Abstract: A memory device is provided. The memory device includes a memory cell and a bit line connected to the memory cell. A negative voltage generator is connected to the bit line. The negative voltage generator, when enabled, is operative to provide a first write path for the bit line. A control circuit is connected to the negative voltage generator and the bit line. The control circuit is operative to provide a second write path for the bit line when the negative voltage generator is not enabled.

Abstract: A device is disclosed. The device includes a first tracking control line, a first tracking circuit, a first sense circuit, and a precharge circuit. The first tracking control line is configured to transmit a first tracking control signal. The first tracking circuit is configured to generate, in response to the first tracking control signal, a first tracking signal associated with first tracking cells in a memory array. The first sense circuit is configured to receive the first tracking signal, and is configured to generate a first sense tracking signal in response to the first tracking signal. The precharge circuit is configured to generate, in response to a rising edge of the first sense tracking signal and a falling edge of a read enable delayed signal, a precharge signal for precharging data lines associated with memory cell in the memory array. A method is also disclosed herein.

Abstract: The disclosure relates to an initialization circuit for initializing memory cells of a memory array including a common bit line. Individual memory cells are coupled to the common bit line of the memory array via at least one pass element of the individual memory cells. The initialization circuit is operable for receiving a set of partition addresses specifying the partitions, i.e. the memory cells to be initialized. The initialization circuit is operable for successively initializing one cell of the partitions to be initialized and iteratively initializing the remaining memory cells of the partitions to be initialized. A number of memory cells initialized simultaneously in one iteration increases from one iteration to another iteration. Initializing a certain memory cell comprises activating the pass element of the cell so that the memory cell is connected to the bit line. Further aspects relate to methods for initializing memory cells and semiconductor circuits.

Abstract: Memories might include control logic configured to cause the memory to perform a first sense operation having an initial phase and a plurality of sensing phases on a first grouping of memory cells, pause the first sense operation upon completion of a present sensing phase in response to receiving a command to perform a second sense operation on a second grouping of memory cells while performing the present sensing phase, perform an initial phase of the second sense operation after pausing the first sense operation, and, in response to completion of the initial phase of the second sense operation, resume the first sense operation at a next subsequent sensing phase of the plurality of sensing phases and continue to a sensing phase of the second sense operation to perform the next subsequent sensing phase of the first sense operation and the sensing phase of the second sense operation concurrently.

Abstract: A circuit for recycling energy in bit lines (BL and BLB) of SRAM during write operation by (i) storing the charges BL and BLB to an intermediate voltage source (VLB) in a discharge phase and (ii) restoring the charges from the intermediate voltage, back to the BL or BLB in a recovery phase. The circuit includes an inductor, a pair of NMOS transistors, a series resonance node, and an energy source (VLB) in addition to the components of an SRAM input-output circuit shown as in FIG. 1. During the SRAM write operation, the BL or BLB is discharged to the energy source VLB through the pair of NMOS transistors and, the inductor and the series resonance node. The remaining energy in the BL and the BLB is discharged to ground using the write complementary write drivers.

Abstract: A computation apparatus includes a plurality of memory cells and a plurality of sense amplifiers, in which each of the memory cells includes a memory circuit and a calculation circuit. The memory circuits of the memory cells are configured to receive input values from a plurality of word lines, generate a computation result based on the input values and output the computation result to a bit line. The calculation circuits of the memory cells are configured to receive calculation input values from a plurality of calculation word lines, generate calculation output values based on the calculation input values, and output the calculation output values to a plurality of calculation bit lines. The sense amplifiers are configured to sense the calculation output values from the calculation bit lines to generate sensed values, wherein a value of the computation result is determined based on the sensed values and the calculation output values.

Abstract: In one embodiment, an electronic device includes a compute-in-memory (CIM) array that includes a plurality of columns. Each column includes a plurality of CIM cells connected to a corresponding read bitline, a plurality of offset cells configured to provide a programmable offset value for the column, and an analog-to-digital converter (ADC) having the corresponding bitline as a first input and configured to receive the programmable offset value. Each CIM cell is configured to store a corresponding weight.

Abstract: A method for writing to a memory is disclosed. The method includes generating a write current that flows to a memory cell of the memory, generating a mirror current that mirrors the write current, and inhibiting application of a write voltage to the memory cell of the memory based on the mirror current. A device that performs the method is also disclosed. A memory that includes the device is also disclosed.

Abstract: Various embodiments of the present application are directed towards a memory cell, an integrated chip comprising a memory cell, and a method of operating a memory device. In some embodiments, the memory cell comprises a data-storage element having a variable resistance and a unipolar selector electrically coupled in series with the data-storage element. The memory cell is configured to be written by a writing voltage with a single polarity applying across the data-storage element and the unipolar selector.

Abstract: Methods and devices for adjusting a read threshold voltage of bitlines are provided. One such method includes adjusting a read threshold voltage of bitlines coupled to memory points of a memory circuit. The read threshold voltage is initially set to a first value. First data are written in the memory points and second data are read from the memory points. The second data are compared to the first data, and the threshold voltage is decreased by a second value in response to a comparison error of one of the second data with the corresponding first data.

