Patents Examined by Steven T Sawyer
  • Patent number: 11439010
    Abstract: This disclosure provides a multi-layered printed circuit board (PC) that has signal array region. The signal array region has a width and circumscribes a power core region and has signal vias connected to respective signal ball pads, and ground vias connected to respective ground ball pads within the signal array region that have an associated ball pad pitch. The PCB also has an inner current power layer. The signal and ground vias are arranged on the component layer in a pattern and extend into the inner current layer. The pattern forms current power paths across the width of the signal array region, such that the current power paths have a width that is at least about 50% as wide as the ball pad pitch.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: September 6, 2022
    Assignee: Nvidia Corporation
    Inventors: Baal Yang, Daniel Lin, Sunil Sudhakaran
  • Patent number: 11432767
    Abstract: A mouth guard senses impact forces and determines if the forces exceed an impact threshold. If so, the mouth guard notifies the user of the risk for injury by haptic feedback, vibratory feedback, and/or audible feedback. The mouth guard system may also remotely communicate the status of risk and the potential injury. The mouth guard uses a local memory device to store impact thresholds based on personal biometric information obtained from the user and compares the sensed forces relative to those threshold values. The mouth guard and its electrical components on the printed circuit board are custom manufactured for the user such that the mouth guard provides a comfortable and reliable fit, while ensuring exceptional performance.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: September 6, 2022
    Assignee: Force Impact Technologies, Inc.
    Inventors: Anthony M. Gonzales, Robert M. Merriman, Susan M. Merriman, Christopher T. Cooper
  • Patent number: 11432396
    Abstract: The present disclosure relates to a printed circuit board and a module including the same. The printed circuit board includes an insulating body, a wiring pattern embedded in the insulating body, and a first conductor pattern disposed on the insulating body and overlapping at least a portion of the wiring pattern in a first direction. First conductive vias each penetrate a portion of the insulating body and are respectively disposed on opposite sides of the wiring pattern, in a second direction orthogonal to the first direction, to surround at least a portion of the wiring pattern. Each first conductive via has a first surface connected to the first conductor pattern, and a second surface, opposite to the first surface, connected to the insulating body.
    Type: Grant
    Filed: May 1, 2020
    Date of Patent: August 30, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Myeong Hui Jung, Kwang Yun Kim
  • Patent number: 11425819
    Abstract: A display device includes a folding area, a first unfolding area located on a side of the folding area, and a second unfolding area located on a second side of the folding area. The display device further includes a display module which includes a display panel, and a first circuit board which is attached to the display panel and disposed under the display module, wherein the first circuit board includes a base film, a first driving integrated circuit (“IC”) disposed in the first unfolding area, and a second driving IC disposed in the second unfolding area where the first driving IC and the second driving IC do not overlap each other in a thickness direction during folding.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: August 23, 2022
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Won Tae Kim, Ji Hye Kim, Jae Hyeon Jeon
  • Patent number: 11419208
    Abstract: A circuit board (3) is provided with a first rigid part (11) having a power system electronic component mounted thereon, a second rigid part (12) having a control system electronic component mounted thereon, and a thin flexible part (13) connecting the first and second rigid parts to each other. The flexible part (13) is provided with a plurality of conductive wires (27) conducted with the electronic components of the first and second rigid parts (11, 12). A non-conductive metal pattern (33) that is a dummy pattern is formed along an outer edge (13a) of the flexible part (13). By the non-conductive metal pattern (33), the disconnection of the conductive wires (27) due to cracking is suppressed.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: August 16, 2022
    Assignee: HITACHI ASTEMO, LTD.
