Patents Examined by Stefan Staicovici
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Patent number: 7226559Abstract: A method for molding composite structures whereby a material stack including a core having first and second opposing sides is prepared. The preparing of the material stack includes applying a fibrous support layer on at least one of the first side and the second side of the core section, applying an adhesive layer on the support layer, and applying a thermoplastic barrier layer on the adhesive layer. The method also includes preparing a resin and a mold; placing the material stack in the mold; sealing the core; infusing the mold and material stack with resin; curing the structure; and removing the structure from the mold. In one embodiment, the method creates a composite aircraft wing panel.Type: GrantFiled: December 4, 2001Date of Patent: June 5, 2007Assignee: Toyota Motor Sales, U.S.A., Inc.Inventors: Michael K. Maxwell, Richard J. Gardiner
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Patent number: 7217335Abstract: A method of manufacturing a hearing aid preferably includes the steps of: placing a moldable material in the ear canal of a patient to cast a form; using the form to form a hollow shell with an outer surface that approximates the shape of the patient's ear canal, the shell being of a soft polymeric material providing a mounting member; mounting electronic hearing aid components to the mounting member; joining the mounting member to the hollow shell to define a mold cavity; and filling the shell with a soft polymeric material that substantially encapsulates at least one of the electronic components and bonds to the mounting member, wherein the combination of shell, electronic components and soft polymeric material define a soft structure that is compliant to ear canal movement during use.Type: GrantFiled: February 23, 2004Date of Patent: May 15, 2007Assignee: Softear Technologies, L.L.C.Inventors: Roger P. Juneau, Lynn P. Creel, Edward J. Desporte, Michael Major, Gregory R. Siegle, Kelly M. Kinler
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Patent number: 7214337Abstract: A method of constructing a skate frame for an in-line skate is provided. The method includes forming a first skin on a mold and positioning core material on the first skin so that the core material does not contact the portions of the frame that receive load from the shoe portion. The method further includes forming a second skin over the first skin such that the core material is positioned and sealed between the first and second skins. The method further includes curing the frame.Type: GrantFiled: September 19, 2003Date of Patent: May 8, 2007Assignee: K-2 CorporationInventor: Dodd H. Grande
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Patent number: 7201861Abstract: To produce a large-size item using the RTM technique, only two reservoirs (16a, 16b) are used which are alternately connected to the mould (10). When one of the reservoirs is empty, it is replaced by another reservoir full of resin while the resin contained in the other reservoir is injected into mould (10).Type: GrantFiled: January 22, 2002Date of Patent: April 10, 2007Assignee: EADS CCRInventor: Didier Filleul
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Patent number: 7198739Abstract: Preform for carbon-carbon composite part (55) comprising multiple layers of fibrous mats (51, 52, 53) wherein each mat (51, 52, 53) comprises random carbon-containing fibrous matrix (11) having polymeric binder distributed therein and wherein adjacent mats (51, 52, 53) are bound together by additional polymer binder, stitching, and interlocking tabs. Also, method of manufacturing thick multi-layer composite preform, by: providing optionally reconfigurable tool including perforated screen through which vacuum can be drawn; delivering chopped fibers (b) to the tool while drawing vacuum therethrough to form fibrous object; delivering binder (c) to the fibrous object; melting or curing the binder (d) to make a fibrous mat (51, 52, 53); assembling plurality of the fibrous mats (51, 52, 53) and additional binder into the shape of a preform (e); and heat-pressing the resulting mat assembly (f) into finished thick preform (55).Type: GrantFiled: May 25, 2004Date of Patent: April 3, 2007Assignee: Honeywell International Inc.Inventors: Mark L. La Forest, Nabil Abu Gharbieh, Raymond J. Cipra, Alan E. Fatz, Thomas H. Siegmund
