Abstract: A temperature measuring apparatus includes a releasable probe chamber for housing a thermometry probe in which the chamber is isolated from the remainder of the thermometry apparatus. Preferably, the probe chamber is releasably attached to the apparatus and causes engagement or disengagement of at least one control switch of the apparatus depending on whether a probe is being removed or inserted into the probe chamber.

Abstract: A cloud point monitoring device which includes thermal conductive surface, cooler, temperature sensor, detection volume, detection wall unit, fiber optic cables for transmitting light, lighter emitter, light detector, and a data acquisition and control unit. The cloud point monitoring device provides an instrument to accurately measure the cloud point of diesel fuel indicate the approximate level of crystallization in diesel fuel that has been chilled beyond its cloud point and indicate the approximate energy content of diesel fuel. The cloud point monitoring device design allows it to be made small enough to be mounted in a fuel system of a vehicle.

Abstract: A test apparatus and method of its use for evaluating various performance aspects of a test specimen is disclosed. A chamber within a housing contains a cold mass tank with a contact surface in contact with a first surface of a test specimen. The first surface of the test specimen is spaced from the second surface of the test specimen by a thickness. The second surface of the test specimen is maintained at a desired warm temperature. The first surface is maintained at a constant temperature by a liquid disposed within the cold mass tank. A boil-off flow rate of the gas is monitored and provided to a processor along with the temperature of the first and second surfaces of the test specimen. The processor calculates thermal insulation values of the test specimen including comparative values for heat flux and apparent thermal conductivity (k-value). The test specimen may be placed in any vacuum pressure level ranging from about 0.01 millitorr to 1,000,000 millitorr with different residual gases as desired.

Abstract: A sensor designed for measurement of conducted heat flux passing through a solid object consists of a thin film thermopile deposited on a planar substrate whose thermal properties match those of the solid object. The thermopile is protected by a thin rectangular plate made of the same material as the substrate. The sensor is imbedded in the solid object and measures the vector of heat flux along the thermopile axis with minimal distortion of the heat flow pattern. Applications include measurement of heat flux in casting molds, boiler tubes, well surveying instruments and laser weapons testing.

Abstract: The present invention is to provide a thermally-sensitive safety device for gas tubing including a main body provided with an inlet, an outlet and a gas passage communicated with said inlet and said outlet, and a thermally-sensitive control valve mounted in the gas passage. The control valve has a ball, which is normally biased by a spring to stop against a thermally-sensitive member, and a bushing with through hole in alignment with the ball. The thermally-sensitive member melts while ambient temperature is higher than the melting point thereof, whereby said ball is biased by said spring to contact against and seal the through hole of the bushing such that the gas passage is blocked off.

Abstract: A fuel freezing point monitoring device to monitor the freezing point of onboard fuel, especially aircraft fuel. The fuel freezing point monitoring device is capable of monitoring the phase transition or fluidity of the fuel to determine the freezing point of the fuel. The fuel freezing point monitoring device eliminates the freezing point assumption of onboard fuel by actually measuring the freezing point of the fuel. The pilot will have knowledge of the approximate freezing point of the composite onboard fuel and will no longer need to assume a conservative fuel freezing point value. Together with the en-route fuel temperature information provided by existing aircraft sensors, the pilot will have the information to ensure a safe flight and to operate the aircraft efficiently.

Abstract: The invention concerns a device (10) for measuring exchanges of amounts of heat in non-stationary operational conditions, including an elongated housing (11) having one measuring end (12) closed and one connecting end (13) and a central cavity (14). The central cavity (14) contains a measuring cell (15) and electrical connection members (13). The housing (11) is extended by a hollow finger (17) which contains partly at least the measuring cell (15) which consists of a sensitive heat flux measuring element (18) sandwiched between a first heat conducting component (19) and a second heat conducting component (20). The first heat conducting component (19) is in contact with at the least one surface of the said housing (11), and in the second heat conducting component (20) is insulated from the housing and constitutes a constant heat capacity.

Abstract: A current probe transformer temperature monitoring method determines an initial transformer temperature of the current probe as a function of the winding resistance of the transformer. A relative temperature of the Hall Effect device is also determined as a function of resistance change of the Hall Effect device. The initial transformer temperature and the relative Hall Effect device temperature are combined to produce a continuous transformer temperature indicative of the temperature of the transformer. The current signal to the multi-turn winding is removed when the continuous transformer temperature exceeds a threshold temperature value and a visual indication may be provided.

Abstract: A method and apparatus for monitoring a temperature on an integrated circuit that includes a thin gate oxide transistor. A temperature monitoring system that includes a thick gate oxide transistor is provided. The temperature monitoring system includes a temperature independent voltage generator, a temperature dependent voltage generator that includes a thick gate oxide transistor, and a quantifier operatively connected to the temperature independent voltage generator and temperature dependent voltage generator.

Abstract: A test wafer for use in wafer temperature prediction is prepared. The test wafer includes: first semiconductor layer formed in a crystalline state; second semiconductor layer formed in an amorphous state on the first semiconductor layer; and light absorption film formed over the second semiconductor layer. Next, the test wafer is loaded into a lamp heating system and then irradiating the test wafer with a light emitted from the lamp, thereby heating the second semiconductor layer through the light absorption film. Thereafter, a recovery rate, at which a part of the second semiconductor layer recovers from the amorphous state to the crystalline state at the interface with the first semiconductor layer, is calculated. Then, a temperature of the test wafer that has been irradiated with the light is measured according to a relationship between the recovery rate and a temperature corresponding to the recovery rate.

