Abstract: The present invention discloses a method for the removal of a number of molecular contaminants from surfaces within a device. A purge gas containing oxygen and/or water is introduced into the interior of the device, contacting at least a portion of the interior surfaces. A contaminated purge gas is produced by transferring a portion of the contamination from the interior surfaces into the purge gas. The contaminated purge gas is removed from the device and the process is continued until the contaminant concentration in the contaminated purge gas is below a predetermined level.

Abstract: The decontamination of PCB-containing transformers to obtain treated transformers containing less than 50 parts per million (ppm) polychlorinated biphenyls (PCB) can be achieved using a method wherein the transformer is initially drained of all PCBs; then the core/coil assembly is removed. The internal surfaces of the transformer are then cleaned using a solvent. Finally, a new core/coil assembly is installed. The method is simple and can be completed within a substantially shorter period of time than methods known in the art.

Abstract: Radioactively contaminated material is cleaned by contacting the material with a decontaminating liquid comprising an aqueous solution of nitric acid containing an NOx generating agent. The NOx generating agent may be a nitrite, for example, sodium nitrite, or a ferrous metal. The material to be cleaned may comprise a plastics material contaminated with uranium or other actinides. Cleaning is effected by placing the material in a rotatable, apertured vessel in which the material is subjected to a leaching cycle by contact with the decontaminating liquid and then a washing cycle in which the material is contacted with a washing liquid.

Abstract: A method of treating headache is provided using a water soluble magnesium salt. Specifically, a method of treating a headache is provided for an individual having a serum ionized magnesium concentration of 0.44 mmoles/L to 0.53 mmoles/L and having at least one headache symptom by administering an amount of a water soluble magnesium salt sufficaent to inhibit at least one headache symptom in the individual within 24 hours and to raise the serum ionized magnesium concentration in the individual to within a normal ionized magnesium concentration range of 0.54 mmoles/L to 0.67 mmoles/L. Headache symptoms which may be inhibited include: pain, aura, photophobia, nausea, unilateral pain and phonophobia.

Abstract: In a method for cleaning a copper surface of a semiconductor wafer or article, nitrogen gas is bubbled or dissolved into a strong alkaline solution, displacing dissolved oxygen from the solution. A nitrogen gas environment is provided over the copper surface. The alkaline solution is then applied to the copper surface. The copper etch rate is greatly reduced. The method is useful in removing residual polishing slurry after a chemical-mechanical polishing step, and for removing residues left in via holes after plasma etching.

Abstract: A method of emptying vessels containing dispersions, solutions or suspensions of polymers in which during the emptying process the liquid medium also used to take up the polymers into the dispersion, solution or suspension is passed into the space within the vessel that is not filled by the solution, dispersion or suspension, wherein the liquid medium used to take up the polymers into the dispersion, solution or suspension is introduced in vapor form.

Abstract: A process for using a magnetic aquarium tank wall cleaning tool for cleaning the inner surface of an aquarium having one or more curved interior vertical corners. Magnetic cleaners for aquariums eliminate the need for reaching into the tank or manipulating a cleaner with a long handle. The magnetic tank wall cleaning tool has at least one edge which is curved. The radius of curvature is no more than the radius of curvature of the inner surface of the tank to be cleaned. The cleaner can be manipulated from one flat surface around a curved interior corner by moving the handle horizontally around the corner.

Abstract: An aerosol assisted chemical cleaning method to remove wall deposition from reaction chambers is provided. The method generates cleaning chemicals in an aerosol state, and then feeds them into the reaction chamber by a carrier gas. The cleaning chemicals interact quickly with unwanted deposits on all internal surfaces of the reaction chamber. By controlling the pressure in the closed reaction chamber, the deposits can be stripped off from the wall and fall into a waste acid collector. The acid collector can then process the waste to prevent contamination.

Abstract: A method for washing cored heads of lettuce includes placing such heads in a position with their cored holes facing downwardly toward an upwardly-directed spray of an aqueous solution, directing such a spray into, and washing the holes, then pushing the heads from that position onto a conveyor.

Abstract: A process for cleansing microorganisms from the pliant epidermal surface of a human hand which comprises brushlessly scrubbing the pliant epidermal surface of the human hand with a plurality of cleansing fluids. The cleansing fluids are oscillating sprays which are sprayed onto the epidermal surface at a frequency of 20-80 HZ and at a temperature of 40-50° C. thereby removing microorganisms present on the pliant epidermal surface.

Abstract: A method for cleaning a semiconductor wafer which includes the sequential steps of cleaning the wafer in a dilute hydrofluoric acid bath, cleaning the wafer in a first ozone bath, cleaning the wafer in a dilute hydrofluoric acid/hydrogen peroxide/hydrogen chloride bath, followed by cleaning the wafer in a second ozone bath. The method uses the dilute hydrofluoric acid/hydrogen peroxide/hydrochloric acid bath instead of the conventional DHF bath and RCA2 bath. Hence, the amount of chemicals consumed and the number of baths used by the cleaning station are lowered. In addition, ozone is passed into an overflow loath so that the highly reactive ozone can be utilized to clean the wafer without putting additional load on the cleaning station. Therefore, the cleaning operation can be carried out in a smaller cleaning station using somewhat lower temperature and lower concentration chemical solutions. The efficiency is as high as a multi-bath station, but chemicals are not wasted.

