Abstract: A superconducting apparatus is provided with windings having superconducting wires wound in a plurality of turns, and a cryostat housing the windings so as to cool the windings in a superconducting state. The superconducting wires disposed at the outer and inner peripheral areas of the windings are selected to be highly stabilized superconducting wires such that, even if frictional heat is conducted towards the windings, the highly stabilized superconducting wires are very less quenched and in turn the possibility of the quenching of the overall windings is extremely low. Further, good heat conductors are provided on the radially outer and inner of the windings. Frictional heat which flows towards the windings is transmitted into the good heat conductors in the circumferential direction, and is dissipated midway during the heat conduction. As a result, the introduction of the frictional heat into the windings is avoided and in consequence no quenching occurs in the superconducting wires.

Abstract: A cochlear prosthetic package having a cup-shaped titanium case with a ceramic plate; a plurality of hermetically-sealed feedthroughs are formed in the plate by sintering the plate with hollow metallic tubes located in plate holes and then sealing at least one end of each tube. An electrode cable connector is provided which allows removal and replacement of a case even in the presence of body fluids. A telemetry coil is contained in a metallic tube which extends out of the case; the coil-containing tube has its two ends hermetically-sealed to the case by ceramic insulating bushings.

Abstract: A multi-layer printed circuit board with self-contained printed resistors includes an undercoat layer made of an insulating material and formed on an outermost conductor circuit at least except for a ground portion of the outermost conductor circuit; an electro-magnetic wave shield layer made of a cured copper paste and formed on the undercoat layer and the ground portion of the outermost conductor circuit so as to cover a generally entire surface of the outermost conductor circuit; and protective overcoat covering an outer surface of the shield layer.

Abstract: A thick film hybrid arrangement has a plurality of ceramic foils provided with conductor paths and superimposed over one another, a support for supporting the ceramic foils, and a plurality of thin metal lugs located between the ceramic foils for contacting the conducting paths. The metal lugs extend outwardly beyond at least the ceramics foils so as to form outer contacts.

Abstract: A printed wiring board shielded from electromagnetic wave radiation has a conductive circuit pattern formed on an insulating substrate, a first insulating layer disposed over the circuit pattern, a jumper wire formed over the first insulating layer and between connecting terminals of the conductive pattern, a second insulating layer covering the jumper wire and the first insulating layer, and an electromagnetic wave shielding layer disposed over the conductive pattern. The jumper wire is formed by printing using a conductive paste containing a conductive material such as silver, carbon or copper. The shield layer is formed by printing using a conductive metal resin paste such as copper. An overcoat layer is applied over the shield layer to protect the shield layer.

Abstract: A rigid-flex printed circuit board having a rigid section and a flexible section extending from the rigid section is disclosed. The rigid-flex printed circuit board is capable of withstanding high temperatures experienced in high volume production environments utilizing infrared reflow ovens by providing spacers and covers for protecting the flexible section from high temperatures. A process for assembling components and devices on the rigid-flex printed circuit board in a high volume production environment utilizing infrared reflow ovens is also disclosed.

Abstract: A multilayer printed circuit board on which integrated circuit chips may be directly mounted has holes at predetermined locations, electrical connections between a chip and conductive layers of the circuit board being accomplished via the holes. The electrical connections are in the form of bump members which protrude outwardly from the circuit board. The bump members cooperate with an electrically conductive plating layer or filler that is in intimate contact with a conductive layer(s) exposed in the formation of each hole.

Abstract: This invention relates to superconducting magnetic storage (SMES) apparatus made of repetitious modular units or modules which support a superconducting electrical magnet and a fluid and which are capable of efficient load transfer and are mass producible. The invention also relates to a method for making a modular SMES apparatus.

Abstract: An article for tape-automated bonding of integrated circuit microchips comprises a carrier sheet (22) carrying conductive tracks (23) with a tubular metal formation (21) passing through the sheet at the end of each track for connection to a microchip (24). The tubular formations tend to accommodate irregularities in the chip and may contain solder or other metal having a lower melting point than the tubular formation to effect bonding.

Abstract: A durable polymeric bearing is provided for a rotatable support insulator. The bearing is of sufficient conductivity to permit the flow of leakage current and capacitive charging current through the bearing. Thus, tracking across and/or deterioration of the bearing is avoided since insufficient voltage is developed across the bearing to cause any deleterious effects.

Abstract: In a substrate member (e.g., circuit board), a plurality of openings (15) are formed in an insulating film (14) which covers electric lines (12) formed on a substrate 11, with pad constructing (contacting) portions (13) of selected ones of the electric lines being exposed. In one example, the pad constructing portion (that portion of the pad to which final connection is to occur, e.g., by solder to a semiconductor device), is set to a first dimension (e.g., length) having a dimension less than a corresponding dimension of the original length. The film openings are also set to another dimension having an allowance size larger than a corresponding dimension of the pad constructing portion. The opening is thus of sufficiently large size in comparison to the respective pad being exposed so as to assure effective tolerance compensation for film positioning deviations in at least two (e.g., X and Y) directions as might occur during production of the substrate member.

