Abstract: An integrated circuit, comprising a plurality of pins, including a signal output pin. The integrated circuit also comprises a plurality of signal nodes. Each node in the plurality of signal nodes is operable to store a respective internal data signal. The integrated circuit also comprises a plurality of testing circuits. Each testing circuit in the plurality of testing circuits configured to sample a respective internal data state and in response to concurrently couple a unique output signal to a same pin in the plurality of pins, other than the signal output pin.

Abstract: A ground fault detection device compatible with Y capacitors of various capacities without increasing the capacitance of a detection capacitor is provided. The ground fault detection device includes a first detection capacitor that operates as a flying capacitor, a second detection capacitor that operates as a flying capacitor, a control unit measures the charging voltage of the first detection capacitor and the second detection capacitor, a switching unit that switches between a state using a first measurement system in which the first detection capacitor is charged with the high voltage battery and the charging voltage of the first detection capacitor is measured by the control unit, and a state using a second measurement system in which the second detection capacitor is charged with the high voltage battery and the charging voltage of the second detection capacitor is measured by the control unit.

Abstract: A method is provided for in situ functionality testing of electrical switches using a Functional Reflectometry Test (FRT) of switches on the signal path of electrical circuits in a semiconductor interface. The method includes initiating the functionality testing of the electrical switches in situ, wherein the functionality of the electrical switches is tested while the electrical switches are connected to the Automatic Test Equipment (ATE) and are in-use testing semiconductors. The method also includes conducting full Functional Reflectometry Testing of the electrical switches in situ in an open switch state and a closed switch state to determine whether each of the electrical switches is one of fully functional, stuck closed, and stuck open, wherein testing for each state is performed as a single vector functional test to minimize test time overhead.

Abstract: A pallet system (10) for transporting goods has a pallet (12) and a measuring component (14) located on top of the upper surface (18) of the pallet (12). The measuring component (14) comprises a first conductive layer (32) and a second conductive layer (34) spaced apart from each other forming a capacitor with a gap (36). At least one elastic element (30) is arranged within the gap, and a control unit (31) is electrically connected to the first conductive layer (32) and the second conductive layer (34), wherein the control unit (31) is configured to measure the capacitance of the capacitor. Further, a measuring component (14) is shown.

Abstract: The magnetic chip detector system can have a first conductor member and a second conductor member both exposed to a liquid flow path and separated from one another by gap, each one of the conductor members having a magnetic field oriented into the liquid flow path, at least a first one of the magnetic fields being actively modifiable; an electrical energy source configured to induce a current circulation across the gap; and a meter configured to measure a response of the gap to the induced current circulation.

Abstract: A multiphase flow metering device may have a conduit through which a multiphase fluid can flow and a structured packing insert positioned in the conduit. The structured packing insert may have a water-wet packing structure zone and/or an oil-wet packing structure zone. The multiphase flow metering device may also have a Halbach pre-polarizing magnet array positioned around the conduit, an RF coil, an electromagnet, an NMR console adapted to detect NMR signals from the multiphase fluid, and a control system configured to vary a polarization of the Halbach pre-polarizing magnet array. The Halbach pre-polarizing magnet array may be positioned or positionable over one or both of the oil-wet and water-wet packing structure zones. In some embodiments, the structured packing insert may include immobilized radicals, providing for dynamic nuclear polarization of the multiphase fluid.

Abstract: A system configured to detect failure of a hose includes a sensor assembly having a body with a first arm and a second arm pivotally coupled to one another at respective first ends, and the body is configured to move between a closed position and an open position. The sensor assembly also includes a first electrical contact positioned at a respective second end of the first arm and a second electrical contact position at a respective second end of the second arm. The first electrical contact and the second electrical contact are configured to contact one another to form a complete electrical circuit when the body is in the closed position and are configured to be separated from one another to form an open electrical circuit when the body is in the open position to facilitate detection of the failure of the hose.

