Abstract: A frequency variable filter includes variable resonators aligned in a predetermined direction, a coupling part configured to couple the adjacent variable resonators, and a coupling variable dielectric. The variable resonator includes a resonator and a frequency variable dielectric disposed in a movable state relative to the resonator, and is configured to be able to change a resonance frequency according to a position of the frequency variable dielectric with respect to the resonator. This applies to aligned variable resonators other than this variable resonator. The coupling variable dielectric is disposed in a movable state with respect to the coupling part and configured to adjust a coupling coefficient according to an amount of insertion into the coupling part. The coupling variable dielectric is disposed so that a movable surface of the coupling variable dielectric is on the same plane as a movable surface of the frequency variable dielectric.

Abstract: A high frequency termination for converting a high frequency electrical signal of a circuit into heat. The high frequency termination includes a substrate. The high frequency termination also includes a spiral resistor formed on the substrate and having a first end and a second end. The high frequency termination also includes a conductive pad electrically coupled to the first end of the spiral resistor. The high frequency termination also includes a contact electrically coupled to the conductive pad and configured to connect to the circuit.

Abstract: A directional coupler (10) includes a main line (20), a sub-line (40), and a variable capacitor (60). At least part of the sub-line (40) is disposed along the main line (20). The variable capacitor (60) is connected between the main line (20) and the sub-line (40). The directional coupler (10) achieves a stable degree of coupling between the main line (20) and the sub-line (40).

Abstract: A high frequency, stripline filter may have a bottom surface for mounting to a mounting surface. The filter may include a monolithic base substrate having a top surface and a plurality of thin-film microstrips, including a first thin-film microstrip and a second thin-film microstrip, formed over the top surface of the substrate. Each of the plurality of thin-film microstrips may have a first arm, a second arm parallel to the first arm, and a base portion connected with the first and second arms. A port may be exposed along the bottom surface of the filter. A conductive path may include a via formed in the substrate. The conductive path may electrically connect the first thin-film microstrip with the port on the bottom surface of the filter. The filter may exhibit an insertion loss that is greater than ?3.5 dB at a frequency that is greater than about 15 GHz.

Abstract: A load-pull test system uses controller, interface, calibration method and at least one low profile, two-probe, slide screw impedance tuner; the tuner probes share the same slabline; they are inserted anti-diametrical at fixed depth (distance from the center conductor) from both sides into the channel and move only horizontally along the slabline. The tuner does not have adjustable high precision vertical axes controlling the penetration of the probes and its low profile is optimized for on-wafer operations. The carriages holding the probes are moved at high speed along the slabline using linear electric actuators. An efficient de-embedding calibration method serves speeding up additionally the measurement procedure.

Abstract: Antenna waveguide transitions for solid state power amplifiers (SSPAs) are disclosed. An SSPA includes a waveguide channel that is configured to propagate an input signal, such as an electromagnetic signal, from an input port to a solid state amplifier for amplification. The waveguide channel is further configured to propagate an amplified signal from the solid state amplifier to an output port. Waveguide transitions to and from the solid state amplifier are bandwidth matched to the waveguide channel. Additionally, the waveguide transitions may be thermally coupled to the waveguide channel. The waveguide transitions may include antenna structures that have a signal conductor and a ground conductor. In this manner, the SSPA may have improved broadband coupling as well as improved thermal dissipation for heat generated by the solid state amplifier.

Abstract: A Docsis-MoCA coupled line directional coupler includes an input port, an output port, a coupled port, and a termination port. A first track connects the input port to the output port and a second track, which may be substantially parallel to the first track, connects the termination port to the coupled port. The first track and the second track are configured to form a variable coupling length so as to control, for instance, an isolation level between the output port and the coupled port to be less than a predetermined isolation level in a MoCA frequency band.

Abstract: A resonator for a filter includes a resonator housing, in which a resonator space is formed. The resonator further includes a dielectric arrangement arranged in the resonator space including a first dielectric element and a second dielectric element, the first dielectric element and the second dielectric element being separated from one another in such a way that a gap is formed between them. Both a first thermal expansion coefficient of the first dielectric element and a second thermal expansion coefficient of the second dielectric element are less than a thermal expansion coefficient of the resonator housing. A temperature-related variation of the resonant frequency of the resonator can therefore be compensated for.

Abstract: A ring resonator based T-shaped duplexer for use in communication systems, the T-shaped duplexer comprising a T-shaped microstrip duplexer body having a first rectangular-shaped body section and a second rectangular-shaped body section that extends from the first-rectangular shaped section in a perpendicular position relative to the first rectangular-shaped section, three connection ports including a first connection port disposed at an open end of the second rectangular-shaped body section, a second connection port disposed at one end of the first rectangular-shaped body section, and a third connection port disposed at another end of the first rectangular-shaped body section, and two bandpass filters, each bandpass filter comprising a ring resonator structure having a circular shape, an outer edge of the ring resonator structure being connected to the first rectangular-shaped body section of the T-shaped microstrip duplexer body, wherein each of the two bandpass filters creates an Electromagnetically Induced

Abstract: Techniques for facilitating reduced thermal resistance attenuator on high-thermal conductivity substrates for quantum applications are provided. A device can comprise a substrate that provides a thermal conductivity level that is more than a defined thermal conductivity level. The device can also comprise one or more grooved transmission lines formed in the substrate. The one or more grooved transmission lines can comprise a powder substance. Further, the device can comprise one or more copper heat sinks formed in the substrate. The one or more copper heat sinks can provide a ground connection. Further, the one or more copper heat sinks can be formed adjacent to the one or more grooved transmission lines.

