Patents Examined by Sagar Shrestha
  • Patent number: 11116088
    Abstract: According to one embodiment, in a semiconductor storage device, a conductive cover is provided on a side of the principal surface, and covers at least a part of the memory and the controller. A substrate has a first notched portion and a second notched portion in an outer edge. The conductive cover has a top plate portion, a first side plate portion, a second side plate portion, a first claw portion, and a second claw portion. The first claw portion is extended from a lower end of the first side plate in a direction intersecting with the principal surface. The first claw portion is fitted into the first notched portion. The second claw portion is extended from a lower end of the second side plate in the direction intersecting with the principal surface. The second claw portion is fitted into the second notched portion.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: September 7, 2021
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Shinya Ohashi, Katsumi Izawa
  • Patent number: 11112828
    Abstract: According to certain embodiments of the present disclosure, an electronic device and manufacturing method are disclosed. The electronic device includes: a housing including a first face, a second face, and a side member surrounding a space defined between the first face and the second face, a support member within the housing such that a side face of the support member is oriented towards an inner wall of the side member, a circuit board mounted on one face of the support member, an electrically conductive plate mounted on a second face, and a contact member mounted on the support member to electrically couple at least a portion of the side member to the circuit board, wherein the contact member includes an end portion adjacent to the plate, and an end face of the end portion includes a width smaller than a width of another portion of the contact member.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: September 7, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae Hwa Jung, Young Kyu Kim, Young Moon Park, Jae Uk Ahn, Jong Chun Wee
  • Patent number: 11102901
    Abstract: An electronics module mounting system includes a baseplate with a main wall, opposite left and right ends spaced apart from each other along an X axis, and opposite first and second spaced-apart edges extending between the left and right ends. The first and second edges are spaced apart along a Y axis. The baseplate includes a first channel that projects outwardly from the main wall and includes a mounting leg that projects outwardly from the main wall and that forms a mounting recess. A module mounting base is connected to the baseplate and includes a mounting tab located in the mounting recess. The mounting base includes a front face to receive and retain an electronics module and a rear face located opposite the front face. A channel recess is located in the rear face and extends between opposite left and right edges of the mounting base. The channel of the baseplate is located in the channel recess.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: August 24, 2021
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Douglas A. Lostoski, Adam M. Wrobel, Michael S. Baran
  • Patent number: 11096299
    Abstract: An electronic device includes a chassis, a back plate, a bracket, and a biological characteristic recognition module. The back plate is fixed to a chassis and has a first through hole. The bracket is fixed to a side of the back plate away from the chassis. The bracket has an accommodating slot recessed away from the chassis. The biological characteristic recognition module is located in the first through hole. The biological characteristic recognition module is abutted between the bracket and the chassis. The biological characteristic recognition module has at least one electronic component. The electronic component is accommodated in the accommodating slot.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: August 17, 2021
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventor: Chang-Sing Guo
  • Patent number: 11096295
    Abstract: These embodiments relates to an electric control unit including a circuit board that is provided in a housing, a damper including a frame member that is formed in correspondence with a frame of the circuit board and is combined with an upper face of the circuit board and a damping member combined with an upper face of the frame member, and a housing cover that is supported at the damping member and is combined with the housing and prevent generation of noise due to vibrations of the housing cover.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: August 17, 2021
    Assignee: MANDO CORPORATION
    Inventor: Ji Hwan Kim
  • Patent number: 11086356
    Abstract: Embodiments of the present application provide a foldable support device, including: a driving component and a support component connected with the driving component; and a rotating gear and a rack intermeshing with each other and connected with the driving component and the support component. The driving component and the support component are disposed on a non-display surface of a flexible display panel; and the flexible display panel is folded or unfolded with intermeshing rotating and relative moving of the rotating gear and the rack. By setting the rotating gear and the rack, when the flexible display panel is folding, the rotating gear rotates along the rack and drives the support component to move away from the driving component. Sufficient storage space is generated for the flexible display panel while folding to effectively prevent the display failure caused by folding of the flexible display panel.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: August 10, 2021
    Assignee: YUNGU (GU'AN) TECHNOLOGY CO., LTD.
