Patents Examined by Tim Phan
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Patent number: 7284313Abstract: A hybrid transmission including two electric motors and a plurality of planetary gear sets operatively connectable to the motors and to an engine is provided. Novel motor features are provided including structure adapted to improve reliability and to facilitate assembly. More precisely, a method is provided for locating and installing the components of a motor, including a rotor and a stator, within a covered housing to form a motor module. A plurality of rotor bearings and a position/speed sensor are also preferably added to the motor module. After the motor module is assembled, the motor may be tested and thereafter the motor module can be installed into a hybrid transmission as a single component utilizing conventional transmission assembly methods.Type: GrantFiled: February 18, 2005Date of Patent: October 23, 2007Assignees: General Motors Corporation, DaimlerChrysler AG, DaimlerChrysler CorporationInventors: James A. Raszkowski, Edward L. Kaiser, Anthony P. Tata, Kyle K. Kinsey, Joel E. Mowatt, Fredrick R. Poskie, James W. Haynes
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Patent number: 7284317Abstract: Disclosed is a method of producing a printed circuit board (PCB) with an embedded resistor, in which a resistor with a desired shape and volume is precisely formed using a resistor paste so that resistance values according to a position of the PCB are uniform, thereby a laser trimming process is omitted or minimally utilized. The method has advantages in that a production time of the PCB is shortened and productivity is improved because an operation condition is rapidly set without being greatly affected by the position precision of a printing device. Other advantages of the method are that the resistor paste with a relatively uniform thickness is secured through a screen printing process, thereby easily forming the resistor and improving resistance tolerance.Type: GrantFiled: February 3, 2004Date of Patent: October 23, 2007Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Suk-Hyun Cho, Jang-Kyu Kang, Byung-Kook Sun, Jong-Kuk Hong, Seok-Kyu Lee, Jin-Yong Ahn
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Patent number: 7281318Abstract: A method of manufacturing a composite structural member with an integrated electrical circuit is provided. The structural member includes a plurality of layers of structural reinforcement material, and two or more electrical devices are disposed at least partially between the layers with an intermediate layer of the structural reinforcement material disposed between the electrical devices. At least one electrical bus is disposed in the structural member, and each electrical device is connected to the bus by a conductive electrode. Thus, the electrodes can extend through the intermediate layer of the structural reinforcement material to connect each of the electrical devices to one or more of the buses.Type: GrantFiled: May 19, 2004Date of Patent: October 16, 2007Assignee: The Boeing CompanyInventors: Joseph A. Marshall, Douglas B. Weems, Richard C. Bussom, David M. Anderson
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Patent number: 7278202Abstract: A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to create an exposed central portion of the resistive material therebetween. According to the method the resistive strip is attached to a single co extensive strip of conductive material and a central portion of the conductive material is removed to create the exposed central portion of the resistive strip.Type: GrantFiled: December 23, 2004Date of Patent: October 9, 2007Assignee: Vishay Dale Electronics, Inc.Inventors: Joel J. Smejkal, Steve E. Hendricks
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Patent number: 7278201Abstract: A high precision power resistor having the improved property of reduced resistance change due to power is disclosed. The resistor includes a substrate having first and second flat surfaces and having a shape and a composition; a resistive foil having a low TCR of about 0.1 to about 1 ppm/° C. and a thickness of about 0.03 mils to about 0.7 mils cemented to one of the flat surfaces with a cement, the resistive foil having a pattern to produce a desired resistance value, the substrate having a modulus of elasticity of about 10×106 psi to about 100×106 psi and a thickness of about 0.5 mils to about 200 mils, the resistive foil, pattern, type and thickness of cement, and substrate being selected to provide a cumulative effect of reduction of resistance change due to power. The present invention also provides for a method of producing a high precision power resistor.Type: GrantFiled: October 18, 2004Date of Patent: October 9, 2007Assignee: Vishay Intertechnology, IncInventors: Joseph Szwarc, Reuven Goldstein
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Patent number: 7275299Abstract: A plurality of single-pole coils are retained by a coil retaining device, the single-pole coils are arranged such that the coil insertion portions of each single-pole coil confront the inner circumference openings of the slots and may be generally parallel to the axial direction of the motor core, each single-pole coil is moved linearly toward the motor core such that the coil retaining device and the moving locus before the adjoining coil insertion portions in the adjoining single-pole coils are inserted into the slots are parallel or approach the more from the inner circumference side to the outer circumference side and the two coil insertion portions of each single-pole coil are moved such that they may start their movements simultaneously and at equal velocities.Type: GrantFiled: July 30, 2003Date of Patent: October 2, 2007Assignee: Aisin AW Co., Ltd.Inventors: Tooru Kuroyanagi, Tsuyoshi Yamaguchi, Shingo Hashimoto, Takahiro Kido
