Abstract: A magnetic position and orientation determining system uses magnetic fields, desirably including uniform fields from Helmholtz coils positioned on opposite sides of a sensing volume and gradient fields generated by the same coils. By monitoring field components detected at the probes during application of these fields, the position and orientation of the probe in the field can be deduced. A representation of the probe can be superposed on a separately acquired image of the subject to show the position and orientation of the probe with respect to the subject.

Abstract: A BGA package includes a semiconductor chip, and a PCB having a board body, a plurality of circuit patterns, a plurality of signal via holes, a solder resist, and a plurality of thermal emissive vias. The thermal emissive vias are holes located beneath a chip attach area, and these holes are filled with metal having a low melting point. The metal prevents moisture from being absorbed, while effectively transferring heat. The semiconductor chip is attached to the chip attach area of the PCB and is connected to circuit patterns of the PCB with bonding wires. The bonding wires and the semiconductor chip are encapsulated to protect them from external environmental stress. Solder bumps are formed on circuit patterns of the PCB. The BGA package has advantages in that it prevents moisture from penetrating to the chip through the thermal emissive vias, and effectively transfers the heat generated by the chip to the outside.

Abstract: Busbars to be connected with a pair of terminals of a fuse are formed from one conductive plate and thus can be arranged in the same layer in an electrical connection box. First and second busbars 13, 14 to be connected with a pair of terminals 11, 12 of a fuse 10 have coplanar base plates 13a, 14a. Bent portions 13b, 14b are provided at the leading ends of the respective base plates 13a, 14a and also are coplanar. Distant side edges of the bent portions 13b, 14b are provided with folded portions 13c, 14c which are parallel with each other and with the side surfaces of the base plates 13a, 14a. Slits 13d, 14d are formed by making cuts from the upper ends of the opposite folded portions 13c, 14c, so that the pair of terminals 11, 12 of the fuse 10 can be pressed into the slits 13d 14d to connect the fuse electrically with the busbars. The first and second busbars 13, 14 are formed by punching one conductive plate and are arranged in the same layer inside a casing.

Abstract: A machine method for providing a dome switch sub-assembly used for providing a keyboard-type user input to electronic devices. A spacer layer, attached to a retaining layer, having a plurality of spacer layer openings for receiving a plurality of dome switches is placed upon a moveable machine table. The dome switches, arranged in reel form, are machine removed and placed into the spacer layer openings. A removable release liner is then attached to the spacer layer. Also a complete dome switch assembly is provided. A spacer layer, attached to a circuit board, having a plurality of dome switch openings is placed on a moveable machine table. The dome switches, arranged in reel form, are machine removed and placed into the spacer layer openings. A retaining cover is attached to the spacer layer. An overlay layer, attached to the retaining cover layer, may also be provided.

Abstract: Both ends of a plurality of parallel electrical wires are respectively connected to the connectors with pressure by a pressure-connecting and wiring machine into which the plurality of electrical wires are introduced, and the thus introduced electrical wires are sent to the electrical wire pressure-connecting section via the electrical wire cutting section. At this time, the connectors are successively fed to the electrical wire pressure-connecting section of the pressure-connecting and wiring machine in the direction parallel with the arrangement of the pressure terminals. After the electrical wires have been connected to the connector with pressure, the pressure-connected electrical wires of a predetermined length are drawn out from the pressure-connecting and wiring machine. Then the pressure-connecting and wiring machine is turned round the vertical axis by an angle of 180.degree., and the electrical wires, which have been drawn out before, are connected to the other connector with pressure and cut.

Abstract: A natural heat dissipation device for a microprocessor. The microprocessor is conventionally mounted to a printed circuit board. The printed circuit board contains a recess that is cut-out directly below the microprocessor. Heat sink material is attached to the microprocessor through the recess. The heat sink material attached to the bottom of the microprocessor may be used alone or in conjunction with a an attached metal tray or case under the printed circuit board.

Abstract: A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board. The heat conductive substrate is mounted to the PC board by applying a controlled pressure to normal surfaces of multiple portions of the substrate. Such pressure reducing the thickness and expands the area of the pressed portions locking the substrate to the PC board. An air gap occurs between the substrate and the PC board everywhere except for the pressed regions of the substrate. Such pressed regions occur along the periphery of the substrate.