Abstract: A printed circuit board includes a printed wiring board and a transmission circuit implemented on the printed wiring board and transmitting digital signals. The printed wiring board connected to the transmission circuit includes a main wiring pattern transmitting digital signals and a first wiring pattern having a connection end connected to the main wiring pattern and an open end. The printed wiring board further includes a second wiring pattern having a grounded end and an open end and extending in a direction in which the first wiring pattern extends. The second wiring pattern is disposed such that the grounded end of the second wiring pattern is disposed adjacent to the connection end or the open end of the first wiring pattern. By this, a printed circuit board capable of suppressing EMI is provided while increase in size of the printed wiring board is avoided.

Abstract: A power processing circuit includes a first portion, a second portion, a third portion, a resistor, a first coupling portion, a second coupling portion, a third coupling portion and a fourth coupling portion. The first portion, the second portion and the third portion are connected to respective external components. The first coupling portion and the third coupling portion are micro-strips symmetrical to the first portion. The second coupling portion and the fourth coupling portion are micro-strips symmetrically connected to two terminals of the resistor.

Abstract: A wide bandwidth multiplexer (MUX) is provided that performs carrier aggregation. The MUX combines at least a first LC filter that acts as a low band filter, at least a first composite filter that acts as a middle band filter, and at least one other LC or composite filter that acts as a high band filter. The wide bandwidth MUX has low insertion loss and provides sufficient attenuation at adjacent edges of adjacent pass bands to prevent overlap between adjacent pass bands.

Abstract: In an example embodiment, a waveguide device comprises: a first common waveguide; a polarizer section, the polarizer section including a conductive septum dividing the first common waveguide into a first divided waveguide portion and a second waveguide divided portion; a second waveguide coupled to the first divided waveguide portion of the polarizer section; a third waveguide coupled to the second divided waveguide portion of the polarizer section; and a dielectric insert. The dielectric insert includes a first dielectric portion partially filling the polarizer section. The conductive septum and the dielectric portion convert a signal between a polarized state in the first common waveguide and a first polarization component in the second waveguide and a second polarization component in the third waveguide.

Abstract: A feed network arrangement for generating a multi-antennae signal includes a plurality of coupler devices coupled to one another in waveguide technique, and a plurality of adjustable length of line devices. At least one of the plurality of adjustable length of line devices is coupled to at least one of the plurality of coupler devices, where the one of the plurality of adjustable length of line device is configured to calibrate an electrical length of a supply line of the at least one of the plurality of coupler devices, In addition, the plurality of coupler devices are arranged such that a plurality of inputs of the feed network arrangement are disposed on a first side of the feed network arrangement and a plurality of outputs of the feed network arrangement are disposed on a second side of the feed network arrangement.

Abstract: A semiconductor device includes a signal transmission line extending in a first direction; an outer protective line extending in a substantially identical direction as the first direction and spaced apart from the signal transmission line by a predetermined distance along a second direction which is substantially perpendicular to the first direction; and an inner protective line, disposed between the outer protective line and the signal transmission line, and intermittently extending substantially in parallel with said signal transmission line and outer protective line.

Abstract: Devices and methods for implementing an RF integrated circuit device operatively configured to provide the function of RF power splitter with programmable output phase shift are described. Configurable and adjustable phase shift units for use in such IC device are also described.

Abstract: The present invention relates to a surface acoustic wave element and a method of manufacturing the same, and more specifically, to a surface acoustic wave element and a method of manufacturing the same, the element including a piezoelectric substrate; a plurality of IDT electrodes formed on the piezoelectric substrate; a plurality of resonator electrodes formed on the piezoelectric substrate; a wiring metal layer formed as a wiring area to electrically connect the plurality of IDT electrodes and the plurality of resonator electrodes; and an insulation layer formed on the piezoelectric substrate, the plurality of IDT electrodes, the plurality of resonator electrodes and the wiring metal layer.

Abstract: A system is provided for combining multiple solid-state amplifiers using a radial combiner/divider. The system includes a coaxial input port, a coaxial output port, a first plurality of N waveguides radially disposed around a first transition, a second plurality of N waveguides radially disposed around a second transition, and a plurality of N amplifiers. A first end of each of the first plurality of waveguides is operatively connected to the coaxial input port via the first transition. A first end of each of the second plurality of waveguides is operatively connected to the coaxial output port via the second transition. A first port of each of the plurality of amplifiers is connected to a second end of one of the first plurality of waveguides and a second port of each of the plurality of amplifiers is connected to a second end of one of the second plurality of waveguides.

Abstract: A laterally coupled multi-mode monolithic filter includes: a substrate; a piezoelectric film formed on the substrate; a ground electrode formed on a first surface of the piezoelectric film; and signal electrodes formed on a second surface of the piezoelectric film and arranged in parallel to each other, the second surface being opposite to the first surface, each of the signal electrodes including a first electrode finger and a second electrode finger, wherein the first electrode finger and the second electrode finger have different electric potentials; adjacent signal electrodes of the signal electrodes are at a distance from each other, the distance being greater than a pitch of the first electrode finger and the second electrode finger.

Abstract: A tunable duplexer circuit is described, wherein the frequency response as well as bandwidth and transmission loss characteristics can be dynamically altered, providing improved performance for transceiver front-end applications. The rate of roll-off of the frequency response can be adjusted to improve performance when used in duplexer applications. A method is described where the duplexer circuit characteristics are optimized in conjunction with a specific antenna frequency response to provide additional out-of-band rejection in a communication system. Dynamic optimization of both the duplexer circuit and an active antenna system is described to provide improved out-of-band rejection when implemented in RF front-end circuits of communication systems. Other features and embodiments are described in the following detailed descriptions.