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Patent number: 7275318Abstract: A spring fixture (1) is provided for quickly installing or uninstalling a coil spring (36) in or from an electrical connector (3). The fixture includes an operation member (11) having a generally cylindrical handle (12) at an end thereof and an action member (16) assembled on an opposite end of the operation member by a screw cap (18). The action member defines a recess (1620) thereby forming a semi-circular bottom wall (1622) and a semi-circular inner wall (1624). During installing or removing the spring, the spring is received in the recess and surrounded by the inner wall. A method of using the fixture to install and remove the spring is also provided.Type: GrantFiled: June 14, 2004Date of Patent: October 2, 2007Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Jung-Jang Chu, Hsiu-Yuan Hsu
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Patent number: 7275308Abstract: A method for manufacturing the same, wherein the monolithic ink-jet printhead includes a manifold for supplying ink, an ink chamber having a hemispheric shape, and an ink channel formed monolithically on a substrate; a silicon oxide layer, in which a nozzle for ejecting ink is centrally formed in the ink chamber, is deposited on the substrate; a heater having a ring shape is formed on the silicon oxide layer to surround the nozzle; a MOS integrated circuit is mounted on the substrate to drive the heater and includes a MOSFET and electrodes connected to the heater. The silicon oxide layer, the heater, and the MOS integrated circuit are formed monolithically on the substrate. Additionally, a DLC coating layer having a high hydrophobic property and high durability is formed on an external surface of the printhead.Type: GrantFiled: December 22, 2003Date of Patent: October 2, 2007Assignee: Samsung Electronics Co., Ltd.Inventors: Hyeon-cheol Kim, Yong-soo Oh, Keon Kuk, Kwang-joon Yoon, Jae-sik Min, Sang-hyun Lee, Chang-seung Lee, Seog Soon Baek, Sang-wook Lee, Jong-cheol Shin
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Patent number: 7275316Abstract: A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.Type: GrantFiled: March 31, 2004Date of Patent: October 2, 2007Assignee: Intel CorporationInventors: Todd B Myers, Nicholas R. Watts, Eric C Palmer, Jui Min Lim
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Patent number: 7275309Abstract: A method of manufacturing an electrical-resistance heating element includes forming sintered ceramics or calcined ceramics, forming an electrode on the sintered ceramics or the calcined ceramics, and forming a ceramic base material having mainly a high melting point metal on the electrode embedded therein, thereby forming a heating element with built-in electrode.Type: GrantFiled: July 30, 2004Date of Patent: October 2, 2007Assignee: NGK Insulators, Ltd.Inventors: Hiroto Matsuda, Kazuhiro Nobori, Yutaka Mori
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Patent number: 7272885Abstract: The present invention relates to a method of manufacturing surge arrestors, the method including stacking varistors; and forming a coating of composite material on the stack. Between these steps, also included is placing a bead of flexible, adhesive, and dielectric material on the previously formed stack in register with the various interfaces between each pair of adjacent varistors.Type: GrantFiled: October 23, 2003Date of Patent: September 25, 2007Assignee: AlstomInventors: Mehrdad Hassanzadeh, Frédéric Malpiece, Dominique Mercier
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Patent number: 7269898Abstract: An antifuse including a bottom plate having a plurality of longitudinal members arranged substantially parallel to a first axis, a dielectric layer formed on the bottom plate, and a top plate having a plurality of longitudinal members arranged substantially parallel to a second axis, the top plate formed over the dielectric layer. Multiple edges formed at the interfaces between the top and bottom plates result in regions of localized charge concentration when a programming voltage is applied across the antifuse. As a result, the formation of the antifuse dielectric over the corners of the bottom plates enhance the electric field during programming of the antifuse. Reduced programming voltages can be used in programming the antifuse and the resulting conductive path between the top and bottom plates will likely form along the multiple edges.Type: GrantFiled: October 4, 2006Date of Patent: September 18, 2007Assignee: Micron Technology, Inc.Inventor: Jigish D. Trivedi
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Patent number: 7266888Abstract: A and method for fabricating a warpage-preventive circuit board is provided, wherein a plurality of conductive traces are formed on a surface of an electrically-insulative core layer, and a plurality of discontinuous dummy circuit regions are disposed on the surface of the electrically-insulative core layer at area free of the conductive traces, with adjacent dummy circuit regions being spaced apart by at least a chink. During a high-temperature fabrication process, the dummy circuit regions help reduce thermal stress and the chinks absorb thermal expansion of the dummy circuit regions, to thereby prevent warpage of the circuit board and cracks of a chip mounted on the circuit board, such that yield and reliability of fabricated semiconductor devices can be improved.Type: GrantFiled: January 25, 2005Date of Patent: September 11, 2007Assignee: Siliconware Precision Industries, Co. Ltd.Inventors: Chin-Huang Chang, Chin-Tien Chiu, Chung-Lun Liu
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Patent number: 7263764Abstract: A method for adjusting the equivalent series resistance (ESR) of a multi-layer component includes providing at least first and second layers separated by an insulating layer, providing a resistive layer between the inslulating layer and one of the first or second electrode layers, and adjusting the ESR of the component by varying the effective resistance of the resistive layer. The effective resistance may be varied by adjusting the composition or thickness of the resistive layer. Alternatively, the effective resistance may be varied by forming a plurality of through-holes perforating one of the electrode layers and by then adjusting the respective diameters of selected of the through-holes to vary the extent of coverage on the resistive layer. An additionally disclosed feature of the present subject matter is to incorporate dielectric layers of varied thicknesses to broaden the resonancy curve associated with a particular mutli-layer component configuration.Type: GrantFiled: August 26, 2003Date of Patent: September 4, 2007Assignee: AVX CorporationInventors: Robert Heistand, II, John L. Galvagni, Georghe Korony
