Patents Examined by Ryan Lepisto
  • Patent number: 11561353
    Abstract: An optical circuit is provided in which electric circuit parts and optical circuit parts are integrated in a stack on a printed substrate. The optical circuit is provided with a lid having a temperature regulation function that uses a temperature control element and an optical fiber block capable of optical input and output. Temperature control of optical circuit elements can be efficiently performed by mounting electric circuit parts and optical circuit parts on a printed substrate in advance by a reflow step using OBO technology and subsequently attaching a lid that includes a temperature control element.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: January 24, 2023
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Takushi Kazama, Yuta Ueda, Hiroyuki Ishii, Koji Takeda, Hitoshi Wakita
  • Patent number: 11561388
    Abstract: A light module includes an optical element and a base on which the optical element is mounted. The optical element has an optical portion which has an optical surface; an elastic portion which is provided around the optical portion such that an annular region is formed; and a pair of support portions which is provided such that the optical portion is sandwiched in a first direction along the optical surface and in which an elastic force is applied and a distance therebetween is able to be changed in accordance with elastic deformation of the elastic portion. The base has a main surface, and a mounting region in which an opening communicating with the main surface is provided. The support portions are inserted into the opening in a state where an elastic force of the elastic portion is applied.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: January 24, 2023
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Tatsuya Sugimoto, Kyosuke Kotani, Tomofumi Suzuki, Katsumi Shibayama, Noburo Hosokawa, Nao Inoue, Masashi Ito, Yutaka Kuramoto
  • Patent number: 11561343
    Abstract: A novel polymer optical waveguide and method of manufacturing is presented herein. A digitally manufactured process is described which utilizes a micro-dispensed UV optical adhesive as the contour guiding cladding, a fused deposition modeling technology for creating a core, and a subtractive laser process to finish the two ends of the optical interconnect. The optical waveguide can be printed directly on a circuit board in some embodiments. Alternatively, using a slightly modified process including a step to bond the optical fiber to the substrate, the optical interconnect can be manufactured on a flexible substrate.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: January 24, 2023
    Assignee: University of South Florida
    Inventors: Venkat Rama Bhethanabotla, Thomas M. Weller, Roger Brandon Tipton, John Townsend Bentley, Eduardo Antonio Rojas
  • Patent number: 11561346
    Abstract: Configurations for a tunable Echelle grating are disclosed. The tunable Echelle grating may include an output waveguide centered in a waveguide array, with input waveguides on both sides of the output waveguide. A metal tuning pad may be located over the slab waveguide and may be heated to induce a temperature change in the slab waveguide. By increasing the temperature of the propagation region of the slab waveguide, the index of refraction may shift, thus causing the peak wavelength of the channel to shift. This may result in an optical component capable of multiplexing multiple light sources in an energy efficient manner while maintaining a small form factor.
    Type: Grant
    Filed: July 27, 2021
    Date of Patent: January 24, 2023
    Assignee: Apple Inc.
    Inventors: Yongming Tu, Alfredo Bismuto
  • Patent number: 11555955
    Abstract: A high backscattering optical fiber comprising a perturbed segment in which the perturbed segment reflects a relative power such that the optical fiber has an effective index of neff, a numerical aperture of NA, a scatter of Rp?r(fiber) that varies axially along the optical fiber, a total transmission loss of ?fiber, an in-band range greater than one nanometer (1 nm), and a figure of merit (FOM) in the in-band range. The FOM being defined as: FOM = R p ? r ( fiber ) ? fiber ? ( NA 2 ? n eff ) 2 .
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: January 17, 2023
    Assignee: OFS FITEL, LLC
    Inventors: Tristan Kremp, Paul S. Westbrook, Tommy Geisler
  • Patent number: 11543608
    Abstract: An optical cable is provided. The optical cable includes an outer cable body jacket and a plurality of optical fiber subunits. The optical fibers within each subunit are stranded relative to each other and are located within a thin subunit jacket. A plurality of unstranded optical fiber subunits are located within the cable jacket.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: January 3, 2023
    Assignee: CORNING RESEARCH & DEVELOPMENT CORPORATION
    Inventors: Bradley Jerome Blazer, Harold Edward Hudson, II, Christopher Mark Quinn, David Alan Seddon, Kenneth Darrell Temple, Jr.
  • Patent number: 11543598
    Abstract: An optical fiber connector includes a casing body formed with upper and lower key slots, a polarity adjusting key detachably mounted in a selected one of the key slots and engaging an adaptor, head and tail sleeves disposed respectively on front and rear ends of the casing body, and two core heads disposed between the head sleeve and the casing body. To adjust the polarity of the optical fiber connector, the optical fiber connector is detached from the adaptor and the optical fiber connector is inverted. Then, the polarity adjusting key is operated to disengage from the selected one of the key slots and engage the other one of the key slots to adjust the polarity without removal of head and tail sleeves.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: January 3, 2023
    Assignee: Gloriole Electroptic Technology Corp.
