlocking compartment modules engage to form a structural wall of the modular cabinet.

Abstract: The heat dissipation assembly structure of a power includes a housing having an open upper portion, a power part having one surface supported by the housing, a printed circuit board disposed above the power part and electrically connected to the power part, and a cover member covering the upper portion of the housing and being coupled to the housing, wherein an inner surface of the cover member presses the other surface of the power part in a direction toward the housing to fixedly press the power part between the housing and the cover member.

Abstract: An electronic cooling system is disclosed. The system includes a plurality of cooling plates to extract heat from their respective heat sources. The system further includes one or more vapor separators for extracting vapor from the liquid, with each vapor separator to receive mixed phase liquid and separate the mixed phase liquid into vapor and cooling liquid. The system further includes a return unit to receive the vapors from the vapor separators through one or more vapor loops, and dissipate the received vapors to an external cooling loop. The cooling plates include a first cooling plate that receives liquid phase cooling liquid to extract heat from a first heat source and produces first mixed phase liquid. The cooling plates further include a second cooling plate that uses cooling liquid from a vapor separator to extract heat from a second heat source, produces second mixed phase liquid, and supplies the second mixed phase liquid to the return unit.

Abstract: Implementations are described for a modular power distribution unit (PDU) for a rack-mountable power tray or power shelf. The modular PDU includes a housing defining an input face and an opposing output face, and a plurality of power cables extending to the input face. The modular PDU further includes one or more second power connectors arranged at the output face, and distribution circuitry configured to distribute power from a first power bus and a second power bus to the one or more second power connectors. The modular PDU further includes one or more fasteners configured to attach the output face of the housing to the face of the power tray or power shelf, wherein the one or more second power connectors are retained in a coupled configuration with the one or more first power connectors.

Abstract: A portable blockchain mining system is disclosed comprising: a portable building; a plurality of blockchain mining processors mounted within, or a plurality of blockchain mining processor mounts located within, an interior of the portable building; an air inlet defined in the portable building; an air outlet defined in the portable building above the air inlet and oriented to direct exhaust air out of the portable building; and a cooling fan connected to convey air through the air inlet, across the plurality of blockchain mining processors and out the air outlet.

Abstract: A heat sink fastener assembly for fastening a heat sink onto a heat generating computer component. The fastener assembly includes a stud comprising at least one cam follower, and a rotatable nut defining a cam surface. A spring may be mounted to the heat generating computer component, and the spring is biased away from the heat sink. The stud is mounted to the spring and the nut is mounted to the heat sink. A clip mounted to the heat sink provides a secondary catch or attachment of the heat sink to the component.

Abstract: Systems and methods for providing an electronic cooling apparatus comprising a chassis having an internal space that is sized/shaped to receive/structurally support circuit card(s). The internal space defined by sidewalls with a channel formed therein in which a coolant is disposed. The coolant is in thermal communication with the circuit card(s) via the sidewall(s) when the circuit card(s) is(are) disposed in the chassis. A refrigerant-based cooling system is disposed in the chassis and comprises an evaporator having inlet/outlet ports coupled to the channel of the chassis to define a first closed-loop channel for the coolant within the chassis. The evaporator facilitates heat transfer from the coolant to a refrigerant flowing through a second closed-loop channel of the chassis at least partially defined by the evaporator. A pump is disposed in the chassis and configured to cause the coolant to flow through the first closed-loop channel.

Abstract: Particular embodiments described herein provide for an electronic device that includes a fan. The fan can include a center shaft, fan blades that extend from the center shaft, and a plurality of magnets on an outside portion of at least two of the fan blades, where stator coils interact with the magnets to drive the blades around the center shaft. The center shaft and fan blades are a single component from the same material. In some examples, the center shaft and fan blades were created using a metal injection molding process.

Abstract: A locking device includes: a housing intended to be mounted on an electrical switchboard between a first switching apparatus and a second switching apparatus, each of the switching apparatuses having a control lever able to move between a lower position, corresponding to an open state, and an upper position, corresponding to a closed state, a locking member able to move in rotation between: a first locking position, in which the locking member blocks the control lever of the first switching apparatus in the open position, and a second locking position, in which the locking member blocks the control lever of the second switching apparatus in the open position.

Abstract: A gas insulated apparatus includes: a grounded metal tank in which an insulating gas is enclosed; a conductor disposed in the tank, voltage being applied to the conductor; and a non-linear resistance layer disposed on at least part of an inner surface of the tank and made from an insulating material containing a particle of a non-linear resistance material, the non-linear resistance material being conductive when voltage higher than or equal to a threshold is applied. The non-linear resistance layer has a thickness that is larger than a sum of a thickness of a conductive portion and a particle diameter of the non-linear resistance material, the conductive portion being a portion of the non-linear resistance layer that is conductive when voltage higher than or equal to the threshold is applied to a metal foreign object on the non-linear resistance layer.

Abstract: Methods, systems, and apparatuses are described for transferring power. A power transfer device may be configured to securely fit in a fuse block, fuse holder, and/or the like. The power transfer device may transfer power from a source to a load connected to the fuse block, fuse holder, and/or the like, while also isolating the power to prevent the power from backfeeding to the source. The power transfer device may be used to perform testing, measurements, and/or analysis (e.g., voltage measurements, power measurements, frequency analysis, system impedance testing, etc.).

Abstract: Disclosed in the present invention is an electric switching apparatus, comprising a drawer apparatus, an electric connection apparatus, a driving mechanism, and a locking mechanism. A busbar of the breaker body at the separate position is separated from the electric connection apparatus, and the breaker body cannot be switched on. The busbar of the breaker body at the trial position is separated from the electric connection apparatus, and the breaker body can be switched on. The busbar of the breaker body at the connected but not clamped position is in touch with the electric connection apparatus, the electric connection apparatus does not clamp the busbar, and the breaker body cannot be switched on. The busbar of the breaker body at the connected and clamped position is in touch with the electric connection apparatus, the electric connection apparatus clamps the busbar, and the breaker body can be switched on.

Abstract: A switchgear device may include a frame defining an interior compartment, an electrical breaker component carried within the interior compartment, and a first optical sensor carried within the interior compartment. The switchgear device may include a grounding device coupled to the electrical breaker component and being within the interior compartment. The grounding device may include an axle extending between the interior compartment and an exterior of the frame, a linkage coupled to the axle, and a grounding switch coupled to the linkage and switching between a first open state and a second closed state. The switchgear device may include a controller coupled to the electrical breaker component, the first optical sensor, and the grounding device and configured to cause the grounding switch to switch to the second closed state based upon the first optical sensor.