Abstract: The invention relates to systems and methods for the manufacture of flexible printed wiring (FPW) harnesses of unlimited length three dimensions. In preferred embodiments, in-line raster scanning (e.g., xerography or laser printing) is used to image continuously updated conductor patterns on an uninterrupted (i.e., seamless) web-fed base material, or substrate With in-line manufacturing, an FPW harness equivalent to a discrete RWH of unlimited dimension can be fabricated.

Abstract: A printed wiring board for forming an electric connection to an external device. The printed wiring board comprises a base material, and at least one connecting terminal formed on the base material for forming an electrical connection to an external device. A solder resist layer is formed on at least a portion of the base material surface excluding a connecting terminal forming region. A conductive protective layer is formed over the connecting terminal forming region and covers the connecting terminal. The end portion of the solder resist layer is separated from the end portion of the conductive protecting layer. An overcoat layer is formed on the separating portion for bridging the end portion of the solder resist layer and the end portion of the conductive protecting layer.

Abstract: A resin circuit substrate includes: a plurality of electronic parts having electrodes to be electrically connected to each other, with surfaces of the electrodes being disposed flush with each other; a resin for integrally molding surfaces of the electronic parts other than the surfaces of the electrodes so that the electronic parts are retained with the resin; and a circuit pattern for electrically connecting the electrodes to each other, the circuit pattern being laminated on exposed surfaces of the electrodes.

Abstract: An interlayer connection structure for an integrated circuit includes a substrate, a first level horizontal conductor formed on the substrate, an interlayer insulator formed to cover the first level conductor, a second level horizontal conductor formed on the interlayer insulator, and a vertical conductive pillar extending through the interlayer insulator for interconnecting the first level horizontal conductor and the second level horizontal conductor. The vertical conductive pillar has a side surface coplanar with a longitudinal side surface of the first level horizontal conductor at a position where the vertical conductive pillar is in electric contact with the first level horizontal conductor.

Abstract: A high density of interconnection sites on a dielectric substrate is provided by producing a laminated assembly with multiple layers of conductors (11, 21) positioned one above the other within the substrate (8). Each conductor (11, 21) terminates at a raised feature (12, 22) projecting beyond the surface of the substrate (8) for connection in an electrical circuit. This permits the conductors (11, 21) to be positioned in the same plane perpendicular to the substrate (8) so that two rows of termination pads (12, 22) may be provided without leaving space between the pads of one for the conductors of the other. Efficient, high speed impedance matching may be accomplished by the addition of a grounding conductor (26) between two signal layers of circuitry within the substrate, also provided with raised features (27) extending to the exterior of the substrate (8).

Abstract: A hermetic package for an electronic device is manufactured by providing a green glass ceramic body with a green via to produce a workpiece. The workpiece is sintered at a temperature at or above 500.degree. C., while compressing the workpiece at a pressure at or above 100 pounds per square inch, so as to obtain a hermetic package. The green via comprises a mixture of copper and a glass ceramic material with a sufficient volume of glass to produce a hermetic package, yet with sufficient copper to have a suitable electrical conductivity.The hermetic package thus produced comprises a sintered glass ceramic body having an electrically conductive sintered via which is hermetically bonded to the glass ceramic body and which comprises a mixture of an electrically conductive material and a glass ceramic material. The electrically conductive material forms at most 50 volume percent of the via.The workpiece may be sintered in a sintering fixture having a frame and a compensating insert.

Abstract: Improved printed circuit boards and methods of soldering them are provided in which a snap bar is provided on the conductor side of a printed circuit board for reducing defects, such as bridging, during soldering. This and other provided process and design techniques, such as lead lengths, orientation, mask finish, and the location of the leads on the board, have significantly reduced reworking and defective components and are especially effective when applied to 50 mil connector products.

Abstract: A circuit board having holes (a) and holes (b) therein with different electrically connecting structures and enlarged connecting areas with respect to an insulating substrate and circuit conductors formed on the insulating substrate is excellent in connection reliability and high in wiring density.

Abstract: Disclosed is a flexible circuit board comprising a pair of conductive films and an insulating adhesive layer sandwiched therebetween. The adhesive layer contains conductive powder in such a concentration that no leakage current occurs between the films. For the production of the flexible circuit board, the adhesive layer is first formed on at least one of the conductive layers and then the conductive layers are bonded with the adhesive layer therebetween. For the formation of a through hole portion in the board, pressure is applied at a predetermined spot on the board throughout the thickness thereof, to form recesses on both sides thereof, thereby compressing the corresponding portion of the adhesive layer. This increases the concentration of the conductive powder contained therein, which causes the adhesive layer between the recesses to be conductive and serve as a through hole portion for electrically connecting the two conductive films.