Abstract: A novel ceramic green tape composition useful in the manufacture of silver conductor based, low temperature, co-fired multilayer circuit boards comprises from about 8-35% by weight of a calcium-zinc-aluminum-borosilicate devitrifying glass; from about 10-35% by weight of a low alkali borosilicate glass; from about 10-35% by weight of a lead-zinc-aluminosilicate glass; from about 10-35% by weight of a ceramic filler; up to 0.5% by weight of a coloring agent and from about 20-45% by weight of an organic binder. The co-fired multilayer circuit boards made from these green tape compositions have excellent mechanical and electrical properties and have thermal expansion characteristics matching that of silicon.The devitrifying glass comprises from about 10-30% by weight of zinc oxide; from about 10-20% by weight of calcium oxide; up to about 15% by weight of boron oxide; from about 15-20% by weight of aluminum oxide and about 25-55% by weight of silicon oxide.

Abstract: A multi-chip module interconnect structure is configurable for a desired application. A power/ground layer and one of two signal interconnect layers have a fixed metal pattern and are generated once for multiple applications. A second signal interconnect layer and a bond pad layer are custom designed for the particular application. The fixed interconnect layer has a repeating pattern of horizontal metal strips in rows and of three different lengths. The end points of each row of strips are staggered to increase routeability by reducing vertical blockage. Power distribution and ground rails are periodically positioned in the repeating pattern to provide current to the power/ground layer. A custom router generates the second signal interconnect layer for the particular application involved.