Abstract: A component-embedded substrate includes: a plurality of insulating layers each including a wiring pattern formed on one surface; an embedded component including a connection terminal; and a plurality of vias that electrically connect the connection terminal to the wiring patterns adjacent to each other in a lamination direction. The plurality of insulating layers is laminated on the connection terminal. Each of the plurality of vias is composed of a via hole formed in the respective insulating layer of the plurality of the insulating layers and a conductive material provided in the via hole. One of the plurality of vias is a connection via directly connected to the connection terminal. Another of the plurality of vias is a first adjacent via adjacent to the connection via in the lamination direction. The first adjacent via is connected to the wiring pattern formed on a surface of a top insulating layer.

Abstract: A cord reel assembly including a single, continuous cord having stationary and retractable segments, with the stationary segment including multiple connectors and sheath covering such connectors where the connectors twist and untwist relative to the sheath in response to the retract and extension of the retractable segment.

Abstract: A coil component includes: an element body part 10; a coil 30 embedded in the element body part 10; an external electrode 50a electrically connected to the coil 30 and provided at least on a bottom face 12 of the element body part 10 along a side 13a of the bottom face 12; and an external electrode 50b electrically connected to the coil 30 and provided at least on the bottom face 12 along a side 13b, wherein the external electrode 50a has a joining part 56a physically and electrically joined to the bottom face 12, and a non-joining part faces the bottom face 12 but is positioned away from the bottom face 12 before being mounted on a circuit board, wherein the non-joining part is positioned closer to the external electrode 50b on the bottom face 12 than is the joining part 56a.

Abstract: A waterproof container is adapted for an electronic device with a touch screen. The waterproof container includes an upper component and a lower component. The upper component includes a first layer, a second layer and a third layer. The second layer is disposed between the first layer and the third layer. A second touched part of the second layer is connected to a first touched part of the first layer by a plurality of first connections. The second touched part of the second layer is connected to a third touched part of the third layer by a plurality of second connections, and the plurality of first connections and the plurality of second connections are staggered relative to each other. The lower component is connected to the upper component. An accommodating space is enclosed by the lower component and the upper component for accommodating the electronic device.

Abstract: An electrical conductor assembly for use in a power distribution assembly includes an electrical conductor and a casing covering at least a portion of the electrical conductor. A spring member is mounted to the casing and configured to apply a compressive force to the electrical conductor.

Abstract: An improved circuit board core material, and method of making the circuit board core material, is provided wherein the circuit board core material is particularly suitable for use in a circuit board. The circuit board core material comprises a laminate. The laminate comprises a prepreg layer with a first clad layer on the prepreg layer wherein the prepreg layer comprises a pocket. An electronic component is in the pocket wherein the electronic component comprises a first external termination and a second external termination. The first external termination is laminated to, and in electrical contact with, the first clad layer and said second external termination is in electrical contact with a conductor.

Abstract: Described are various configurations of high-speed via structures. Various embodiments can reduce or entirely eliminate insertion loss in high-speed signal processing environments by using impedance compensation structures that decrease a mismatch in components of a circuit. An impedance compensation structure can include a metallic structure placed near a via to lower an impedance difference between the via and a conductive pathway connected to the via.

Abstract: A multi-layer ceramic electronic component includes: a ceramic body including a main surface, an end surface, and a side surface respectively perpendicular to a first axis, a second axis, and a third axis orthogonal to one another, a top portion that connects the main surface, the end surface, and the side surface to one another, and a plurality of internal electrodes laminated in a direction of the first axis; and an end external electrode including a corner portion located on the top portion, a base portion that covers the end surface and extends from the end surface to the main surface and the side surface, and a protrusion that protrudes from the base portion in a thickness direction, the protrusion including an L-shaped main surface protrusion located on the main surface and extending in directions of the second axis and the third axis from the corner portion.

Abstract: Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.

Abstract: A device may include a frame, a first leg extending from the frame, and a second leg extending from the frame, wherein each of the first leg and the second leg is curved in a respective direction, the respective directions being different.

