Abstract: According to one embodiment, a printed circuit board includes a substrate and a shared pad group provided on the substrate and including a plurality of shared pads. The shared pads include a first area, a second area smaller in size than the first area, a port of which is overlap the first area and an other port of which is located to protrude from the first area to a side of another one of the shared pads, and a second side edge located on a side of another shared pad. The second pad side edge includes a first side edge defining the first area, a second side edge defining the second area and displaced on a side of another shared pad with respect to the first side edge, and a sloping side edge connecting the first side edge and the second side edge to each other.

Abstract: Example embodiments relate to a substrate integrated waveguide (SIW) with dual circular polarizations. An example SIW may include a dielectric substrate and a first metallic layer coupled to a top surface of the dielectric substrate with a through-hole extending through the dielectric substrate and the first metallic layer. The SIW also includes a dielectric layer coupled to a top surface of the first metallic layer. A second metallic layer is coupled to a top surface of the dielectric layer. The second metallic layer includes a non-conductive opening, a plurality of feeds with a first end in the non-conductive opening and a second end including a single-ended termination, and an impedance transformer. The SIW also includes a third metallic layer coupled to a bottom of the dielectric substrate, and a set of metallic via-holes proximate the non-conductive opening and coupling the second metallic layer to the third metallic layer.

Abstract: A flexible printed circuit board according to an embodiment includes: a substrate; a circuit pattern disposed on the substrate; and a protective layer on the circuit pattern, wherein the circuit pattern includes a first circuit pattern and a second circuit pattern connected to a chip in a chip mounting region, a first direction that is a direction in which the circuit pattern extends and a second direction perpendicular to the first direction are defined in the substrate, the substrate includes first and second ends facing each other in the first direction and third and fourth ends facing each other in the second direction, the protective layer includes fifth and sixth ends spaced apart from ends of the substrate and facing in the first direction and seventh and eighth ends spaced apart from ends of the substrate and facing in the second direction, and an outer pattern disposed adjacent to the third end and the fourth end on the substrate, wherein the outer pattern includes: a first outer pattern and a second

Abstract: A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.

Abstract: A foldable electronic device may have a foldable housing. The foldable housing may be configured to bend about a bend axis. First and second portions of the housing that rotate relative to each other may be coupled by a hinge that is aligned with the bend axis. A foldable display may be coupled to the foldable housing and may be configured to bend along the bend axis as the foldable housing is folded. The display may have an array of pixels supported by a metal layer. The pixels may be interposed between a display cover layer and the metal layer. The foldable housing may have a support layer. To help support the display for bending about the bend axis while preventing damage to the display when the display is contacted by an external object, a spring layer may be interposed between the metal layer and the support layer.

Abstract: An electronic device including: a multilayer printed circuit board; and a molded retaining body; wherein the printed circuit board is formed of structured layers of conducting and non-conducting materials adhered together, the conducting materials form conductor tracks and contact areas, the printed circuit board being stiffened in a rigid region by stiffening material, the rigid region having electronic components and encapsulated in an epoxy; the printed circuit board having a flexible region that is more flexible than the rigid region, the flexible region having contact areas; the retaining body having an arc-shape formed on a radial inner side of the retaining body for arrangement on an inner tube of an endoscope; the retaining body having, on a radial outer side, a receiving contour for receiving and shaping the printed circuit board; and the retaining body having a retainer for holding the printed circuit board in a bent state.

Abstract: A method of manufacturing a component carrier includes providing a laminated stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, at least partially covering a component with a transition layer having a thickness in a range from 0.5 nm to 1 ?m, and assembling the component with the stack.

Abstract: A semiconductor package is provided. The semiconductor package can include a first redistributed layer on which a plurality of semiconductor chips and a plurality of passive devices are mounted on one surface, a second redistributed layer electrically connected to the first redistributed layer through a via, an external connection terminal formed on the lower surface of the second redistributed layer, a first mold provided to cover the plurality of semiconductor chips and the plurality of passive devices on the first redistributed layer, and a second mold provided between the first redistributed layer and the second redistributed layer. Each of the first redistributed layer and the second redistributed layer includes a wiring pattern and an insulating layer and is composed of a plurality of layers, and at least one of the plurality of semiconductor chips is disposed between the first redistributed layer and the second redistributed layer.

Abstract: The present disclosure provides a protector for a wire harness that can suppress attachment of water to a surrounding electrical component. In a longitudinal direction X along the horizontal direction of the protector main body portion 11 in a state in which a protector is mounted in a vehicle, there is a first region A1 where an electrical component E is located below a protector main body portion 11, and a second region A2 where there is no electrical component E below the protector main body portion 11. A groove 21 that is open vertically upward is provided in an outer surface of the protector main body portion 11. The groove 21 extends over the first region A1 and the second region A2, and is inclined vertically downward while extending toward the second region A2.