    Inventors: Kumiko Yoshinaga, Eiji Ichikawa, Hirofumi Watanabe, Mototaka Takahashi
  • Patent number: 11417821
    Abstract: Superconducting integrated circuit layouts are proofed against the detrimental effects of stray flux by designing and fabricating them to have one or more ground planes patterned in the x-y plane with a regular grid of low-aspect-ratio flux-trapping voids. The ground plane(s) can be globally patterned with such voids and thousands or more superconducting circuit devices and wires can thereafter be laid out so as not to intersect or come so close to the voids that the trapped flux would induce supercurrents in them, thus preventing undesirable coupling of flux into circuit elements. Sandwiching a wire layer between patterned ground planes permits wires to be laid out even closer to the voids. Voids of successively smaller maximum dimension can be concentrically stacked in pyramidal fashion in multiple ground plane layers having different superconductor transition temperatures, increasing the x-y area available for device placement and wire-up.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: August 16, 2022
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Anna Y. Herr, Vladimir V. Talanov, Quentin P. Herr
  • Patent number: 11407371
    Abstract: A vehicular circuit body includes a trunk line that includes a power source line and a communication line, and that is routed in a vehicle body; and a plurality of control boxes that are disposed in a distribution manner along the trunk line. The trunk line includes a first trunk line portion extending in a front-and-rear direction of the vehicle body and a second trunk line portion extending in a leftward-and-rightward direction of the vehicle body. The plurality of control boxes include a branch control box that connects the first trunk line portion and the second trunk line portion, and distributes power from one of the first trunk line portion and the second trunk line portion to the other one.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: August 9, 2022
    Assignee: YAZAKI CORPORATION
    Inventors: Masahiro Takamatsu, Koichi Uezono, Kousuke Kinoshita, Atsushi Nakata, Yasuyuki Saito, Kazuyuki Oiwa, Terumitsu Sugimoto, Taku Furuta, Noriaki Sasaki, Yukinari Naganishi, Sadaharu Okuda, Kunihiko Yamada
  • Patent number: 11410791
    Abstract: In accordance with an aspect of the disclosure, a cable comprises a flexible cable portion; and an end cable portion connected to one end of the flexible cable portion, wherein the flexible cable portion comprises: a first wire comprising one or more signal transmission lines; and a second wire comprising one or more fill-cut areas corresponding to the signal transmission lines and at least one or more ground lines.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: August 9, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Bumhee Bae, Minseok Kim, Younho Kim
  • Patent number: 11412610
    Abstract: A disclosed apparatus may be a circuit board that includes (1) a first unique sublaminate that includes a plurality of ground layers and a plurality of signal layers, (2) a second unique sublaminate that includes a plurality of power layers and another plurality of signal layers, and (3) a symmetry axis that bisects the circuit board between the first unique sublaminate and the second unique sublaminate, wherein the first unique sublaminate and the second unique sublaminate are distinct from one another. Various other apparatuses, systems, and methods are also disclosed.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: August 9, 2022
    Assignee: Juniper Networks, Inc
    Inventors: Boris Reynov, David K. Owen, Michael Clifford Freda, Steve M. Wilkinson, Jing Zhang
  • Patent number: 11406004
    Abstract: A metal-core printed circuit board (MCPCB) and method of generating an ultra-narrow, high-current pulse driver with a MCPCB is provided. The MCPCB includes a rigid, metal heat sink layer and at least one electrically conductive top layer. At least one electrically insulating dielectric layer is positioned between the conductive top layer and rigid, metal heat sink layer, wherein the dielectric layer has a thickness of less than 0.007 inches.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: August 2, 2022
    Assignee: LEONARDO ELECTRONICS US INC.
    Inventors: Eric Paul Ruben, Jean Michel Maillard, Prabhu Thiagarajan
  • Patent number: 11406019
    Abstract: A fixing device for fixing a display card on a circuit board, includes a backplane and a support bracket. The backplane includes a substrate plate, and a first engaging part. The substrate plate is fixed on the display card. The first engaging part is disposed on the substrate plate. The support bracket includes at least one support leg and a second engaging part. The support leg includes a first end and a second end. The first end is connected with the circuit board. The second engaging part is connected with the second end and engaged with the first engaging part.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: August 2, 2022
    Assignee: ASUSTEK COMPUTER INC.
    Inventor: Hsu-Ching Chu
  • Patent number: 11399432
    Abstract: A component carrier includes a stack with a plurality of electrically conductive layer structures and at least one electrically insulating layer structure. The electrically conductive layer structures include an electrically conductive vertical through-connection and a horizontally extending electrically conductive trace electrically coupled with an end portion of the vertical through-connection. A back-drill hole extends through at least part of the at least one electrically insulating layer structure towards the end portion of the vertical through-connection. An etching neck connects the back-drill hole with the end portion of the vertical through-connection.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: July 26, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Markus Kastelic, Lackner Sebastian
  • Patent number: 11388823
    Abstract: An insulated metal substrate (IMS) includes a metal substrate, an insulating layer, a plastic frame, and a plurality of conductive metal pads. The insulating layer is located on the metal substrate. The plastic frame is located on the insulating layer and has a plurality of aperture areas. The conductive metal pads are located on the insulating layer and are respectively located in the aperture areas, and the conductive metal pads have sidewalls are in contact with the plastic frame.
    Type: Grant
    Filed: October 21, 2020
    Date of Patent: July 12, 2022
    Assignee: Jentech Precision Industrial Co., Ltd.