Abstract: A twist for coupling radiation between orthogonal waveguides is provided. The twist includes at least three cavities opening from at least one of a first X1-Y1 surface and a second X2-Y2 surface of a metal block. A first cavity has a first opening in a first Y-Z plane and a second opening in a second Y-Z plane offset from the first Y-Z plane by a first length. A second cavity shares the second opening with the first cavity and has a third opening in a third Y-Z plane offset from the second Y-Z plane by a second length and has at least two heights and at least two widths. A last cavity shares a next-to-last opening in a next-to-last Y-Z plane with a next-to-last cavity. The last cavity has a last opening in a last Y-Z plane offset from the next-to-last Y-Z plane by a last length.

Abstract: Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) are disclosed. In one embodiment, the tunable diplexer may be formed by providing one of either a varactor or a variable inductor in the diplexer. The variable nature of the varactor or the variable inductor allows a notch in the diplexer to be tuned so as to select a band stop to eliminate harmonics at a desired frequency as well as control the cutoff frequency of the pass band. By stacking the elements of the diplexer into three dimensions, space is conserved and a variety of varactors and inductors are able to be used.

Abstract: A power combiner/divider includes a main conductor; a ground conductor radially exterior of the main conductor; an input connector having a center conductor electrically coupled to the main conductor and having a second conductor electrically coupled to the ground conductor; a conductive cylinder including an inner cylindrical surface radially exterior of and spaced apart from the main conductor, including an outer cylindrical surface; a second ground conductor radially exterior of the outer cylindrical surface of the conductive cylinder, a gap being defined between the second ground conductor and the outer surface of the conductive cylinder; a plurality of output connectors, the output connectors having center conductors electrically coupled to the conductive cylinder and having respective second conductors electrically coupled to the second ground conductor; and means for receiving and retaining a gas inside the divider/combiner. Methods of manufacturing are also disclosed.

Abstract: A microwave/millimeter device having a narrow gap between two parallel surfaces of conducting material by using a texture or multilayer structure on one of the surfaces is disclosed. The fields are mainly present inside the gap, and not in the texture or layer structure itself, so the losses are small. The microwave/millimeter wave device further includes one or more conducting elements, such as a metallized ridge or a groove in one of the two surfaces, or a metal strip located in a multilayer structure between the two surfaces. The waves propagate along the conducting elements. At least one of the surfaces is provided with means to prohibit the waves from propagating in other directions between them than along the ridge, groove or strip. At very high frequency, the gap waveguides and gap lines may be realized inside an IC package or inside the chip itself.

Abstract: A filtering device includes at least one dielectric resonant element, which includes a dielectric block, an outer conductor, and an inner conductor, a terminal disposed in a through hole of the dielectric resonant element from a front surface, a plate-shaped circuit element electrically coupled with the at least one dielectric resonant element via the terminal, and a substrate on which the at last one dielectric resonant element and the plate-shaped circuit element are mounted. The outer conductor is disposed so as to cover the back surface besides the peripheral surface of the dielectric block. The first end surface of the dielectric block includes a first electrode-free portion that electrically isolates the inner conductor from the outer conductor, and a second electrode-free portion that electrically isolates the inner conductor from the outer conductor.

Abstract: A diplex filter having tunable inductors. Preferably the tunable inductors include pads that may each selectively receive one end of a jumper.

Abstract: The disclosure relates to a harmonic oscillator and a preparation method thereof, a filtering device and an electromagnetic wave device. The harmonic oscillator includes at least one dielectric slab and response units attached on one surface of the at least one dielectric slab, where the response units are structures manufactured by conductive material and provided with geometric patterns. According to the technical solution of the disclosure, the filtering device and the electromagnetic wave device with the harmonic oscillator are good in structure stability. Swinging of a harmonic oscillator sheet layer is low in loss. The Q value of the harmonic oscillator prepared by the disclosure is high; and loss of a resonant cavity, the filtering device and a microwave device with the harmonic oscillator is obviously reduced.

Abstract: Doherty power amplifier combiner with tunable impedance termination circuit. A signal combiner can include a balun transformer circuit having a first coil and a second coil. The first coil can be implemented between a first port and a second port. The second coil can be implemented between a third port and a fourth port. The first port and the third port can be coupled by a first capacitor. The second port and fourth port can be coupled by a second capacitor. The first port can be configured to receive a first signal. The fourth port can be configured to receive a second signal. The second port can be configured to yield a combination of the first signal and the second signal. The signal combiner can include a termination circuit that couples the third port to a ground. The termination circuit can include a tunable impedance circuit.

Abstract: Described embodiments include a surface acoustic wave device, method, and apparatus. The device includes a piezoelectric substrate and a configurable electrode assembly. The assembly includes a plurality of spaced-apart elongated electrode sub-elements electromechanically coupled with the piezoelectric substrate. The assembly includes a first signal bus crossing each electrode sub-element of the plurality of electrode sub-elements and electrically isolated therefrom. The assembly includes a first matrix of addressable switches. Each addressable switch of the first matrix configured to electrically couple a respective electrode sub-element of the plurality of electrode sub-elements with the first signal bus. The assembly includes a second signal bus crossing each electrode sub-element of the plurality of electrode sub-elements and electrically isolated therefrom. The assembly includes a second matrix of addressable switches.