    Inventors: Hongqi Hou, Zhaoji Zhu, Liwei Ding, Fu Liao, Kanglong Sun, Yuhua Wu
  • Patent number: 11079793
    Abstract: An adhesive member is disclosed. The adhesive member includes a first release element, a second release element and a body. The body includes a first adhesive surface and a second adhesive surface. The body also includes a first end face and a second end face. The first end face forms an acute angle with the first release element located on the body. The second end face faces the first end face and forms an obtuse angle with the second release element of the body.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: August 3, 2021
    Assignee: Lenovo (Singapore) PTE LTD
    Inventors: Fumitake Mizoguchi, Takehito Yamauchi, Yoshihisa Ishihara, Keita Ishikawa
  • Patent number: 11083076
    Abstract: An anti-vibration and heat dissipation structure for a memory socket includes a circuit board, a heat dissipation pad, and a heat dissipation shell. The circuit board includes memory sockets for insertions of memory modules. The heat dissipation pads are disposed on upper and lower surfaces of memory modules, respectively, to upwardly conduct heat, generated by the memory modules to the topmost heat dissipation pad via a stack structure of the memory modules and the heat dissipation pads. The heat dissipation shell comprises a maintenance window, and a cover board disposed on the maintenance window and having a bottom surface abutted with the topmost heat dissipation pad, to form a vertical position-limiting and anti-vibration structure to conduct heat to the heat dissipation shell via the cover board for dissipation, and easy maintenance of the memory modules via the maintenance window is also achieved.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: August 3, 2021
    Assignee: Adlink Technology Inc.
    Inventors: Chih-Liang Fang, Cheng-Chun Cheng
  • Patent number: 11083093
    Abstract: A modular electronics enclosure includes a rear frame, a first L-shaped piece and a second L-shaped piece joined to form a box-shaped shell having a floor, a ceiling, a rear wall and first and second opposed side walls that define an internal cavity. The first L-shaped piece includes a wall panel and a top panel that form the ceiling and the first side wall of the shell. The second L-shaped piece includes a wall panel and a bottom panel that form the floor and the second side wall of the shell. The rear frame forms the rear wall of the shell.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: August 3, 2021
    Assignee: CommScope Technologies LLC
    Inventors: Charles John Mann, Jiayong Wang, Qiwei Shi, Walter Mark Hendrix, Tri H. Nguyen
  • Patent number: 11074942
    Abstract: A storage system includes a chassis, a storage module, and a controller module. The storage module and the controller module are mounted to the chassis. The storage module includes a housing, a storage member, and an adapter plate. The storage member is fixed to the housing and is configured to store data. The adapter plate is fixed to the housing and is detachably connected to the storage member and the controller module.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: July 27, 2021
    Assignee: HONGFUJIN PRECISION ELECTRONICS(TIANJIN)CO., LTD.
    Inventors: Jia-Feng Lin, Chieh-Hsiang Lin, Wen-Chen Wang, Chih-Hung Kuo
  • Patent number: 11075190
    Abstract: A semiconductor device includes a printed circuit board in a peripheral portion of a housing portion of a case in which a laminated substrate is housed. A terminal block holding control terminals from which control signals are outputted to the printed circuit board is disposed over the printed circuit board. A gate electrode of a semiconductor chip and the printed circuit board are electrically connected by a wire.
