Abstract: An automated fiber bundle placement apparatus includes a supply device, a placement head, and an articulated robot. The articulated robot includes a head swing mechanism and a guide mechanism. The guide mechanism includes a position changing mechanism which includes a support member for supporting a tow guide, and which displaces the tow guide corresponding to a change in a position of an introduction section by a head swing mechanism.

Abstract: A robot includes: a first arm that is a horizontal multi-joint type arm provided with a first base link provided to be rotatable around a pivoting axis, a first intermediate link, and a first hand that holds a workpiece W thereon, and configured to move the first hand along a first diameter direction; a second arm that is a horizontal multi-joint type arm provided with a second base link provided to be independently rotatable from the first base link around the pivoting axis, a second intermediate link, and a second hand that holds the workpiece W thereon, and configured to move the second hand along a second diameter direction, and a pivoting device configured to pivot the first arm and the second arm together in the circumferential direction while maintaining a positional relationship of the first arm and the second arm in the circumferential direction.

Abstract: An apparatus for treating a substrate includes an index module and a treatment module that treats the substrate. The index module includes a load port on which a carrier having a plurality of substrates received therein is loaded and a transfer frame that is disposed between the treatment module and the load port and that transfers the substrate between the carrier loaded on the load port and the treatment module. The treatment module includes one or more process chambers and a transfer chamber that transfers the substrate to the process chambers. The transfer chamber includes a housing having a transfer space in which the substrate is transferred, a transfer robot that is disposed in the housing and that transfers the substrate between the process chambers, and an electrostatic pad that is provided in the transfer space and that electro-statically attracts particles in the housing.

Abstract: A receiving element for receiving and transporting a component includes: a main body. A recess in the form of an indentation into which the component is insertable is formed in the main body. In an embodiment, the recess has a shape which is adapted to a contour of the component.

Abstract: A boom mounting assembly for attachment to an agricultural machine is disclosed, which may comprise a primary frame, and a boom support frame configured to support a boom and being suspended from the primary frame to pivot in a transverse plane around a longitudinal axis of rotation provided in a pivot point. The boom support frame may comprise a first sub-frame connected to the primary frame; a second sub-frame supported by the first sub-frame in support sections provided on opposite sides of the pivot point in a transverse direction; and an actuator connected to the sub-frames and operable such that the support sections move relative to the pivot point to increase and decrease, in the transverse direction, a respective distance on opposite sides of the pivot point at the same time. Further, a method for controlling operation of a boom mounting assembly attached to an agricultural machine is provided.

Abstract: An apparatus for fabricating a semiconductor device has a housing defining a buffer chamber, a plurality of reactor ports formed in the housing for establishing interfaces with a plurality of process chambers that are to receive a wafer during a fabrication process to fabricate the semiconductor device, a wafer positioning robot positioned within the buffer chamber to transport the wafer between the plurality of process chambers through the plurality of reactor ports, a purge port formed in the housing for introducing a purge gas into the buffer chamber, a pump port formed in the housing for exhausting a portion of the purge gas from the buffer chamber, and a first flow enhancer that directs the purge gas flowing in an axial direction along a longitudinal axis of the purge port into the buffer chamber in a plurality of radial directions relative to the longitudinal axis.

Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft counter-rotatable with the first shaft. The transfer apparatus may include an eccentric hub extending at least partially through the central hub, and which is radially offset from a central axis of the central hub. The transfer apparatus may also include an end effector coupled with the eccentric hub. The end effector may include a plurality of arms having a number of arms equal to the number of substrate supports of the plurality of substrate supports.

Abstract: This invention discloses a reticle pod and gripping unit thereof. The aforementioned gripping unit comprises a gripping arm and at least two gripping modules. The gripping arm is hold and configured on the reticle pod, and each gripping module is deposed on the end of the gripping arm, passing through the reticle pod. A single gripping module comprises a case, a stopper and a spring unit. The case is configured on and in the reticle pod. The stopper is configured in the case and passes through the reticle pod. The spring unit is connected with the stopper.

Abstract: A substrate transport apparatus for transporting substrates, the substrate transport apparatus including a frame, at least one transfer arm connected to the frame, at least one end effector mounted to the at least one transfer arm and at least one substrate support pad disposed on the at least one end effector, the at least one substrate support pad has a configuration that effects increased friction force, resulting from an increased friction coefficient, in at least one predetermined direction.

Abstract: A five-degree-of-freedom parallel mechanism and a series-parallel multi-degree-of-freedom equipment having the parallel mechanism are disclosed, and can machine complex components and parts as well as large structural parts and implement multi-degree-of-freedom numerical control machining, such as offsite maintenance of large equipment. The parallel mechanism includes: a rack; a movable platform; a first chain connected with the rack by at least two revolute pairs with axes intersecting with each other perpendicularly, and connected with the movable platform by at least two revolute pairs with axes intersecting with one another perpendicularly; a second chain having the same structure as the first chain; and a third chain including a main branch chain and two auxiliary branch chains, wherein the first chain, the second chain, and the third chain are separately connected between the rack and the movable platform.