    Inventor: Hsien-Hsin Hsu
  • Patent number: 11536910
    Abstract: A cable assembly for optical monitoring is assembled by laying optical fibers into an adhesive layer on a substrate to form an optical circuit. First ends of the fibers are arranged in various groups and second ends of the fibers are arranged in various groups. Groups at a first end of the circuit are spliced to coupler input fibers and coupler output fibers. Groups at the second end of the circuit are terminated at one or more input connectors, one or more output connectors, and one or more monitoring connectors. Some cable assemblies monitor signals received at the input connectors. Other cable assemblies monitor signals received at both the input connectors and the output connectors.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: December 27, 2022
    Assignee: CommScope Technologies LLC
    Inventors: Scott C. Sievers, Jill Anne Malecha, Kristofer Bolster, Paula Lockhart
  • Patent number: 11531156
    Abstract: A multicore optical fiber comprising: a depressed index common-cladding region having a refractive index ?cc; and a plurality of core portions disposed within the depressed index common-cladding region, wherein each core portion comprises: a central axis, a core region comprising a relative refractive index ?1, an inner-cladding region encircling and directly contacting the core region comprising a relative refractive index ?2, a trench region encircling and directly contacting the inner cladding region comprising a relative refractive index ?3, and an outer-cladding region encircling and directly contacting the trench region comprising a relative refractive index ?4, wherein the refractive index of the depressed index common-cladding region ?cc is less than the refractive index of the outer-cladding region ?4, and wherein a difference between the refractive index of the depressed index common-cladding region ?cc and the refractive index of the first outer-cladding region ?4 is greater than 0.05% ?.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: December 20, 2022
    Assignee: Corning Incorporated
    Inventor: Pushkar Tandon
  • Patent number: 11520109
    Abstract: A cover for a fiber optic cable connection includes a cap portion having a first housing portion having a first housing wall, a second housing portion having a second housing wall, and a coupler portion that couples the first housing portion and the second housing portion in a closed position. The first housing wall and the second housing wall define a housing opening. A sealing assembly is received within the housing opening and has an inner surface and an outer surface. The inner surface defines a sealing opening that receives a fiber optic cable. The outer surface contacts at least one of the first housing wall or the second housing wall when the sealing assembly is received within the housing opening. The sealing assembly creates an additional seal when the first housing wall and the second housing wall compress the sealing assembly onto a union portion.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: December 6, 2022
    Assignee: PREFORMED LINE PRODUCTS CO.
    Inventors: Jonathon Randall Olszewski, John Lewis Hornsby, Benjamin Franklin Ciesielczyk
  • Patent number: 11513376
    Abstract: A electronic method, includes receiving, by a graphene structure, a SPP mode of a particular frequency. The electronic method includes receiving, by the graphene structure, a driving microwave voltage. The electronic method includes generating, by the graphene structure, an entanglement between optical and voltage fields.
    Type: Grant
    Filed: June 5, 2021
    Date of Patent: November 29, 2022
    Assignee: ABU DHABI UNIVERSITY
    Inventors: Montasir Yousof Abdallah Qasymeh, Hichem El Euch
  • Patent number: 11513288
    Abstract: In integrated optical structures (e.g., silicon-to-silicon-nitride mode converters) implemented in semiconductor-on-insulator substrates, wire waveguides whose sidewalls substantially consist of portions coinciding with crystallographic planes and do not extend laterally beyond the top surface of the wire waveguide may provide benefits in performance and/or manufacturing needs. Such wire waveguides may be manufactured, e.g., using a dry-etch of the semiconductor device layer down to the insulator layer to form a wire waveguide with exposed sidewalls, followed by a smoothing crystallographic wet etch.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: November 29, 2022
    Assignee: OpenLight Photonics, Inc.
    Inventors: Avi Feshali, John Hutchinson, Jared Bauters
  • Patent number: 11513377
    Abstract: A electronic method, includes receiving, by a graphene structure, a SPP mode of a particular frequency. The electronic method includes receiving, by the graphene structure, a driving microwave voltage. The electronic method includes generating, by the graphene structure, an entanglement between optical and voltage fields.
    Type: Grant
    Filed: June 5, 2021
    Date of Patent: November 29, 2022
    Assignee: ABU DHABI UNIVERSITY
    Inventors: Montasir Yousof Abdallah Qasymeh, Hichem El Euch
  • Patent number: 11506846
    Abstract: The present invention discloses a guide pin, which comprises a base support layer (1) and a protective layer (2). The base support layer (1) is a rod-shaped structure. The protective layer (2) tightly wraps the surface of the base support layer (1). A manufacturing method for the guide pin made of various materials is also disclosed. The guide pin manufactured by the method of the present invention is not prone to bending or deformation and has good corrosion resistance and acid/alkaline resistance properties; it is wear resistant and has of extended service life; it is easy to be processed and is low in cost.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: November 22, 2022
    Assignee: CHAOZHOU THREE-CIRCLE (GROUP) CO., LTD.