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Patent number: 7257883Abstract: In the manufacture of an electric heater, means (24, 26) is provided for feeding and guiding a ribbon heating element (14) progressively into overlying edgewise relationship with a base (2). Means (6, 8) is provided for supporting the base (2) and for effecting relative motion between the base (2) and the feeding and guiding means (24, 26), such that motion of the base (2) is synchronised with feeding of the element (14) as it is fed and guided into the relationship with the base (2), to urge the heating element (14) towards the base (2) and cause an edge portion (22) of the heating element (14) to become embedded in the base (2).Type: GrantFiled: January 27, 2003Date of Patent: August 21, 2007Assignee: Ceramaspeed LimitedInventor: Kevin Ronald McWilliams
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Patent number: 7257884Abstract: A semiconductor component includes adjustment circuitry configured to adjust selected physical and electrical characteristics of the component or elements thereof, and an input/output configuration of the component. The component includes a semiconductor die, a substrate attached to the die, and terminal contacts on the substrate. The adjustment circuitry includes conductors and programmable links, such as fuses or anti-fuses, in electrical communication with the die and the terminal contacts. The adjustment circuit can also include capacitors and inductance conductors. The programmable links can be placed in a selected state (e.g., short or open) using a laser or programming signals. A method for fabricating the component includes the steps of forming the adjustment circuitry, and then placing the programmable links in the selected state to achieve the selected adjustment.Type: GrantFiled: August 24, 2005Date of Patent: August 21, 2007Assignee: Micron Technology, Inc.Inventors: Aaron M. Schoenfeld, David J. Corisis, Tyler J. Gomm
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Patent number: 7254881Abstract: A motor includes a stator having magnets, a rotor having teeth, a commutator secured to the rotor, and brushes. A coil is wound about each tooth. The commutator is connected to the coils. The brushes slidably contact the commutator. The number of the magnets and the number of the teeth are determined such that the resultant of torque vectors that act on the teeth is zero. For example, the number of the magnet is six, and the number of the teeth is eight. As a result, the rotor is prevented from vibrating.Type: GrantFiled: August 30, 2004Date of Patent: August 14, 2007Assignee: Asmo Co., Ltd.Inventors: Kaname Egawa, Toshio Yamamoto, Keiichi Uemura, Yasuhiro Toyama, Shinji Santo, Yoshiyuki Takabe, Takahiro Nakayama
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Patent number: 7254880Abstract: During the positioning of a control device for controlling an electromechanical drive, contact elements, which are connected to the control device in a fixed manner, are positioned in relation to one or more openings in a connector collar. To position the control device, the latter is displaced into a predetermined position. The predetermined position is defined, for example, by a guide or a stop. The contact elements are a component of an electric and/or optical junction which connects the drive device to other functional units, for example to a door control device or a motor vehicle battery. To position the contact elements in the connector collar of a connecting element which lies on the side of the drive device in the junction, the contact elements are positioned in relation to openings in the connector collar by being displaced together with the control device into the predetermined position.Type: GrantFiled: April 20, 2001Date of Patent: August 14, 2007Assignee: Brose Fahrzeuqteile GmbH & Co. KG, CoburgInventors: Volker Aab, Karl-Heinz Rosenthal, Reiner Kurzendoerfer, Herbert Becker, Gerhard Schelhorn
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Patent number: 7251885Abstract: In order to improve the adhesion of a circuit to a circuit forming board, a separation film including a base film and a coating layer formed on the base film is joined to both the sides of the board. When a laser beam is applied to form a throughhole in the board, a unified portion of the board and the separation film is formed around the throughhole. An energy beam is applied to the whole or a part of the surface of a circuit formed at a circuit forming step to transfer a part of the separation film. Thus, a high density board where the circuit strongly adheres to the board can be realized in the manufacturing process of the circuit forming board.Type: GrantFiled: February 4, 2004Date of Patent: August 7, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventor: Toshihiro Nishii
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Patent number: 7246426Abstract: A method of manufacturing a motor that includes a permanent magnet unit disposed at a circumference for providing a plurality of magnetic poles, and a rotor disposed inside the circumference to be coaxial with the said permanent magnet unit. The rotor includes a center core coaxial with the center axis of the rotor, a plurality of coil cores disposed at peripheral portions of the rotors, and a plurality of concentrated coils respectively mounted on the coil cores. The method includes simultaneously: holding all of the coil cores by peripheral portions thereof so that outer peripheries of the held coil cores are on a prescribed circle, punching corners of one end of the center core to form chamfered corners; and moving the held coil cores from the end of the center core where the chamfered corners are formed so that the center core can be completely fitted to the held coil cores.Type: GrantFiled: July 29, 2004Date of Patent: July 24, 2007Assignee: DENSO CorporationInventor: Shigeyuki Haga