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Patent number: 7198742Abstract: Presented herein is an apparatus and method for deforming a sheet material. The apparatus includes a deforming roller having a plurality of circumferential depressions and at least one cord in rotational engagement with the roller and adapted to press the material into the depressions. The method includes the steps of providing a rotating deforming roller having circumferential depressions, at least one cord aligned to fit within the depressions and at least one sheet material, and feeding the material in a first direction between the roller and cord and deforming the material by pressing it at least partially into the depressions with the cord. The deformation may include stretching or extending the material, and/or aperturing the material, and/or producing topographical shapes or surface features in the material.Type: GrantFiled: December 30, 2003Date of Patent: April 3, 2007Assignee: Kimberly-Clark Worldwide, Inc.Inventor: Robert James Gerndt
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Patent number: 7198478Abstract: A method of treating a disc plate. has the following operations of: molding a mold disc plate through an injection molding; and spinning the mold disc plate at a high spin speed. The spinning operation has at least one of the following two sub-operations of: reducing a warp of the mold disc plate with a centrifugal force caused during the spinning operation, and reducing a temperature of the mold disc plate during the spinning operation. Moreover, an apparatus of treating a disc plate has: a conveyer for conveying a mold disc plate obtained through an injection molding; a disc bench for receiving the mold disc plate conveyed with the conveyer; and a spin driver for spinning the disc bench when a temperature of the mold disc plate is higher than 90° C., to thereby spin the mold disc plate.Type: GrantFiled: May 17, 2004Date of Patent: April 3, 2007Assignee: Origin Electric Company, LimitedInventors: Takayuki Suzuki, Masahiro Nakamura, Hideo Kobayashi, Shinichi Shinohara
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Patent number: 7186361Abstract: In a continuous molding apparatus equipped with a long core 10 having a curvature disposed on a plane, a release film supplied from a lower release film feeder 20 is sent onto the core 10, and prepreg sheets supplied from a prepreg sheet feeder 30 are laminated thereon and preformed. A release film supplied from a release film feeder 40 is disposed on top of the laminated body, before the body is sent into a hot press 50. A puller 60 moves the laminated body without loading tension thereto. The laminated body enters a postcure device 70 in which thermosetting of the material is completed.Type: GrantFiled: November 19, 2003Date of Patent: March 6, 2007Assignee: Jamco CorporationInventors: Toru Kasai, Makoto Okamoto, Shuntaro Kuriyama
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Patent number: 7182902Abstract: A method for making crayons is provided. The method employs an apparatus which includes a base that houses a heating component, a melt pan disposed to absorb heat from the heating component, a mold, and a cover. The melt pan receives crayon material and contains it as the heating component increases the temperature, causing the crayon material to liquefy. The liquefied crayon material can then be drained by the user of the device, into a mold with crayon-shaped cavities. A timer and a cover prevents access to the melt pan and the mold during particular operating conditions of the apparatus.Type: GrantFiled: April 25, 2005Date of Patent: February 27, 2007Assignee: Binney & Smith Inc.Inventor: David A. Cziraky
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Patent number: 7182899Abstract: A manufacturing method for manufacturing ceramic electronic components, includes steps of forming a stack body by stacking ceramic green sheets and conductive layers on top of each other, punching a frame into the stack body and holding the frame in the stack body, locating a pressing force applying member inside the frame and, while the frame is held in the stack body, applying a pressing force to a portion of the stack body located inside the frame by causing the pressing force applying member located inside the frame to press against the portion of the stack body located inside the frame, to thereby form a high-density structure inside the frame while preventing the high-density structure from deforming outwardly beyond the frame. The stack body can be heated to reduce the required pressing force, and an elastic member may be provided to make the pressing force uniform.Type: GrantFiled: September 18, 2002Date of Patent: February 27, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shin Tanii, Yoshiya Sakaguchi, Mitsuhiro Yamazaki, Toru Kitamachi
