Abstract: The present invention relates to heat-curing sealant compositions including at least epoxy resin, dicyanodiamide or an amine complex of a Lewis acid, polyurethane polymer (PUP) containing isocyanate groups and polyaldimine. These single component sealant compositions are characterized by a rapid skin formation and high tensile strength. Because of the short skin formation time, said compositions are optimally suitable for use as sealants in autobody work because they can be excellently layered on top of same.

Abstract: Compositions and methods for forming epoxy resin are provided, and compositions and methods for forming epoxy resin composites are provided. In one embodiment, a composite comprises an epoxy resin composition comprising an epoxy resin component comprising a glycidyl ether of an aryl substituted phenolic compound, a curing agent component, and a substrate. In one embodiment, a composite comprises an epoxy resin composition comprising an epoxy resin component and a curing agent component comprising an aryl substituted phenolic compound, and a substrate.

Abstract: Premixes suitable for the production of membrane materials are described. Products of this invention are suitable for the formation of membranes and membrane modules that may be in the form of flat sheets, tubes, or hollow fibers.

Abstract: A process comprising: a) contacting a polyhydric phenol and an epihalohydrin in the presence of a catalyst under reaction conditions to form an organic feed comprising a bishalohydrin ether; b) contacting the organic feed and an aqueous feed comprising an inorganic hydroxide with a high shear mixer to produce a first mixed feed; c) contacting the first mixed feed with a phase separator to form a first organic product comprising an epoxy resin and a first aqueous product; and d) recovering the first organic product, is disclosed.

Abstract: A hardener composition comprising: a) an amine component; and b) a glycol ether component comprising i) from 10 weight percent to 70 weight percent alkylene glycol phenyl ether; ii) from 25 weight percent to 80 weight percent dialkylene glycol phenyl ether; iii) from 5 weight percent to 20 weight percent trialkylene glycol phenyl ether, is disclosed. The hardener composition can be used in epoxy thermoset formulations.

Abstract: The masterbatch-type latent curing agent for epoxy resin comprised of (A) glycidyl ether type epoxy resin, (B) a fine particle of mixture containing (B-1) 50 to 99 mass % of adduct-modified amine obtained by reacting the glycidyl ether type epoxy resin with a polyamine compound and (B-2) 50 to 1 mass % of a phenol compound, (C) an active hydrogen compound and (D) an isocyanate compound; and a one-component curable epoxy resin composition containing the masterbatch-type latent curing agent and epoxy resin.

Abstract: A golf ball includes an inner core layer formed from a thermoset rubber composition. The inner core layer has a first outer surface Shore D hardness and an outer diameter of about 1.0 to 1.6 inches. A thermoplastic outer core layer is formed around the inner core layer, has a second outer surface Shore D hardness, and is formed from an acid copolymer of ethylene and an ?,?-unsaturated carboxylic acid, optionally including a softening monomer, such as alkyl acrylates and methacrylates; a plasticizer; and a cation source present in an amount sufficient to neutralize about 70 to 100% of the acid groups present in the material. The golf ball an inner and outer cover layers. The second outer surface Shore D hardness is greater than the first outer surface Shore D hardness.

Abstract: An epoxy resin composition having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin composition can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.

Abstract: The invention relates to a hydrophilically modified multifunctional amine AC which has more than one primary amino group per molecule, and at least one group per molecule derived from the reaction of an epoxide group with a reactive group selected from the group consisting of secondary amino groups >NH, hydroxyl groups —OH, mercaptan groups —SH, amide groups —CO—NHR, where R can be hydrogen or an alkyl group having from one to twelve carbon atoms, hydroxyester groups, and acid particularly carboxyl groups —COOH, sulphonic acid groups —SO3H, and phosphonic acid groups —PO3H2, and preferably, also moieties which are compatible with an epoxy resin, as well as a process for its preparation, and a method of use thereof.

