Abstract: Disclosed herein is a memory cell including a memory element and a selector device. Data may be stored in both the memory element and selector device. The memory cell may be programmed by applying write pulses having different polarities and magnitudes. Different polarities of the write pulses may program different logic states into the selector device. Different magnitudes of the write pulses may program different logic states into the memory element. The memory cell may be read by read pulses all having the same polarity. The logic state of the memory cell may be detected by observing different threshold voltages when the read pulses are applied. The different threshold voltages may be responsive to the different polarities and magnitudes of the write pulses.

Abstract: A memory device and an operation method thereof are disclosed. The memory device includes a P-well region, a common source line, a ground selection line, at least one dummy ground selection line, a plurality of word lines, at least one dummy string selection line, a string selection line, at least one bit line and at least one memory string. The gates of a plurality of memory cells of the memory string are connected to the word lines. The operation method includes the following steps. Performing a read operation and applying a read voltage on the selected word line. Applying a pass voltage on other unselected word lines and the ground selection lines, etc. Before ending of the read operation, firstly decreasing voltages of the string selection line and the dummy string selection line in advance, then increasing voltage of the bit line.

Abstract: A memory system separately programs memory cells connected by a common word line to multiple sets of data states with the set of data states having higher threshold voltage data states being programmed before the set of data states having lower threshold voltage data states. The memory system also separately programs memory cells connected by an adjacent word line to the multiple sets of data states such that memory cells connected by the adjacent word line are programmed to higher data states after memory cells connected by the common word line are programmed to higher data states and prior to memory cells connected by the common word line are programmed to lower data states.

Abstract: A plurality of memory units residing in a first location of a memory device is identified, wherein the first location of the memory device corresponds to a first layer of a plurality of layers of the memory device. It is determined whether a write disturb capability associated with the first location of the memory device satisfies a threshold criterion. Responsive to determining that the write disturb capability associated with the first location of the memory device satisfies the threshold criterion, a plurality of logical addresses associated with the plurality of memory units is remapped to a second location of the memory device, wherein the second location of the memory device corresponds to a second layer of the plurality of layers of the memory device, and wherein a write disturb capability associated with the second location of the memory device does not satisfy the threshold criterion.

Abstract: A variety of applications can include devices or methods that provide read processing of data in memory cells of a memory device without predetermined read levels for the memory cells identified. A read process is provided to vary a selected access line gate voltage over time, creating a time-variate sequence where memory cell turn-on correlates with programmed threshold voltage. Total string current of data lines of a group of strings of memory cells of the memory device can be monitored during a read operation of selected memory cells of the strings to which a ramp voltage with positive slope is applied to an access line coupled to the selected memory cells. Selected values of the change of the total current with respect to time, from the monitoring of the total current, are determined. Read points to capture data are based on the determined selected values. Additional devices, systems, and methods are discussed.

Abstract: Methods, systems, and devices for memory cells for storing operational data are described. A memory device may include an array of memory cells with different sets of cells for storing data. A first set of memory cells may store data for operating the memory device, and the associated memory cells may each contain a chalcogenide storage element. A second set of memory cells may store host data. Some memory cells included in the first set may be programmed to store a first logic state and other memory cells in the first set may be left unprogrammed (and may represent a second logic state). Sense circuitry may be coupled with the array and may determine a value of data stored by the first set of memory cells.

Abstract: The present disclosure includes apparatuses, methods, and systems for multi-state programming of memory cells. An embodiment includes a memory having a plurality of memory cells, and circuitry configured to program a memory cell of the plurality of memory cells to one of four possible data states by applying a first voltage pulse to the memory cell wherein the first voltage pulse has a first polarity and a first magnitude, and applying a second voltage pulse to the memory cell wherein the second voltage pulse has a second polarity and a second magnitude, and the second voltage pulse is applied for a shorter duration than the first voltage pulse.

Abstract: A method for finding an optimum read voltage includes acquiring difference values between state bit counts of different positions. A direction for finding the optimum read voltage is determined based on the difference values. An offset for finding the optimum read voltage is determined based on correspondence between a difference value of bit count and offset. Reading is performed with the offset applied to a current read reference voltage, wherein upon read-success, the current reference voltage superimposed with the offset is the optimum read voltage, and upon read-error, new first and second positions are obtained based on the direction and the offset for finding the optimum read voltage until reading becomes successful.

Abstract: A memory device includes a plurality of planes. A method of programming the memory device includes applying a first program pulse to one or more memory cells of a first plane of the plurality of planes, verifying whether each one of the memory cells reaches a predetermined program state, and in response to a preset number of the memory cells in the first plane failing to reach the predetermined program state after the memory cells being verified for a predetermined number of times, bypassing the first plane when applying a second program pulse after the first program pulse.

Abstract: A storage device is provided that applies pulsed biasing during power-up or read recovery. The storage device includes a memory and a controller. The memory includes a block having a word line and cells coupled to the word line. The controller applies a voltage pulse to the word line during power-up or in response to a read error. The voltage pulse may include an amplitude and a pulse width that are each a function of a number of P/E cycles of the block. The controller may also perform pulsed biasing during both power-up and read recovery by applying one or more first voltage pulses to the word line during power-up and one or more second voltage pulses to the word line in response to a read error. As a result, lower bit error rates due to wider Vt margins may occur and system power may be saved over constant biasing.