Abstract: Disclosed is a manufacturing method for an embedded structure. The method includes: preparing a temporary carrier board; preparing a second circuit layer on at least one of the upper surface and the lower surface of the temporary carrier board, and preparing a first dielectric layer to cover the second circuit layer; patterning and curing the first dielectric layer to form a cavity, mounting a device in the cavity, and performing hot-curing, wherein a surface of the device provided with a terminal faces an opening of the cavity; and preparing a second dielectric layer, wherein the device is embedded in the second dielectric layer, and a surface of the second dielectric layer is higher than a surface of the terminal by a preset value.

Abstract: A stretchable display device comprises a display panel that includes a stretchable substrate where a plurality of emission elements is disposed, wherein the stretchable substrate is stretchable in at least one of a first direction and a second direction perpendicular to the first direction; a printed circuit film that includes a first driving circuit chip generating a drive control signal to be applied to the display panel and a second driving circuit chip receiving image data from outside and transferring the image data to the first driving circuit chip, wherein the printed circuit film is stretchable in at least one of the first direction and the second direction with respect to a stretch direction of the display panel.

Abstract: A display device includes a base substrate including a display area and a non-display area at a periphery of the display area; a first signal wiring on the non-display area of the base substrate and including a first wiring part and a second wiring part connected to the first wiring part; and a printed circuit board including a lead wiring on the first signal wiring. The second wiring part includes an open part passing through a surface of the second wiring part in a thickness direction, the second wiring part includes a long side extending along a first direction and a short side extending along a second direction intersecting the first direction, and a separation distance between the open part and an end of the short side of the second wiring part in the first direction is within about 0.4 times the long side of the second wiring part.

Abstract: A flexible circuit board, a method for manufacturing the flexible circuit board, and a display device are provided. The flexible circuit board includes: a plurality of driving signal lines arranged with mutually insulate-gates, wherein the driving signal lines comprise at least two voltage signal lines arranged adjacent to each other; at least one isolation protecting line, the isolation protecting line being located between the two voltage signal lines arranged adjacent to each other.

Abstract: A circuit board according to an embodiment includes: a substrate including one surface and the other surface; a first circuit pattern disposed on the one surface; and a second circuit pattern disposed on the other surface, wherein at least one via is formed in the substrate, and the first circuit pattern and the second circuit pattern are wire-bonded through the via to conduct electricity.

Abstract: A printed circuit board includes: a first insulating layer; a via pad including a first layer embedded in the first insulating layer and a second layer disposed on the first layer; and a first via layer disposed on the via pad, wherein the second layer has a width decreasing in a direction away from the first layer in a stacking direction of the first and second layers.

Abstract: A method for manufacturing a flex inlay is provided. The method includes providing a flexible printed circuit having opposed surfaces. The method includes attaching components to a surface of the flexible printed circuit. The method includes applying a coverlay over at least one surface of the flexible printed circuit, wherein the coverlay is patterned to not cover any components attached to the surface of the flexible printed circuit. The coverlay at least in part forms an essentially planar surface of the flex inlay.

Abstract: A security apparatus for securing a portable electronic device to an immovable object includes a locking head having a base and a compressible element supported by the base. The locking head is adjustable between an unlocked configuration, in which the compressible element is uncompressed and insertable into and removable from an opening of the portable electronic device, and a locked configuration, in which the compressible element is compressed and secured within the opening of the portable electronic device.

Abstract: A photosensitive insulating paste according to preferred embodiments of the present disclosure contains glass frit, a first inorganic filler, a second inorganic filler, an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, and a solvent. The first inorganic filler has a refractive index of 1.7 or higher. The second inorganic filler has a refractive index of 1.55 or lower. An electronic component according to preferred embodiments of the present disclosure is produced by using the photosensitive insulating paste.

Abstract: A wiring substrate includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on the insulating layer, a connection conductor penetrating through the insulating layer and connecting the first and second conductor layers, and a coating film formed on a surface of the first conductor layer and adhering the first conductor layer and the insulating layer. The first conductor layer includes a conductor pad in contact with the connection conductor such that the conductor pad has a surface having a first region and a second region on second conductor layer side and that surface roughness of the first region is different from surface roughness of the second region, and the conductor pad of the first conductor layer is formed such that the first region is covered by the coating film and that the second region is covered by the connection conductor.

Abstract: A dielectric layer for manufacturing a component carrier is described. The dielectric layer includes a first section including a first material having a first material property; and a second section including a second material having a second material property. The second material property is different from the first material property. A method for manufacturing such a component carrier and a component carrier including such a dielectric layer is further described.