Abstract: An optical fiber connection system includes a first and a second optical fiber, each with end portions that are terminated by a first and a second fiber optic connector, respectively. A fiber optic adapter connects the first and the second fiber optic connectors. A fiber alignment apparatus includes V-blocks and gel blocks. Each of the fiber optic connectors includes a connector housing and a sheath. The end portions of the optical fibers are positioned beyond distal ends of the respective connector housings. The sheath is slidably connected to the connector housing and slides between an extended configuration and a retracted configuration. The sheath covers the end portion of the respective optical fiber when the sheath is at the extended configuration and exposes the end portion when at the retracted configuration. The end portions of the optical fibers are cleaned when slid between the V-blocks and the gel blocks.

Abstract: A flexible cable guide and enclosure is disclosed for guiding one or more optic fiber cables between an outside of the enclosure and a moveable tray inside the enclosure on which devices terminating the one or more cables are mounted. A first end of the cable guide is secured to an outside of the enclosure and a second end is secured to the tray for movement therewith. The flexible cable guide ensures that the optic fiber cables transition smoothly from the outside of the enclosure to the devices.

Abstract: An optical connector holding one or more optical ferrule assembly is provided. The optical connector includes an outer body, an inner front body accommodating the one or more optical ferrule assembly, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four optical ferrule assembly are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight optical ferrule assembly are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint. A receptacle can hold one or more connector inner bodies forming a single boot for all the optical fibers of the inner bodies.

Abstract: A photodetector array includes a substrate, and an array of pixels over the substrate. Each pixel includes a set of diffraction gratings directly on a semiconductor photodetector. A pitch of the set of diffraction gratings associated with each pixel in the array of pixels are different to enable each pixel to detect a specific wavelength of light different than other pixels of the array of pixels. An air cavity may be provided in the substrate under the germanium photodetector to improve light absorption. A method of forming the photodetector array is also disclosed.

Abstract: A light distribution structure 10 and a related element 100, such as a light guide, are provided. The structure 10 is preferably an optically functional layer comprising an at least one feature pattern 11, 11A established in a light-transmitting carrier by a plurality of three-dimensional optical features variable in terms of at least one of the cross-sectional profile, dimensions, periodicity, orientation and disposition thereof within the feature pattern. In some instances, the optical features are embodied as internal optical cavities 12 capable to establish the total internal reflection (TIR) function at a horizontal surface and at an essentially vertical surface thereof. A method for manufacturing the light distribution structure is further provided.

Abstract: A process for terminating an optical fiber with a ferrule includes the steps of: (a) providing an optical fiber and ferrule with an end of the optical fiber extending beyond a surface of the ferrule; and (b) directing a jet comprising an air-abrasive mixture at the end of the optical fiber to cleave the end of the optical fiber from the remainder of the optical fiber.

Abstract: According to various aspects of the present disclosure, an apparatus is provided. In an aspect, the apparatus includes an optical transceiver having a first port, a second port and an optical switch coupled to the first port and the second port. The optical switch is switchable between a unidirectional port operation mode and a bidirectional port operation mode. When the optical switch is in the unidirectional port operation mode, the first port is configured to send a first optical signal, and the second port configured to receive a second optical signal. When the optical switch is in the bidirectional port operation mode, the first port configured to send the first optical signal and receive the second optical signal, and the second port configured to receive a third optical signal and not send the first signal.

Abstract: Configurations for a photonics device with a vertical outcoupler and fabrication operations thereof are disclosed. The photonics device may include an off-cut substrate with a cavity. The cavity may be coated with a buffer layer, which may form the vertical outcoupler. The cavity may be filled with a fill material that provides structural integrity to the cavity. The off-cut substrate may have a first and a second cladding layer above and below it, to provide cladding for the waveguide structure. In some examples, light may propagate through the off-cut substrate and may be received by the outcoupler. The outcoupler may reflect and redirect the light out of the waveguide structure and toward one or more optical elements. The optical element(s) may provide the light to a launch region in a system interface and/or to a sample.

Abstract: The present invention has a pixel which includes a first switch, a second switch, a third switch, a first resistor, a second resistor, a first liquid crystal element, and a second liquid crystal element. A pixel electrode of the first liquid crystal element is electrically connected to a signal line through the first switch. The pixel electrode of the first liquid crystal element is electrically connected to a pixel electrode of the second liquid crystal element through the second switch and the first resistor. The pixel electrode of the second liquid crystal element is electrically connected to a Cs line through the third switch and the second resistor. A common electrode of the first liquid crystal element is electrically connected to a common electrode of the second liquid crystal element.

Abstract: A robust conjugate symmetric optical apparatus is disclosed. The robust conjugate symmetric optical apparatus comprises a first optical cell set and a second optical cell set. The first optical cell set includes a first plurality of cells, each of which includes a first left half cell and a first right half cell, and the respective first right half cell and the corresponding first left half cells form a first symmetric structure therebetween.

Abstract: A photonic integrated circuit (PIC) having a substrate in which vertically coupled photodetectors and in-line optical modulators are integrated to enable vertical coupling of light using a fiber assembly block (FAB), with the planar end surface thereof being attached to a substantially planar main surface of the substrate. In an example embodiment, the photodetectors are buried in deep vias formed in the substrate, and the in-line optical modulators are waveguide-connected to the corresponding vertical-coupling optical gratings. The photodetectors and optical gratings may be arranged in a linear array along the main surface of the substrate to enable uncomplicated optical alignment of end segments of the optical fibers in the FAB with the corresponding photodetectors and optical gratings for vertical coupling of light therebetween. In some embodiments, the FAB may have more than one hundred optical fibers. In some embodiments, the PIC can be implemented using the silicon photonics material platform.