Abstract: Circuits and methods for generating a temperature dependent signal are described involving: generating a thermal voltage referenced positive temperature coefficient signal using a pair of transistors operating at different current densities; generating a transistor voltage referenced negative temperature coefficient signal using a transistor voltage of one of said pair of transistors; and subtracting one of said positive and negative temperature coefficient signals from the other of said signals to generate said temperature dependent signal, whereby the temperature dependence of said temperature dependent signal is greater than either of said subtracted signals.

Abstract: A temperature sensor is integrated together with an integrated circuit on a chip, the sensor delivering a temperature-dependent measuring signal or at least emitting a signal when the chip temperature falls below a specific prescribed value. For such an eventuality, the chip includes a special circuit device thereon, by which a current flow is generated through a provided structure of electrical conductors that keeps the temperature of the integrated circuit above a prescribed minimum temperature.

Abstract: A contact measurement probe for measuring a temperature of a substrate in a process environment includes a probe head having a contact surface made of a ceramic material or a polymeric material for contacting the substrate. The contact measurement probe eliminates electrical biasing effects in process environments that include an ion source, thereby providing greater accuracy and reproducibility in temperature measurement.

Abstract: An infrared camera is configured to measure a temperature distribution on a surface of at least one rotating turbine bucket. With the measured surface temperature distribution, a condition index is determined which reflects either an overall condition of a bucket or a specific location on the bucket. The condition index can be used to predict the remaining useful life of a turbine bucket, which can be used to optimize maintenance intervals and thereby reduce maintenance costs.

Abstract: A mechanism for removing probe covers from an ear thermometer includes a fastening portion, a connecting portion and a pushing portion. The fastening portion is mounted to the thermometer at a portion near the measuring probe. The connecting portion has one end connected to the fastening portion and the other end connected to the pushing portion. The pushing portion is located at rear end of the probe cover so that as the connecting portion or the pushing portion being pressed by user, the probe cover is removed from the probe.

Abstract: A temperature sensor includes a sensor tube and a sensor rod received in the sensor tube and having a thermal expansion coefficient which differs from a thermal expansion coefficient of the sensor tube. The sensor rod has one end, which is supported by a free end of the sensor tube, and another end, which forms an actuating element of a switching contact assembly. An insulating member at least partly surrounds the switching contact assembly and has an opening for passage of the sensor tube with accommodated sensor rod. Mounted to the insulating member in the area of the opening is a support plate which is connected at least indirectly to the sensor tube by a welding process such that an opening-surrounding wall portion of the insulating member is held in place.

Abstract: In a method apparatus for measuring the temperature of a semiconductor substrate during processing thereof in a processing chamber, a resonant circuit formed on the substrate surface is energized by an electromagnetic field radiation device, and disturbances in the electromagnetic field are detected to determine the resonant frequency of the resonant circuit. The temperature of the substrate is determined as a function of the resonant frequency. The substrate is moved into and out of processing chamber by a transfer arm, and the radiation device is disposed on the transfer arm or mounted on the processing chamber. Multiple resonant circuits may be provided, which are energized by movement of the transfer arm, without transferring the substrate.

Abstract: This invention is a micromachined sensor pixel structure that can be fabricated either as a discrete sensor or in array form with application to thermal sensing of radiation receive from various wavelength emitters. The transmissivity of a thermally-isolated microplatform is a sensitive function of temperature. This transmissivity is modulated by incident radiation from sources including infrared sources. The transmissivity of a micromachined structure is interrogated by means of an optical carrier. Readout is obtained by means of conventional silicon optical sensors or imagers. A multiplicity of micromachined pixels can be tailored for specific wavelengths permitting the array to operate as a multispectral imager with windows ranging from ultraviolet to millimeter wavelengths.

Abstract: A magnet is provided to a vibrating plate within a detection pipe unit and an electromagnet is placed opposite to the magnet with a slight gap therebetween. A drive circuit applies, to a coil at every predetermined measurement cycle, an alternating current at a frequency which is swept over a predetermined range centered at a resonance frequency of the vibrating plate. When the alternating current is applied, a phase comparison circuit detects a change in phase that is caused according to whether or not an object contacts the vibrating plate. A microcomputer determines presence/absence of the object based on the detected change in phase, measures the temperature based on the detected change in phase in a former half cycle of the predetermined measurement cycle and changes the swept frequency based on the result of measurement of the temperature in a latter half cycle of the predetermined cycle.

Abstract: A microwave power sensor and a method for manufacturing the same. The microwave power sensor includes a semiconductor substrate with a nitride or oxide film formed thereon. A membrane which is a portion of the nitride or oxide film is floated by removing a portion of the semiconductor substrate. First and second thermocouple groups are formed to be symmetrically spaced apart from each other on the membrane. An RF input end is formed on the nitride or oxide film. A heating resistor is formed on the membrane to be connected with the RF input end. First and second ground plates are formed on the nitride or oxide film at both sides of the RF input end. A third ground plate is formed on the nitride or oxide film to be connected with the heating resistor and electrically connected with the first and second ground plates. The first and second output terminals are formed on the semiconductor substrate to be connected with the first and second thermocouple groups, respectively.