Abstract: Techniques for measuring fluid properties include circulating a mixed-phase fluid flow through a fluid flow circuit; circulating the mixed-phase fluid flow through a pre-polarizing magnet; polarizing at least a gas phase of the mixed-phase fluid flow to an initial polarization; measuring fluid induction decay (FID) values of the polarized gas phase with the EFNMR detector; determining a velocity of the gas phase based on the FID values of the polarized gas phase; producing a pulsed magnetic field gradient to suppress one or more signals acquired by the EFNMR detector with a first electromagnet; measuring FID values of the liquid phase of the mixed-phase fluid with the EFNMR detector simultaneously with the production of the pulsed magnetic field gradient; producing a homogeneous polarizing field to polarize the liquid phase of the mixed-phase fluid with a second electromagnet; and determining a velocity and content of the liquid phase based on the FID values of the polarized liquid phase.

Abstract: Provided is a semiconductor inspection device capable of high-speed response analysis as defect analysis of a fine-structured device constituting an LSI. Therefore, the semiconductor inspection device includes a vacuum chamber 3, a sample table 4 which is disposed in the vacuum chamber and on which a sample 6 is placed, an electron optical system 1 disposed such that an electron beam is emitted from above the sample, a plurality of probe units 24 connected to external devices 11 and 12 disposed outside the vacuum chamber via a coaxial cable 10, and an electrode 5 provided on or in the vicinity of the sample table. The probe unit 24 includes a measurement probe 8 configured to come into contact with the sample, a GND terminal 9 configured to come into contact with the electrode 5, and a probe holder 7 configured to hold the measurement probe and the GND terminal, connect a signal line of the coaxial cable to the measurement probe, and connect a GND line of the coaxial cable to the GND terminal.

Abstract: In some embodiments, a method may include an area-aware optimization for the test patterns. The method may include dividing the chip area into a grid. The grid may be based on the smallest particle size. The method may include preparing test patterns and identifying a subset of test patterns that touch all of the grid locations. The subset may include a minimum number of test patterns from the prepared test patterns which when implemented exercise the all of the grid locations. The method allows to more quickly determine chips that fail due to extrinsic defects. Once a test fails during the testing process for a chip, testing on the chip is stopped and testing begins on the next chip. Rapidly identifying chips that fail due to extrinsic failures can decrease the overall test time and identify those that will fail quickly as the chip process matures and is dominated by extrinsic failures.

Abstract: A test system is provided. The system includes a first test apparatus and a second test apparatus. A device power supply of the first test apparatus (ATE) is electrically connected with a device under test (DUT) through a driving branch (F) and a detecting branch (S), the driving branch (F) being configured to provide an original driving current to the DUT b the device power supply during testing, and the detecting branch (S) being configured to detect an effective driving current reaching the DUT. The second test apparatus includes a first voltage drop branch, the first voltage drop branch is connected to the detecting branch (S), and a voltage drop detected by the driving branch (F) is used to determine an effectiveness of an electrical connection formed between the driving branch and the device under test, and an electrical connection formed between the detecting branch (S) and the DUT.

Abstract: A fixture and a measurement system are provided. The fixture is adapted for electrically connecting a measurement device with a device under test, DUT, in particular a wireless DUT, and for mechanically holding the DUT. The fixture comprises a clamp for clamping the DUT; a male plug for engaging a mating socket of the DUT; and an electrical cable connected to the plug on one end and connectable with the measurement device at its other end. The fixture is arranged to mechanically hold the DUT such that the DUT can be rotated relative to the measurement device. The fixture reduces a shielding effect in respect of antenna modules of the DUT.

Abstract: A winding of an antenna of a metal detector, the winding includes multi-turn wire with both ends connected to the metal detector; and at least one resistive component for connecting a first part of the winding to a second part of the winding. The first part or the second part are not both ends of the winding. The resistive component is configured to damp an internal resonance of the winding with an order greater than 1.