Abstract: A memory device is provided. The memory device includes a plurality of memory cells arranged in a matrix of a plurality of rows and a plurality of columns. A first column of the plurality of columns of the matrix includes a first plurality of memory cells of the plurality of memory cells, a first pair of bit lines connected to each of the first plurality of bit cells, and a second pair of bit lines connectable to the first pair of bit lines through a plurality of switches.

Abstract: This disclosure describes a memory cell array with enhanced read sensing margin. The memory cell array includes a write port and a read port being connected through first and second data storage lines. The memory cell array further includes multiple word lines and bit lines arranged in rows and columns such that the read port is coupled to a read word line, a read bit line, and a virtual ground. The read port includes a first transistor coupled to at least the read bit line and the virtual ground, a second transistor coupled to at least the first data storage line and the first transistor, a third transistor coupled to at least the second data storage line and the read word line, and a fourth transistor coupled at least the first data storage line and the read word line.

Abstract: A memory is provided that is configured to practice both a conventional normal read operation and also a burst mode read operation. During the normal read operation, the memory pre-charges the bit lines in a group of multiplexed columns. Each column has a sense amplifier that latches a bit decision for the column during the normal read operation. If a subsequent read operation addresses the same group of multiplexed columns, the memory invokes the burst-mode read operation during which the bit lines are not pre-charged.

Abstract: A memory device having a plurality sections of memory cells, such as ferroelectric memory cells (hybrid RAM (HRAM) cells) may provide for concurrent access to memory cells within independent sections of the memory device. A first memory cell may be activated, and it may be determined that a second memory cell is independent of the first memory cell. If the second memory cell is independent of the first memory cell, the second memory cell may be activated prior to the conclusion of operations at the first memory cell. Latching hardware at memory sections may latch addresses at the memory sections in order to allow a new address to be provided to a different section to access the second memory cell.

Abstract: Drivers for sense amplifiers are disclosed. A driver may include two or more drain areas extending in a first direction and two or more source areas extending in the first direction. The driver may also include a drain interconnection including two or more first drain-interconnection portions which extend in the first direction above the two of more drain areas and one or more second drain-interconnection portions extending in a second direction between the two or more first drain-interconnection portions. The driver may also include a source interconnection including two or more first source-interconnection portions extending in the first direction above the two or more source areas and one or more second source-interconnection portions extending in the second direction between the two or more first source-interconnection portions. Associated systems are also disclosed.

Abstract: Provided is a semiconductor device capable of reducing its area, operating at a high speed, or reducing its power consumption. A circuit 50 is used as a memory circuit with a function of performing an arithmetic operation. One of a circuit 80 and a circuit 90 has a region overlapping with at least part of the other of the circuit 80 and the circuit 90. Accordingly, the circuit 50 can perform the arithmetic operation that is essentially performed in the circuit 60; thus, a burden of the arithmetic operation on the circuit 60 can be reduced. Moreover, the number of times of data transmission and reception between the circuits 50 and 60 can be reduced. Furthermore, the circuit 50 functioning as a memory circuit can have a function of performing an arithmetic operation while the increase in the area of the circuit 50 is suppressed.

Abstract: A three-dimensional (3D) storage circuit includes two or more tiers of semiconductor dies, and a storage array of bitcells distributed on the two or more tiers to form a plurality of storage subarrays. One of the storage subarrays is arranged on a respective one of the tiers. Row and column replica/dummy tracking cells are arranged on each of the tiers. A timing circuit is coupled to the tracking cells of each of the tiers. In response to receipt of tier-specific trim bits for each of the tiers, the timing circuit independently controls a timing and/or voltage state of each of the tiers during an access operation of the 3D storage circuit to account for process and/or thermal variation between tiers of the 3D storage circuit.

Abstract: A semiconductor memory device, and a method of operation, include: a memory block coupled with a plurality of word lines and a plurality of bit lines; a peripheral circuit configured to perform a program operation and a read operation on the memory block; and control logic configured to control the peripheral circuit such that a word line overdrive period overlaps with a bit line overdrive period in a bit line precharge operation during at least one of the program operation and the read operation.

Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive word line layers located over a substrate, and a plurality of vertical memory strings. Each vertical memory string includes a series connection of a memory stack structure and a selector element. Each of the memory stack structures extends through the alternating stack and includes a respective memory film and a respective vertical semiconductor channel. Each of the selector elements includes a two terminal device that is configured to provide at least two different resistivity states.

Abstract: Magnetic junction memory devices and methods for writing data to memory devices are provided. The magnetic junction memory device includes a first memory bank including first magnetic junction memory cells, a first local write driver adjacent to the first memory bank, connected to global data lines, the first local write driver configured to write data to the first magnetic junction memory cells via local data lines, a second memory bank adjacent to the first memory bank and including second magnetic junction memory cells, a second local write driver adjacent to the second memory bank, connected to the global data lines, the second local write driver configured to write data to the second magnetic junction memory cells via local data lines, and a global write driver configured to provide first and second write data to the first and second local write driver, respectively, via the global data lines.