    Inventors: Chun-Ta Yeh, Kuo-Pin Cheng, Chin-Long Lin
  • Patent number: 11380508
    Abstract: An electric connection box includes a housing, a first lid portion, a groove, and a protrusion. The housing includes an opening. The first lid portion includes a first body wall that closes the opening of the housing and a first peripheral wall extending from a periphery of the first body wall toward the housing. The groove is provided between the first peripheral wall and a wall portion arranged to be spaced apart from the first peripheral wall. The groove includes an opening in a side of the first body wall in an extending direction of the first peripheral wall. The protrusion is provided on the first lid portion and protruding toward the wall portion. The protrusion covers the opening of the groove.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: July 5, 2022
    Assignee: YAZAKI CORPORATION
    Inventors: Sho Kurata, Hideki Kawamura, Minoru Umezaki, Keiichi Sugiyama
  • Patent number: 11375606
    Abstract: Disclosed is an electronic apparatus including a printed board, a plurality of connectors mounted on the printed board, a plurality of communication control circuits that is mounted on the printed board and that controls communication through corresponding ones of the plurality of connectors, and a shield member disposed to face the printed board, in which an annular ground pattern surrounding, without interruption, a shield area including the plurality of communication control circuits is formed on a front surface of the printed board, the plurality of connectors is all disposed outside the ground pattern surrounding the shield area, and the shield member covers the shield area and is fixed to the printed board such that a portion facing the ground pattern is electrically connected to the ground pattern.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: June 28, 2022
    Assignee: Sony Interactive Entertainment Inc.
    Inventor: Tetsufumi Nozawa
  • Patent number: 11373781
    Abstract: In accordance with an aspect of the disclosure, a cable comprises a flexible cable portion; and an end cable portion connected to one end of the flexible cable portion, wherein the flexible cable portion comprises: a first wire comprising one or more signal transmission lines; and a second wire comprising one or more fill-cut areas corresponding to the signal transmission lines and at least one or more ground lines.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: June 28, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Bumhee Bae, Minseok Kim, Younho Kim
  • Patent number: 11373779
    Abstract: Proposed is a conductive particle used for a testing socket electrically connecting a lead of a device to be tested and a pad of a test board by being arranged between the device to be tested and the test board, wherein the conductive particle has a predetermined depth d and has a length l that is greater than a width w, the conductive particle having a body part in a pillar shape, a first convex part having an upper surface, formed in a top of the body part, and a second convex part having a lower surface, formed in a bottom of the body part.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: June 28, 2022
    Assignee: SNOW CO., LTD.
    Inventor: Gyu Sun Kim
  • Patent number: 11367972
    Abstract: A vehicle controller has a modification prevention device, and the vehicle controller includes: a printed circuit board; a security module frame seated on the printed circuit board and having multiple coupling holes; and security modules inserted into the coupling holes and configured to electrically communicate with a circuit of the printed circuit board. In particular, the security modules include non-conductive insertion pins and conductive insertion pins inserted into the coupling holes, and the non-conductive insertion pins and the conductive insertion pins are scattered while being separated from the coupling holes of the security module when the vehicle controller is disassembled.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: June 21, 2022
    Assignee: HYUNDAI KEFICO CORPORATION
    Inventor: Jun Ho Lee
  • Patent number: 11363718
    Abstract: An electronic device and oscillator structure are provided. The electronic device includes a printed circuit board, an oscillator configured to oscillate at a frequency corresponding to an operation clock of the electronic device, and a connection member disposed between the oscillator and the printed circuit board such that the oscillator is spaced apart from a surface of the printed circuit board to electrically connect the oscillator to the printed circuit board. The connection member includes a first pad part electrically connected to a terminal of the oscillator, a second pad part electrically connected to a pad of the printed circuit board, and at least one conductive pattern electrically connecting the first pad part and the second pad part.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: June 14, 2022
    Inventors: Ungryeol Lee, Youngjin Kim, Taeyoun Kwon
  • Patent number: 11357103
    Abstract: A system-in-package cellular assembly is disclosed. The assembly may include a main board including a multi-layer printed circuit board. The main board may include one or more through holes and be detachably connectable to an end-product via the one or more through holes and one or more connecting members. The main board may be reversibly, electrically couplable to the end-product via the one or more through holes and the one or more connecting members. The assembly may include an add-on board including one or more through holes and be detachably connectable to the main board via one or more connectors. The add-on board may be reversibly, electrically couplable to the main board via one or more main board surface mount connectors and one or more add-on board surface mount connectors. The add-on board may include at least one of one or more sensors or one or more sensor through holes.
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: June 7, 2022
    Assignee: Signetik, LLC
    Inventors: Steven Poulsen, Christopher Lawson, Nalini Muppala