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Patent number: 7179407Abstract: A microcapsule composition comprising a core material in a matrix of polymorphic shell material, releases said core material in an aqueous environment in accordance with zero order linear release profile. A preferred composition comprises a core material having a degree of water solubility entrapped in a beta crystalline matrix of water insoluble shell material which matrix may, optionally, be surrounded by a contiguous core material-free layer of water insoluble shell material. Also disclosed is a process for the preparation of microcapsules comprising subjecting a flowable mixture of core material and a first amount of water insoluble shell material to a pressure force to form a pressure-treated mixture, and passing said pressure-treated mixture through a spray nozzle into a chilling zone to form a solidified composition.Type: GrantFiled: February 24, 2003Date of Patent: February 20, 2007Assignee: Verion Inc.Inventors: Farid Vaghefi, Jeffry Lee, Vijendra Nalamothu
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Patent number: 7172721Abstract: The invention provides a novel thermoplastic molding process useful in the manufacture of hollow, deformable thermoplastic articles such as hollow doll heads. In the process of the instant invention, a parison is formed at a first injection station and is transferred to a blow mold station. At the blow mold station, the parison is transformed into a hollow, deformable thermoplastic article through application of a vacuum and gas injection. Articles made by the process of the instant invention have a highly realistic appearance and texture.Type: GrantFiled: July 14, 2003Date of Patent: February 6, 2007Assignee: J.T. Labs, Ltd.Inventor: Tit Shing Wong
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Patent number: 7169343Abstract: A machine and method for moulding a composite of complex nodal structure includes laying down under CNC a reinforcement (38) of constant cross-section repeatedly into and along channels (26) of a mold (24) and through nodes of the structure, closing the mold, impregnating it with resin and curing the resin.Type: GrantFiled: August 24, 2000Date of Patent: January 30, 2007Assignee: Coretex Structures LimitedInventors: Andrew Mills, Steven Cousins, Lee Bateup, Robert Backhouse
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Patent number: 7160498Abstract: A flexible molding component used with a base mold improves on existing methods of forming fiber reinforced composite parts. The molding component is formed of a flexible body structure having an interfacing surface and a perimeter region including a perimeter seal configured for sealing engagement with the base mold. Resin and vacuum distribution channels are formed in the interfacing surface to deliver resin to a fiber lay up disposed on the base mold and draw the resin across and through the lay up, respectively, to properly mix the resin/fiber combination which forms the desired part. Application of the vacuum causes the perimeter seal of the flexible body structure to sealingly engage with the base mold to enclose materials between the body structure and the mold, as well as causing the interfacing surface to draw against the resin/fiber combination and the mold to shape the combination into the desired part.Type: GrantFiled: March 8, 2004Date of Patent: January 9, 2007Assignee: Tracker Marine, L.L.C.Inventor: Robert F. Mataya
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Patent number: 7157038Abstract: Patterns with feature sizes of less than 50 microns are rapidly formed directly in semiconductors, particularly silicon, GaAs, indium phosphide, or single crystalline sapphire, using ultraviolet laser ablation. These patterns include very high aspect ratio cylindrical through-hole openings for integrated circuit connections; singulation of processed die contained on semiconductor wafers; and microtab cutting to separate microcircuit workpieces from a parent semiconductor wafer. Laser output pulses (32) from a diode-pumped, Q-switched frequency-tripled Nd:YAG, Nd:YVO4, or Nd:YLF is directed to the workpiece (12) with high speed precision using a compound beam positioner. The optical system produces a Gaussian spot size, or top hat beam profile, of about 10 microns. The pulse energy used for high-speed ablative processing of semiconductors using this focused spot size is greater than 200 ?J per pulse at pulse repetition frequencies greater than 5 kHz and preferably above 15 kHz.Type: GrantFiled: December 14, 2001Date of Patent: January 2, 2007Assignee: Electro Scientific Industries, Inc.Inventors: Brian W. Baird, Michael J. Wolfe, Richard S. Harris, Kevin P. Fahey, Lian-Cheng Zou, Thomas R. McNeil