    Type: Grant
    Filed: July 25, 2019
    Date of Patent: July 27, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Shin Soyano
  • Patent number: 11076513
    Abstract: A circuit module 2 comprises: a wiring structure 4; at least one electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which at least one electronic component 6a, 6b is embedded; and a metal layer 10 provided on the upper surface of the insulating resin layer 8. The surface roughness of the portion S1 directly above each electronic component on the upper surface of the insulating resin layer 8 is expressed as R1. The surface roughness of the portion S2 other than the portion directly above all the electronic components on the upper surface of the insulating resin layer 8 is expressed as R2. At least one R1 satisfies the condition: R1>R2.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: July 27, 2021
    Assignee: TDK CORPORATION
    Inventors: Shuichi Takizawa, Hironori Sato, Atsushi Yoshino, Hideki Kachi
  • Patent number: 11048304
    Abstract: Various embodiments relating to an electronic device comprising an accessory are described. An electronic device according to one embodiment comprises: a first electronic device forming a first curved surface on at least one side and including at least one first magnet on the first curved surface; a second electronic device forming a second curved surface on at least one side and including at least one second magnet on the second curved surface; and an accessory structure including third and fourth curved surfaces facing the first and second curved surfaces, and including at least one third and fourth magnets on the third and fourth curved surfaces, wherein the accessory structure may attach and detach the at least one first and second magnets and the at least one third and fourth magnets by magnetic force, may rotate the first and second curved surfaces along the third and fourth curved surfaces, and may be bent during rotation so as to mount the first electronic device at various angles.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: June 29, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Nam-Hyun Kang, Han Kim, Ik-Sang Kim, Seon-Keun Park, Ji-Su Hwang
  • Patent number: 11023016
    Abstract: The description relates to hinged devices, such as hinged computing devices and associated input devices. One example can include first and second device portions and a hinge assembly rotatably securing the first portion and the second portion through a range of orientations. This example can also include a wedge-shaped input device extending between a first end having a first thickness and a second end having a second greater thickness. In a closed orientation the first and second portions simultaneously contact the first end and the second end.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: June 1, 2021
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Young S. Kim, Scott D. Schenone, Timothy G. Escolin, Panos C. Panay
  • Patent number: 11019736
    Abstract: Disclosed is an electronic device.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: May 25, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jeong Woo, Kwonho Song, Seungki Choi, Youngsik Choi, Soyoung Lee
  • Patent number: 11013132
    Abstract: An electronic device of a novel embodiment, specifically an arm-worn electronic device used while being worn on an arm, is provided. An arm-worn secondary battery used while being worn on an arm is provided. An electronic device is provided, which includes a structure body having a curved surface as a support structure body, a flexible secondary battery including a film as an exterior body over the curved surface of the support structure body, and a display portion including a plurality of display elements between a pair of films over the secondary battery. The plurality of display elements and the secondary battery overlap with each other at least partly. It is possible to provide an electronic device which has a small maximum thickness of 1 cm or less and a light weight of 50 g or less even when an arm-worn secondary battery is provided with a display portion.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: May 18, 2021
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Masaaki Hiroki, Haruki Katagiri, Shinya Okano
  • Patent number: 10999956
    Abstract: A module includes a wiring substrate; a component; a metal pin attached to a land electrode formed at one main surface and has a first extending portion extends from the one main surface, a second extending portion that is bent and extends from one end of the first extending portion on an opposite side from the one end surface, and a third extending portion that is bent and extends from one end of the second extending portion on an opposite side from the first extending portion to approach the one main surface; a sealing resin layer that covers the one main surface, the component, and the metal pin; and a shield layer that covers a side surface of the wiring substrate, a surface of the sealing resin layer, and the upper surface and the side outer surface of the metal pin.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: May 4, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yoshihito Otsubo
  • Patent number: 10996710
    Abstract: The description relates to devices, such as computing devices having displays that can be rotated through a range of travel. The device can counter-balance the display to create a near weightless feel for the user when repositioning the display.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: May 4, 2021
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Daniel C. Park, Anthony J. Hewett, Scott J. Korn, Karsten Aagaard, Randal Joseph Kinser
  • Patent number: 10993336
    Abstract: The present disclosure relates to a user interface module for a building control system that has flexible mounting options to address mounting constraints that are often encountered in utility rooms and/or equipment panels. In some cases, the user interface module may be provided with interchangeable mounting bases from which an installer can select depending on the mounting constraints presented at a particular installation.
    Type: Grant
    Filed: September 1, 2018
    Date of Patent: April 27, 2021
    Assignee: Honeywell International Inc.
    Inventors: Cary Leen, Haitao Li, Arthur Zhang, Michael Zheng, Tonya Tang, Timo Tapio Pihlajasaari, Andrew D. Halford, Sanjoy Bhattacharjee, Derek Tai
  • Patent number: 10993342
    Abstract: The disclosure discloses an electronic device, and the electronic device includes: a housing, a waterproof structure, a functional module, and a driving member. The housing has an inner surface and an opening connected to each other. The waterproof structure has a first end surface, a second end surface, and a side wall connecting the first end surface and the second end surface. The first end surface tightly connected with the inner surface in a sealing manner. The functional module is disposed inside the waterproof structure. The driving member is located in the housing, and is configured to drive the functional module to move toward or away from the opening.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: April 27, 2021
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Chui-Hung Chen, Chia-Min Cheng, Ching-Yuan Yang, Cheng-Han Chung