Abstract: The present disclosure provides a dual-band transformer structure, which is suitable for at least two frequencies. The dual-band transformer structure includes a metal layer, a first transmission line, a second transmission line, and a third transmission line. The first transmission line and the second transmission line are disposed on the metal layer. A first end of the second transmission line is coupled to a second end of the first transmission line. A second end of the second transmission line is aligned with an edge of the metal layer, and a first end of the third transmission line is coupled to the second end of the second transmission line. The third transmission line extends away from the edge.

Abstract: A symmetric, multi-layer, three-way power divider that is equally balanced, with resistors placed between all combinations of legs. This three-way power divider is specifically designed to be used in millimeter wave applications (e.g., 5G in the 20 GHz-40 GHz range for both dual and single polarization), specifically in designs where a common signal is distributed to a multiple of three elements. This three-way power divider also can be useful for addressing space constraints in 5G applications, e.g., due to routing limitations.

Abstract: There are disclosed acoustic filters and radios incorporating the acoustic filters. A filter includes a first filter port, a second filter port, and n sub-filters, where n is an integer greater than one. Each sub-filter has a first sub-filter port connected to the first filter port and a second sub-filter port connected to the second filter port. A first acoustic resonator is connected from the first filter port to ground, and a second acoustic resonator is connected from the second filter port to ground. The first and second acoustic resonators are configured to create respective transmission zeros adjacent to a lower edge of a passband of the filter.

Abstract: Radio frequency filters. A radio frequency filter includes a substrate attached to a piezoelectric plate, portions of the piezoelectric plate forming a plurality of diaphragms spanning respective cavities in the substrate. A conductor pattern formed on the piezoelectric plate includes a plurality of interdigital transducers (IDTs) of a respective plurality of resonators, interleaved fingers of each IDT disposed on a respective diaphragm of the plurality of diaphragms. The conductor pattern connects the plurality of resonators in a matrix filter circuit including a first sub-filter and a second sub-filter, each sub-filter comprising two or more resonators from the plurality of resonators.

Abstract: A balun and a method for manufacturing the same are disclosed. According to an embodiment, the balun comprises a substrate, and a first and a second coplanar waveguide (CPW) couplers which are disposed on the substrate and cascaded with each other. Each CPW coupler comprises two first ground planes disposed on a first side of the substrate, a first microstrip line and at least two second microstrip lines which are disposed on the first side of the substrate between the two first ground planes, and at least one third microstrip line that is disposed on an opposite side of the substrate. The first microstrip line and the at least two second microstrip lines can be coupled with each other by electromagnetic coupling. The at least one third microstrip line electrically connects the at least two second microstrip lines with each other by via-holes.

Abstract: A signal transmission device, including a RF processing circuit and a cable connecting circuit including a first choke inductor, a first and second bypass capacitors, and a first coupling capacitor, is provided. One end of the first choke inductor is coupled to a transceiver end of a RF transceiver and the other end is coupled to a first control end of a RF antenna controller. The transceiver end is coupled to a first conductor. The first bypass capacitor is coupled between the other end and a digital ground terminal. The first coupling capacitor is coupled between the digital ground terminal and a RF ground terminal. The second conductor is coupled to the RF ground terminal and a second control terminal of the RF antenna controller at a second connecting end of a RF cable. The second bypass capacitor is coupled between the second control terminal and the digital ground terminal.

Abstract: A MoCA splitter device may include an input port, a first output port and a second output port, a first transmission line configured to connect the input port to the first output port, a second transmission line configured to connect the input port to the first output port, a first isolation element configured to connect the first transmission line to the second transmission line, a second isolation element configured to connecting the first transmission line to the second transmission line. The first isolation element and the second isolation element are configured to provide an isolation level between the first output port and the second output port that is less than a predetermined isolation level of about less than 16 dB in a MoCA frequency band.

Abstract: In one embodiment, a method, a method of manufacturing a semiconductor is disclosed. A monitored semiconductor manufacturing system (monitored system) is operated over a period of time, the monitored system comprising an impedance matching network coupled between a radio frequency (RF) source and a plasma chamber. First values for a parameter of the monitored system are received, the first values comprising different values for the parameter over the time period of operation of the monitored system, and a learning model is trained using the first values for the parameter. A substrate is then placed in a plasma chamber of a controlled semiconductor manufacturing system (controlled system). A characteristic of the controlled system is determined using a current value of the parameter and the trained learning model. An action is then taken upon the controlled system to address the determined characteristic.

Abstract: A hybrid coupler operating in a power divider mode includes two inputs, two outputs, a capacitive module coupled between the inputs and the outputs or on each input and each output. The capacitive module has an adjustable capacitive value making it possible to adjust the central frequency. A calibration method includes: delivering a first reference signal having a first reference frequency on the first input of the hybrid coupler, measuring the peak value of a first signal delivered to the first output of the coupler and measuring the peak value of a second signal delivered to the second output of the coupler. The two peak values are compared and an adjustment of the capacitive value of the capacitive module is made until an equality of the peak values is obtained to within a tolerance.

Abstract: In one embodiment, a method of impedance matching and controlling the power delivered to a plasma chamber is disclosed. A matching network includes a variable reactance element (VRE), the VRE having different positions for providing different reactances. Based on a determined parameter, the method determines potential new positions for the VRE that would have a threshold effectiveness in providing an impedance match between the RF source and the plasma chamber. A preferred position for the VRE is determined by determining the one of the potential new positions meeting the threshold effectiveness whose efficiency in delivering RF power from the RF input to the RF output would cause an RF power at the RF output to be closest to a desired RF power.