Abstract: To provide a transfer chamber capable of replacing a chemical filter without affecting an internal atmosphere, and shortening or eliminating stop time of a transfer process of a wafer (W) associated with replacement of the chemical filter. The transfer chamber transfers the wafer (W) to or from a processing device (6) by using a transfer robot (2) provided thereinside, and includes a circulation path (CL1) formed inside of a transfer chamber (1) to circulate gas, a chemical filter unit (7) provided in the midstream of the circulation path (CL1), and a connecting and disconnecting means (8) which switches connection and disconnection of the chemical filter unit (7) to and from the circulation path (CL1).

Abstract: Described herein is a technique capable of suppressing generation of particles and improving a throughput. According to one aspect of the technique, there is provided a substrate processing apparatus including: a loading chamber accommodating a boat; an elevator configured to elevate and lower the boat; a boat exchanging device configured move the boat on the elevator to a first stand-by region and a second stand-by region; a first clean air supplier facing an unloading region in the loading chamber where the boat placed on the elevator is accommodated; a second clean air supplier facing the first stand-by region; and a third clean air supplier facing the second stand-by region, wherein a flow volume ejected from the clean air suppliers are individually controlled so as to form a predetermined air flow in a range of height in which the boat exchanging device in the loading chamber is provided.

Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.

Abstract: A frame, a boom assembly, and an actuator. The boom assembly includes a first boom section having a proximal end coupled to the frame and a distal end opposite the proximal end and a second boom section pivotably coupled to the distal end of the first boom section. The actuator is reconfigurable between a locked configuration and an unlocked configuration. The actuator permits the boom assembly to move freely when the actuator is in the unlocked configuration. In the locked configuration, the actuator is positioned to couple the second boom section to the frame such that the actuator limits movement of the first boom section relative to the frame.

Abstract: An apparatus includes a base configured to receive at least one component. The apparatus also includes a handle connected to the base and extending away from the base. The apparatus further includes a clip configured to slide along at least part of the handle towards and away from the base. The clip is configured to secure the at least one component to the apparatus and to release the at least one component from the apparatus. The clip is configured, after the at least one component is secured, to be locked in order to prevent release of the at least one component from the apparatus. The handle may include a lock configured to selectively prevent movement of the clip along the handle passed the lock.

Abstract: An object is to suppress dew condensation in a carrier device. There is provided a carrier device comprising a body; a rotational part provided to be rotatable relative to the body; an arm supported on the rotational part; an end effector provided in a leading end portion of the arm and configured to hold a work; a gas supply unit configured to supply a gas to an arm-side internal space provided in an arm-side base portion of the end effector and/or in the leading end portion of the arm; and an exhaust unit provided in a body-side internal space that communicates with the arm-side internal space and configured to discharge the gas in the arm-side internal space and/or in the body-side internal space.

Abstract: A pick-and-place dispensing head comprises: a body structure having a z-axis motor attachment location and a linear track; a z-axis motor attached to the body structure at the axis motor attachment location, the z-axis motor configured to exact movement in a z-axis; a body attached to the linear track and operably connected to the z-axis motor such that the body moves along the linear track when the z-axis motor is actuated; a theta motor operably connected to the first body; a receiving location operably connected to the body; and an optical detector extending from the first body configured to detect upward z-axis movement of a received pick-and-place spindle relative to the body.

Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region, and including substrate supports and a transfer apparatus. The transfer apparatus may include a central hub having a housing, and including a first shaft and a second shaft. The housing may be coupled with the second shaft, and may define an internal housing volume. The transfer apparatus may include a plurality of arms equal to a number of substrate supports of the plurality of substrate supports. Each arm of the plurality of arms may be coupled about an exterior of the housing. The transfer apparatus may include a plurality of arm hubs disposed within the internal housing volume. Each arm hub of the plurality of arm hubs may be coupled with an arm of the plurality of arms through the housing. The arm hubs may be coupled with the first shaft of the central hub.

Abstract: Introduced is a micro-chip gripper comprising: a pin plate of which one surface is coupled to another apparatus; a hole plate of which one surface faces the other surface of the pin plate while being disposed to be spaced apart therefrom by a fixed distance, and which is driven together with the drive of the pin plate, and in which a plurality of holes making a fixed pattern are formed; pins which are inserted into the holes of the hole plate and of which one end part is supported by the pin plate; and an adhesion layer which covers the other surface of the hole plate. Other embodiments are possible.

Abstract: Disclosed are a substrate treating apparatus and a substrate transporting method for the substrate treating apparatus. Two treating blocks are arranged so as not to be stacked, and a first treating block, an ID block, and a second treating block are linearly connected horizontally. Accordingly, the number of treatment layers is increasable while a height of the substrate treating apparatus is suppressed. The first and second treating blocks are each connected to the ID block directly. This enables suppression in step of passing a substrate through a treating block without performing any treatment on the substrate, leading to prevention of decrease in throughput. In addition, a substrate buffer is placed in the middle of the two treating blocks. The two treating blocks enable transportation of substrates W with the substrate buffer. Thus, reduction in footprint of the substrate treating apparatus is obtainable.