Abstract: A wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited layer on its external surface. The deposition of the layer may be performed in a very low pressure environment, thus assuring the same kind of environment in the sealed chamber. The chamber may enclose at least one device such as a thermoelectric sensor, bolometer, emitter or other kind of device. The wafer-pair typically will have numerous chambers, and may be divided into chips.
Type:
Grant
Filed:
March 31, 1998
Date of Patent:
March 19, 2002
Assignee:
Honeywell International Inc.
Inventors:
R. Andrew Wood, Jeffrey A. Ridley, Robert E. Higashi