Abstract: Integrated passive components in a stacked integrated circuit package are described. In one embodiment an apparatus has a substrate, a first die coupled to the substrate over the substrate, the first die including a power supply circuit coupled to the substrate to receive power, a second die having a processing core and coupled to the first die over the first die, the first die being coupled to the power supply circuit to power the processing core, a via through the first die, and a passive device formed in the via of the first die and coupled to the power supply circuit.
Type:
Grant
Filed:
January 18, 2019
Date of Patent:
June 8, 2021
Assignee:
Intel Corporation
Inventors:
Sujit Sharan, Ravindranath Mahajan, Stefan Rusu, Donald S. Gardner