    Inventor: Xueyun Huang
  • Patent number: 11506837
    Abstract: An optical fiber includes: a central core portion; an intermediate layer formed around an outer circumference of the central core portion; a trench layer formed around an outer circumference of the intermediate layer; and a cladding portion formed around an outer circumference of the trench layer. Further, when, relative to the cladding portion, a relative refractive-index difference of the central core portion is ?1, a relative refractive-index difference of the intermediate layer is ?2, and a relative refractive-index difference of the trench layer is ?3, relationships ?1>?2>?3 and 0>?3 are satisfied and ?1 is equal to or greater than 0.34% and equal to or less than 0.40%, |?3| is equal to or less than 0.25%, and ?1×|?3| is less than 0.08%2.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: November 22, 2022
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventor: Kazunori Mukasa
  • Patent number: 11500145
    Abstract: An antifouling layer stack comprising a first layer element, a silicone layer, and a second layer element. The silicone layer is a light guide for UV radiation, and may include embedded UV light sources. The first layer element is situated on a first surface of the silicone layer, and the second layer element is situated on a second surface of the silicone layer. The first and second layer elements differ in composition from the silicone layer. The first layer element facilitates transmission of the UV radiation from the silicone layer to an external medium, and may provide protection and improve the structural integrity of the stack. The second layer element may also provide protection and structural integrity. The second layer element may be reflective, and may provide an adhesive surface for attaching the stack to a vessel.
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: November 15, 2022
    Assignee: Koninklijke Philips N.V.
    Inventors: Willem-Jan Arend deWijs, Cornelis Gerardus Visser, Michael Maria Johannes van Lierop
  • Patent number: 11500410
    Abstract: A system for parallel photonic computation, preferably including a source module, a plurality of input modulator units, an optical interference unit (OIU), and a plurality of detector banks. An OIU, preferably including one or more unitary matrix modules and optionally including a diagonal matrix module. An input modulator, which can include one or more waveguides, couplers, and/or modulator banks. A method for parallel photonic computing, preferably including encoding input vectors, performing a desired matrix operation, and receiving output values, and optionally including performing electronic computations and/or performing further optical computations based on the outputs, which can function to compute the results of a matrix operation on many different input vectors in parallel.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: November 15, 2022
    Assignee: Luminous Computing, Inc.
    Inventors: Mitchell A. Nahmias, Michael Gao
  • Patent number: 11493711
    Abstract: A hybrid multi-layered optical flexible printed circuit device, comprising: an optical flexible substrate including a first open window and a second open window with a first, a second surfaces opposite to each other; an intrinsic film including a first bonding region aligned with the first open window and a second bonding region aligned with the second open window formed on the first surface; an optical waveguide film including a first notch with a first slant surface aligned with the first bonding region, and a second notch with a second slant surface aligned with the second bonding region formed on the second surface and encompassed the first open window and the second open window; a first flexible printed circuit board formed on the optical waveguide film; and a first optoelectronic device and a second optoelectronic device mounted in the first bonding region and the second bonding region of the intrinsic film.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: November 8, 2022
    Assignee: AuthenX Inc.
    Inventors: Po-Kuan Shen, Chao-Chieh Hsu, Sheng-Fu Lin, Chun-Chiang Yen, Chiu-Lin Yu, Kai-Lun Han, Jenq-Yang Chang, Mao-Jen Wu
  • Patent number: 11493687
    Abstract: Techniques disclosed herein relate generally to photonic integrated circuits working at cryogenic temperatures. In one example, a device includes a substrate, a dielectric layer on the substrate, an optical waveguide in the dielectric layer, a superconducting circuit in the dielectric layer and coupled to the optical waveguide, and a micro-channel in the dielectric layer and adjacent to the superconducting circuit. The micro-channel is aligned with the superconducting circuit and is configured to conduct a liquid at a cryogenic temperature to locally cool the superconducting circuit.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: November 8, 2022
    Assignee: PSIQUANTUM, CORP.
    Inventor: Eric Dudley
  • Patent number: 11494461
    Abstract: Methods, devices, and systems for processing information are disclosed. An example device may comprise a metastructure comprising a plurality of physical features configured to transform an analog signal according to a kernel of an integral equation. The device may comprise one or more waveguides coupled to the metastructure and configured to recursively supply a transformed analog output signal of the metastructure to an input of the metastructure to iteratively cause one or more transformed analog signals output from the metastructure to converge to an analog signal representing a solution to the integral equation.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: November 8, 2022
    Assignee: The Trustees of the University of Pennsylvania
    Inventors: Nader Engheta, Brian Edwards, Nasim Mohammadi Estakhri, Mario Junior Mencagli