Abstract: A power supply unit for an aerosol inhaler includes: a power supply able to discharge power to a load for generating an aerosol from an aerosol source; a first control device and a second control device which are configured to control at least one of charging and discharging of the power supply; a circuit board on which the first control device and the second control device are provided; a first capacitor which is provided on an input side of the first control device so as to be connected in parallel with the first control device; and a second capacitor which is provided on an input side of the second control device so as to be connected in parallel with the second control device, wherein a capacity of the first capacitor is different from a capacity of the second capacitor.

Abstract: A surface mount device having features on contacts to prevent the surface mount device from tombstoning. The feature may be channel defined by the contact that helps balance a torque/force applied on each side of the surface mount device during a reflow soldering process. The feature may also be a solder mask that helps balance a torque/force applied on each side of the surface mount device during a reflow soldering process.

Abstract: A wiring substrate includes a first conductive plate, a second conductive plate, and a first insulator. A first end of an element is connected to a first main surface of the first conductive plate, and a second end of the element is connected to a first main surface of the second conductive plate. The first insulator includes a first portion and a second portion. The first portion separates the first conductive plate and the second conductive plate from each other. The second portion is continuous with the first portion, and covers at least a portion of the first main surface. The first portion includes an end portion. The end portion protrudes from the second main surface to the opposite of the first main surface or from the second main surface to the opposite of the first main surface.

Abstract: The invention relates generally to an illuminable wall socket plate for replacing existing wall socket plates in one simple installation step. The illuminable wall socket plate obtains electric current from a socket to power a light by connecting metal tabs on the back side of the illuminable wall socket plate to socket terminals, and transferring electric current from the socket terminals to a light in the wall socket plate through conductive material, in accordance with the invention described herein.

Abstract: An object is to be able to increase the force necessary for removal in a state where an elastic attaching member is attached to an attachment target member as much as possible. An elastic attaching member for attaching an attachment component to an attachment target member includes an elastic main body part formed from an elastic material and a high rigidity part formed from a material more rigid than the elastic main body part, the elastic main body part covering at least part of the attachment component, part of the high rigidity part being embedded in the elastic main body part, and another part of the high rigidity part protruding outward from at least part of the elastic main body part to form a protruding part.

Abstract: A component carrier includes a base material stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a magnet stack with a plurality of magnetic layers and at least one bonding layer, each of the at least one bonding layer bonding two respectively neighboured magnetic layers, wherein the magnet stack is embedded in the base material stack.

Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.

Abstract: A feedthrough assembly includes: a ferrule; an insulating structure; and a seal fixedly securing the insulating structure within the ferrule, the seal comprising a glass and single-phase particulate dispersed therein; wherein the glass includes: 25% to 40% B2O3; 0 to 25% CaO; 0 to 25% MgO; 0 to 25% SrO; 0 to 10% La2O3; 5% to 15% SiO2; and 10% to 20% Al2O3; wherein all percentages are mole percentages of the glass.

Abstract: A multilayer capacitor includes a capacitor body having first to sixth surfaces, including a plurality of first and second dielectric layers and a plurality of internal electrodes stacked; and first and second external electrodes. The internal electrode includes first and second internal electrodes, a first floating electrode disposed between the first and second internal electrodes on the first dielectric layer, and second and third floating electrodes disposed on the second dielectric layer. The second floating electrode overlaps a portion of the first internal electrode and a portion of the first floating electrode, and the third floating electrode overlaps a portion of the second internal electrode and a portion of the first floating electrode. a/L is 0.113 or more, in which L is a length of the capacitor body, and a is a distance between the first floating electrode and the first or second internal electrodes.

Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and a pair of external electrodes disposed on opposing ends of the capacitor body and connected to exposed portions of the internal electrodes, wherein the external electrodes respectively include a conductive layer including a connection portion formed on one end surface of the capacitor body and connected to the internal electrode and a band portion extending from the connection portion to a portion of a neighboring surface of the capacitor body, a conductive resin layer covering a corner of the connection portion of the conductive layer and having a cutout portion so that a portion of an edge of the connection portion is exposed, and a plating layer covering the conductive layer and the conductive resin layer and contacting a portion of the conductive layer due to the cutout portion.