Abstract: A massive testing system of a micro integrated circuit includes: a first test area including a plurality of test pads and a plurality of reading pads, and disposed on scribe lines; a plurality of test controllers disposed on the scribe lines one by one; and a probe configured to contact the first test area to test a plurality of rows of integrated circuit chips; wherein each of the plurality of test controllers is configured to test a respective one of the plurality of rows of integrated circuit chips row by row; wherein the probe merely contacts the first test area once; wherein the plurality of reading pads are configured to read test results of each of the plurality of rows of integrated circuit chips row by row.

Abstract: A representative phase-shift based method for using a transformer system to detect movement of an object, and associated systems and methods are disclosed. A representative transformer system detects movement of an object and includes an excitation coil configured to receive an excitation coil input signal that results from an input sinusoidal signal. The transformer further includes first and second sensing coils, and a core configured to be operatively coupled to the object. The core moves relative to the first and second sensing coils when the object moves. First and second impedance loads are connected to the first and second sensing coils, respectively. The two impedance loads have different phase-shifting characteristics. A phase-shift sensing circuit determines a phase-shift between the excitation coil input signal and the input sinusoidal signal that is correlated with a position of the core relative to the first and second sensing coils.

Abstract: A rotational angle sensor includes a rotary plate and a printed circuit board in which a primary coil and a secondary coil group are arranged. Loops of the primary coil and the secondary coil group are along a surface of the printed circuit board. The rotary plate includes a target portion whose outer circumferential edge portion has a sine-wave shape. The primary coil overlaps with the target portion, and has a circular-arc shape along a rotational direction of the rotary plate. The secondary coil group includes 4n (n is a natural number) secondary coils arranged in a line along the rotational direction, on an inner circumferential side of the primary coil. The number of turns of a secondary coil on an end side in a line is smaller than that of a secondary coil on an inner side in the line.

Abstract: The purpose of the present invention is to realize a dew point measurement in which the generation of dew condensation is directly detected and the detection can be performed without using any optical system. In particular, the purpose of the present invention is to realize a dew point measuring device that is compact and has a high sensitivity. According to one embodiment of the present invention, a sudden change in current values before and after the dew point is detected by detecting the dew condensation to detect a galvanic current that flows due to a water droplet attached onto a surface of an insulating substrate on which thin wires of dissimilar metals are juxtaposed, and by controlling the temperature on the surface of the substrate. In this way, the dew point measurement in which the dew point can be directly measured and a measurement with simple configuration and high accuracy can be performed can be realized.

Abstract: An integrated circuit die has a peripheral edge and a seal ring extending along the peripheral edge and surrounding a functional integrated circuit area. A test logic circuit located within the functional integrated circuit area generates a serial input data signal for application to a first end of a sensing conductive wire line extending around the seal ring between the seal ring and the peripheral edge of the integrated circuit die. Propagation of the serial input data signal along the sensing conductive wire line produces a serial output data signal at a second end of the sensing conductive wire line. The test logic circuit compares data patterns of the serial input data signal and serial output data signal to detect damage at the peripheral edge of the integrated circuit die.

Abstract: A metal detector for detecting a target, the metal detector including: a transmitter for transmitting a transmitted magnetic field; a receiver, including a winding with a plurality of turns, for receiving a magnetic field; and a receive electronics connected to the winding for receiving signals from the winding. The receiver further includes an electrostatic screen covering at least part of the winding. The electrostatic screen is connected to an electronic circuit to receive signals from the receiver to reduce an effective capacitance presented by the electrostatic screen to the winding.

Abstract: A semiconductor package test apparatus includes an interface board having connection terminals for electrically connecting a semiconductor package to a tester, a push block for pressing the semiconductor package toward the interface board to bring external terminals of the semiconductor package into contact with the connection terminals of the interface board, a temperature adjustment unit connected with the push block to heat or cool the semiconductor package to a test temperature through the push block, and a heat transfer member for thermally connecting the push block and the interface board.