Patents Examined by Smauel M. Heinrich
  • Method for producing a semiconductor modular structure
    Patent number: 5379942
    Abstract: A method for producing a semiconductor modular structure includes placing semiconductor bodies, a ceramic substrate with metallizing, and a metal base plate, in an elastomer compression mold. A heatable pressure ram with a surface being concave relative to the base plate is placed on the base plate. At least the base plate and the ceramic substrate are convexely deformed and joined with pressure exerted by the pressure ram, at a temperature above room temperature.
    Type: Grant
    Filed: November 24, 1993
    Date of Patent: January 10, 1995
    Assignee: Siemens Aktiengesellschaft
    Inventors: Reinhold Kuhnert, Herbert Schwarzbauer