Abstract: An epoxy grout system comprises a first epoxy resin component comprising a novolac epoxy resin, a bisphenol F epoxy resin, and a non-reactive diluent, and a second epoxy curing agent component comprising an amidoamine. The epoxy grout system has excellent chemical resistance while maintaining good installation properties. Another epoxy grout system comprises a first epoxy resin component which is resistant to a mixture of oleic acid and water, a second epoxy resin component which is less resistant to a mixture of oleic acid and water than the first component, and a third amine-containing curing agent component operable to cure both the first and second epoxy resin components. Optionally, the curing agent component can be provided as a plurality of amine-containing curing agent components of respective colors, whereby a user can select a curing agent component of a desired color for use with either the first or second epoxy resin component.

Abstract: A method for manufacturing a semiconductor device by using underfill material includes: a semiconductor chip mounting step configured to mount a semiconductor chip having a solder bump on a substrate via an underfill film including a film forming resin having a weight average molecular weight of not more than 30000 g/mol and a molecular weight distribution of not more than 2.0, an epoxy resin, and an epoxy curing agent; and a reflow step configured to solder-bond the semiconductor chip and the substrate by a reflow furnace. The film forming resin of the underfill material has a weight average molecular weight of not more than 30000 g/mol and a molecular weight distribution of not more than 2.0, and accordingly, the viscosity at the time of heat melting can be reduced, and a semiconductor chip can be mounted at a low pressure.

Abstract: An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having unsaturated hydrocarbon group, and a coupling agent (C) having reactive a double bond group.

Abstract: The present application relates to a method for preparing epoxy resins from a mixture of epoxidized phenolic compounds, wherein said epoxidized phenolic compounds are obtained by the epoxidation of natural phenolic compounds selected from the group comprising simple phenol, acid-phenol, coumarin, naphthoquinone, stillbenoid, flavonoid, isoflavanoid, anthocyanin, condensed tannin and hydrolyzable tannin.

Abstract: The present invention relates to hardeners for epoxy resins, which contain secondary aliphatic and primary aromatic amino groups. They harden surprisingly quickly together with epoxy resins even under cold and humid conditions and without blushing effects to give films with a high degree of hardness. They are especially suitable for coatings with high resistance requirements.

Abstract: The invention relates to hardeners for epoxy resin containing secondary amino groups having dialkyl amino phenyl groups. The hardeners have a surprisingly low viscosity and harden surprisingly fast together with the epoxy resins, even in moist, cold conditions, and without blushing to form films with high hardness and stability. They are suitable, in particular, for low-emission coatings.

Abstract: A thermohardenable structural adhesive material that upon curing has an elongation at break of at least 10% and has a glass transition temperature (Tg) of 80° C. or higher and is useful as a structural adhesive in automobiles to reduce the deformation of bonds particularly during accidents, the adhesive is dry to the touch at ambient temperature and can be melt processed at temperature below that at which thermohardening occurs. The adhesives are useful in applications requiring a combination of high strain to failure, glass transition temperature more than 80° C., high stiffness and high strength. This combination is of particular interest in the aerospace and automotive industries.

Abstract: The present invention relates to hardeners for epoxy resins, which contain secondary amino groups having pyridinyl groups. They harden surprisingly quickly together with epoxy resins even under cold and humid conditions and without producing blushing to give films with a high degree of hardness, the highest degrees of hardness being obtained with a surprisingly low amount of hardener required. They are especially suitable for low-emission coatings with high resistance requirements.

Abstract: The present invention provides a phosphorus-containing flame retardant epoxy resin that can constitute parts of electric or electronic equipment having low water absorptiveness and high heat resistance. The phosphorus-containing flame retardant epoxy resin is obtained by reacting an epoxy resin having at least three epoxy groups per molecule with an organophosphorus compound represented by Formula (I).

Abstract: This invention provides a heat curable resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature 100° C. to 200° C., molding pressure not more than 20 MPa, and molding time 60 to 120 sec is not more than 5 mm and the light reflectance after heat curing at a wavelength of 350 nm to 800 nm is not less than 80%.

Abstract: The invention provides a novel platform for minimal- or non-flammable polymers, which is based purely on hydrocarbon systems and does not need additives of any kind A key feature is that the hydrocarbons disclosed herein are characterized by degradation mechanisms that produce few flammable volatiles. For example, 2,4,4?,6-tetrahydroxydeoxybenzoin is employed as a multifunctional cross-linker in conjunction with bis-epoxydeoxybenzoin, affording new resins that combine excellent physical and mechanical properties with low flammability.