Abstract: A silicon optical modulator is fabricated to have a multi-slab structure between the contacts and the waveguide, imparting desirable performance attributes. A first slab comprises dopant of a first level. A second slab adjacent to (e.g., on top of) the first slab, comprises a doped region proximate to a contact, and an intrinsic region proximate to the waveguide. The parallel resistance properties and low overlap between the highly doped silicon and optical mode pigtail afforded by the multi-slab configuration, allow the modulator to operate with reduced optical losses and at a high speed. Embodiments may be implemented in a Mach-Zehnder interferometer or in micro-ring resonator modulator configuration.

Abstract: A multi-chip package assembly includes a substrate, a first semiconductor chip attached to the substrate, and a second semiconductor chip attached to the substrate, such that a portion of the second semiconductor chip overhangs an edge of the substrate. A first v-groove array for receiving a plurality of optical fibers is present within the portion of the second semiconductor chip that overhangs the edge of the substrate. An optical fiber assembly including the plurality of optical fibers is positioned and secured within the first v-groove array of the second semiconductor chip. The optical fiber assembly includes a second v-groove array configured to align the plurality of optical fibers to the first v-groove array of the second semiconductor chip. An end of each of the plurality of optical fibers is exposed for optical coupling within an optical fiber connector located at a distal end of the optical fiber assembly.

Abstract: A method for measuring a response from an optical fiber providing distributed back reflections using a system comprising an optical source comprising a laser, an optical receiver and a processing unit is disclosed. The method comprises establishing initial parameters of a distributed back-reflection processing. The method also comprises generating an interrogation signal and an optical local oscillator using the optical source, the interrogation signal being represented by an interrogation phasor and the optical local oscillator being represented by a local oscillator phasor; transmitting the interrogation signal into the optical fiber; and mixing the optical local oscillator with reflected light from the optical fiber and detecting a mixing product with the optical receiver to achieve a receiver output signal.

Abstract: An electronic device may have a display, a display cover layer, and a sheet-packed coherent fiber bundle. The coherent fiber bundle may have an input surface that receives an image from the display and a corresponding output surface to which the image is transported. The coherent fiber bundle may be placed between the display and the display cover layer and mounted to a housing. The coherent fiber bundle may have fiber cores with bends that help conceal the housing from view and make the display appear borderless. The coherent fiber bundle has filaments formed from elongated strands of binder in which multiple fiber cores are embedded. Sheets of filaments are stacked and fused together to form the coherent fiber bundle. By aligning and fusing the sheets with respect to each other the filaments are packed with a desired density and uniformity.

Abstract: A device includes a first package connected to an interconnect substrate, wherein the interconnect substrate includes conductive routing; and a second package connected to the interconnect substrate, wherein the second package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler and to a photodetector; a via extending through the substrate; an interconnect structure over the photonic layer, wherein the interconnect structure is connected to the photodetector and to the via; and an electronic die bonded to the interconnect structure, wherein the electronic die is connected to the interconnect structure.

Abstract: An optical connector holding one or more optical ferrule assembly is provided. The optical connector includes an outer body, an inner front body accommodating the one or more optical ferrule assembly, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four optical ferrule assembly are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight optical ferrule assembly are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint. A receptacle can hold one or more connector inner bodies forming a single boot for all the optical fibers of the inner bodies.

Abstract: It is an object of the present invention to connect a wiring, an electrode, or the like formed with two incompatible films (an ITO film and an aluminum film) without increasing the cross-sectional area of the wiring and to achieve lower power consumption even when the screen size becomes larger. The present invention provides a two-layer structure including an upper layer and a lower layer having a larger width than the upper layer. A first conductive layer is formed with Ti or Mo, and a second conductive layer is formed with aluminum (pure aluminum) having low electric resistance over the first conductive layer. A part of the lower layer projected from the end section of the upper layer is bonded with ITO.

Abstract: A photonic integrated circuit includes a slot optical waveguide having an optical core with sub-wavelength slot therein that is partially filled with a first lower-index material having a negative thermo-optic coefficient. The slot may also include a second lower-index material having a positive thermo-optic coefficient. The relative volume of the first lower-index material within the slot may be configured to provide athermal or nearly-athermal operation. Example applications include integrated AWG MUX/DEMUX devices, Mach-Zehnder modulators, and micro-ring resonators or modulators implemented with silicon-based or silicon-nitride based slot waveguides with reduced sensitivity to temperature changes.

Abstract: Disclosed are a waveguide display module, and an image generation module and application corresponding thereto. By wavelength division multiplexing, an image generation unit generates through modulation mixed light beams containing at least two groups of sub-images of different wavelengths. The mixed light beams generated through modulation by the image generation unit are coupled into a waveguide module, which module has in-coupling units arranged in multiple layers and out-coupling units arranged in multiple layers, an in-coupling unit in each layer being configured to couple in light of different wavelength ranges. Emergent images, formed after mixed light beams of an image to be displayed generated by the image generation unit are coupled out by the out-coupling units of the waveguide module, are spliced into the image to be displayed.