Abstract: A semiconductor memory device of embodiments includes: a substrate; a memory pillar; first to sixth conductive layers provided above the substrate; first to sixth memory cells formed between the first to sixth conductive layers and the memory pillar, respectively; and a control circuit. The control circuit applies a first voltage to the first, second, a sixth conductive layer and applies a second voltage to the third, fifth conductive layer, then applies a third voltage to the first conductive layer, applies a fourth voltage to the sixth conductive layer, and applies a fifth voltage to the second conductive layer, and then applies a sixth voltage to the first conductive layer, applies a seventh voltage to the sixth conductive layer, and applies an eighth voltage lower than the fifth voltage to the second conductive layer.

Abstract: In certain aspects, a memory device includes a memory cell array having rows of memory cells, word lines respectively coupled to the rows of memory cells, and a peripheral circuit coupled to the memory cell array through the word lines. Each memory cell is configured to store a piece of N-bits data in one of 2N levels, where N is an integer greater than 1. The level corresponds to one of 2N pieces of N-bits data. The peripheral circuit is configured to program, in a first pass, a row of target memory cells, such that each target memory cell is programmed into one of K intermediate levels based on the corresponding piece of N-bits data, wherein 2N-1<K<2N. The peripheral circuit is also configured to program, in a second pass after the first pass, the row of target memory cells, such that each target memory cell is programmed into one of the 2N levels based on the corresponding piece of N-bits data.

Abstract: Methods, systems, and devices for reduced-voltage operation of a memory device are described. A memory device may operate in different operational modes based on a value of a supply voltage fir the memory device. For example, when the value of the supply voltage exceeds both a first threshold voltage and a second threshold voltage, the memory device may be operated in a normal operation mode. When the value of the supply voltage is between the first threshold voltage and the second threshold voltage, the memory device may be operated in a low voltage operation mode, which may be a reduced performance mode relative to the normal operation mode. When the value of the supply voltage is below the second threshold voltage, the memory device may be deactivated.

Abstract: In certain aspects, a method for operating a memory device is disclosed. The memory device includes a plurality of memory planes. Whether an instruction is an asynchronous multi-plane independent (AMPI) read instruction or a non-AMPI read instruction is determined. In response to the instruction being an AMPI read instruction, an AMPI read control signal is generated based on the AMPI read instruction, and the AMPI read control signal is directed to a corresponding memory plane of the memory planes. In response to the instruction being a non-AMPI read instruction, a non-AMPI read control signal is generated based on the non-AMPI read instruction, and the non-AMPI read control signal is directed to each memory plane of the memory planes.

Abstract: A first sequence of operations corresponding to an error recovery process of a memory sub-system is determined. A value corresponding to an operating characteristic of a memory sub-system is determined, the operating characteristic corresponding to execution of a first sequence of operations of an error recovery process. A determination is made that the value satisfies a condition. In response to the value satisfying the first condition, a second sequence of operations corresponding to the error recovery process is executed.

Abstract: A memory structure, includes active columns of polysilicon formed above a semiconductor substrate, each active column includes one or more vertical NOR strings, with each NOR string having thin-film storage transistors sharing a local source line and a local bit line, the local bit line is connected by one segment of a segmented global bit line to a sense amplifier provided in the semiconductor substrate.

Abstract: Apparatuses and techniques are described for obtaining a threshold voltage distribution for a set of memory cells based on a user read mode. The user read mode can be based on various factors including a coding of a page and an increasing or decreasing order of the read voltages. The read process for the Vth distribution is made to mimic the read mode which is used when the memory device is in the hands of the end user. This results in a Vth distribution which reflects the user's experience to facilitate troubleshooting. In some cases, one or more dummy read operations are performed, where the read result is discarded, prior to a read operation which is used to build the Vth distribution.

Abstract: In certain aspects, a method for operating a memory device is disclosed. The memory device includes memory planes and multiplexers (MUXs). Each MUX includes an output coupled to a respective one of the memory planes, a first input receiving a non-asynchronous multi-plane independent (AMPI) read control signal, and a second input receiving an AMPI read control signal. Whether an instruction is an AMPI read instruction or a non-AMPI read instruction is determined. In response to the instruction being an AMPI read instruction, an AMPI read control signal is generated based on the AMPI read instruction, and a corresponding MUX is controlled to enable outputting the AMPI read control signal from the second input to the corresponding memory plane.

Abstract: A non-volatile semiconductor memory device includes a memory cell array and a control circuit. A control circuit performs an erase operation providing a memory cell with a first threshold voltage level for erasing data of a memory cell, and then perform a plurality of first write operations providing a memory cell with a second threshold voltage level, the second threshold voltage level being higher than the first threshold voltage level and being positive level. When the control circuit receives a first execution instruction from outside during the first write operations, the first execution instruction being for performing first function operation except for the erase operation and the first write operations, the circuit performs the first function operation during the first write operations.

Abstract: Embodiments provide a scheme for non-parametric PV-level modeling and an optimal read threshold voltage estimation in a memory system. A controller is configured to: generate multiple optimal read threshold voltages corresponding to multiple sets of two cumulative distribution function (CDF) values, respectively; perform read operations on the cells using a plurality of read threshold voltages; generate cumulative mass function (CMF) samples based on the results of the read operations; receive first and second CDF values, selected from among a plurality of CDF values, each CDF value corresponding to each CMF sample; and estimate an optimal read threshold voltage corresponding to the first and second CDF values, among the multiple optimal read threshold voltages.