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Patent number: 7153461Abstract: A method for manufacturing adhesive tape that pattern and mark are easily formed thereon which includes the steps of placing a felted surface of a felt portion on the bearing portion of a lower mold, alter closing the upper mold, injecting a plastic material via high pressure to merge to the back side of the felted surface, thereby the plastic board can be integrally combined wit the back side of the felted surface to obtain the best combined strength. The plastic board can be formed with specific patterns or marks as desired, such that the adhesive tape can have a hard strip to make it easier for the user to detach, even if the user is wearing heavy gloves. In addition, a logo or mark can be formed on the adhesive tape to enhance the aesthetic effect.Type: GrantFiled: May 26, 2004Date of Patent: December 26, 2006Assignee: Universal Trim Supply Co., Ltd.Inventor: Shih-Sheng Yang
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Patent number: 7150846Abstract: The invention relates to a method of fabricating a bipolar plate for fuel cell stacks, wherein the bipolar plate includes a circumferential frame made of an electrically non-conductive material and further includes an inner bipolar plate region which is enclosed by the frame, is made of the electrically non-conductive material and comprises channels for gases and, if required, for coolants, said method comprising the following procedural steps: A) Inserting an electrically conductive fabric into a tool for fabricating the bipolar plate, B) Introducing the electrically non-conductive material into the tool in order to form the frame and the inner bipolar plate region (3), the electrically non-conductive material extending through the fabric, C) Removing a molded bipolar plate from the tool, and D) Bending back the fabric on both sides which extends beyond the inner bipolar plate region so as to cause the fabric to cover the inner bipolar plate region made of the non-conductive material.Type: GrantFiled: December 22, 2003Date of Patent: December 19, 2006Assignee: BASF AktiengesellschaftInventors: Willi Bartholomeyzik, Gerhard Bohrmann
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Patent number: 7147818Abstract: A vacuum assisted resin transfer molding (VARTM) process wherein a preform, release film, distribution medium layer, resin inlet(s), vacuum outlet(s), and vacuum bag(s) are positioned on a mold. After the resin has fully impregnated the preform by a vacuum process, the resin feed source is closed and a vacuum crossover line is opened. The resin inlet(s) are then used as a vacuum source to continue the process of removal of the excess resin. Further, secondary vacuum outlets may be placed on the preform to aid in the removal of excess resin after resin impregnation. This imposes a uniform vacuum pressure across the preform to improve the structural characteristics such as the fiber volume fraction and the compaction of the wetted preform over the conventional VARTM process.Type: GrantFiled: May 16, 2002Date of Patent: December 12, 2006Assignee: The United States of America as represented by the Secretary of the ArmyInventors: Elias J. Rigas, Thomas J. Mulkern
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Patent number: 7144538Abstract: A method for forming a direct chip attach device (1) includes attaching an electronic chip (3) to a lead frame structure (2), which includes a flag (18). Next, conductive studs (22) are attached to bond pads (13) on electronic chip (3) and flag (18) to form a sub-assembly (24). Sub-assembly (24) is then placed in a molding apparatus (27,47), which includes a first plate (29,49) and second plate (31,51). Second plate (31,51) includes a cavity (32,52) for receiving electronic chip (3) and flag (18), and pins (36,56). During a molding step, pins (36,56) contact conductive studs (22) to prevent encapsulating material (4) from covering studs (22). This forms openings (6) to receive solder balls (9) during a subsequent processing step.Type: GrantFiled: June 26, 2003Date of Patent: December 5, 2006Assignee: Semiconductor Components Industries, LLCInventors: Yeu Wen Lee, Chuan Kiak Ng, Guan Keng Quah
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Patent number: 7144539Abstract: An imprint process comprises the step of aligning a substrate, supported on a first support member, with a template, supported on a second support member. The substrate has at least one essentially plane surface provided with a moldable film. The template has at least one essentially plane surface provided with a relief pattern. The relief pattern is adapted to interact with the moldable film. The process further comprises the step of arranging a sealing gasket between the template and the second support member, such that a pressure cavity is defined by the second support member, the template and the sealing gasket. The process also comprises the step of applying a static gas pressure to the pressure cavity, in order to provide a pressure between the template and the substrate. The pressure is sufficient to form a pattern in the moldable film. An imprint device is also disclosed.Type: GrantFiled: April 4, 2002Date of Patent: December 5, 2006Assignee: Obducat ABInventor: Lennart Olsson