Abstract: A method for cleaning the surface of a semiconductor wafer having an organic dielectric film thereon by removing residual slurry particles adhered to the wafer surface after chemical-mechanical planarization is provided. The semiconductor is subjected to a post CMP cleaning step by applying mechanical frictional force to the surface of the wafer while concurrently applying to the wafer surface and aqueous solution having a pH of greater than 10 for a period of time sufficient to wet and clean the wafer surface, the basic aqueous solution comprised of a surfactant and a tetra alkyl quaternary ammonium hydroxide compound such as tetramethylammonium hydroxide.

Abstract: An apparatus and method that enhances removal of contaminating particles from surfaces of a non-electrostatically sensitive components that are cleaned using a carbon dioxide cleaning spray. The apparatus includes a programmable power supply that is connected to ground and to the non-electrostatically sensitive component. The surface charge of the component is determined by cleaning the surface without adding any voltage or charge bias to the component. Then the surface is reversed-biased with a voltage having the opposite polarity by a large amount using the programmable power supply. The surface is then cleaned a second time, which removes the contaminating particles that were bound to the surface by electrostatic forces generated during the first cleaning. Thus, reversing the polarity of the charge on the surface that is to be cleaned removes the strong attraction between the contaminating particles and the surface and enhances removal of the contaminating particles from the surface.

Abstract: A vial cap holder and cap piercer for holding vials of varying sizes sealed with pierceable caps, said holder comprising: a frame, a holder adjustably mounted to said frame, a plate mounted on said frame below said holder, the plate having an aperture, a cup mounted on top of said plate for receiving a pierceable cap of said vial, a retractable needle for piercing the pierceable cap of the vial and to communicate with the contents of the vial, a driver for extending and retracting said needle, and a tongue pivotally mounted to the holder, the tongue having a beveled surface for receiving the vial.

Abstract: Aqueous acidic solutions of hydrogen peroxide used for metal surface treatments suffer from an increased decomposition rate of the hydrogen peroxide, caused by the dissolution of metals such as iron, copper, or titanium. Stabilization can be achieved by employing a combination of a) hydroxybenzoic acid, preferably p-hydroxybenzoic acid; b) a hydrotropic sulphonic acid, preferably p-toluene sulphonic acid; and c) a hydrophobic alkaryl sulphonic acid, preferably dodecylbenzene sulphonic acid.

Abstract: The present invention provides a novel method (300) for cleaning sponge or porous polymeric devices, e.g., scrubbing brush. The method includes a step of providing (302) (332) a porous polymeric member, which has an outer surface and may also include inner surfaces. The member also has a plurality of impurities (e.g., ions, particles) distributed on the surface and through the member. These impurities can be introduced into the member through the manufacturing process, which is commonly "dirty" and does not provide substantially clean polymeric materials. In some embodiments, the impurities are a by-product of the manufacturing process. To clean the member, it is subjected to a wash cycle (330). The wash cycle can be performed by a washing-type machine, as well as other types of apparatus. The wash cycle can include at least one or more treatments to remove selected impurities from the member. The treatments include washes using an acid (339), a base (341), a solvent (337), and other chemicals.

Abstract: A component (10 or 12) of a flat-panel display is cleaned with a fluid having a mole-fraction dominant constituent. The cleaning operation is performed by subjecting the component to the cleaning fluid while its absolute pressure exceeds the absolute pressure at the triple point of the dominant constituent and is at least 20% of the absolute pressure value at the critical point of the dominant constituent. The temperature and pressure of the cleaning fluid are typically controlled in a direction toward the supercritical state of the dominant constituent.

Abstract: An industrial sponge device and a method of manufacturing the same. The sponge is made from a polyvinyl acetal material with a process in which the pores are formed by gas to provide an open pore structure having no fibrils. Additionally, the sponge is purified by an extracting process which includes alternating exposure of the partially cross-linked sponge to acid and oxidizing solutions. The sponge is sterilized by electron beam radiation to destroy micro organisms that can cause contamination of the final product. The resulting sponge material is formed into an industrial sponge having a cylindrical body and a plurality of projections extending from the body. The projections are tapered truncated cones having a cross-sectional radius that decreases with distance from the body. The extracting process permits residual amounts of calcium, zinc, and other elements to be 2 ppm or less; preferably 1 ppm or less.

Abstract: A method is provided for monitoring the cooking temperature of meat patties. More specifically, a method is provided for monitoring the cooking temperature of meat patties by determining the concentration of colored compounds, such as myoglobin, in meat juice.

Abstract: An apparatus for rinsing and drying semiconductor wafers. The apparatus includes side walls, end walls and a base. One embodiment of the apparatus includes a rigid side and end walls. In another embodiment of the apparatus, at least a portion of the side wall is collapsible. In yet another embodiment of the apparatus, at least a portion of the wall has a tambour configuration, facilitating bending or rolling of the wall beneath the base. The apparatus includes an assembly for injecting a rinse liquid into the chamber. The side walls, end walls, and base form a chamber configured to receive at least one semiconductor wafer. Rinse liquid can be directed into the chamber, over each semiconductor wafer therein to rinse each semiconductor wafer. At least a portion of a side wall can be lowered substantially vertically to permit rinse liquid to flow out of the chamber. The apparatus also includes an assembly for injecting a drying fluid into the chamber.