Patents Examined by Tsz Chan
  • Patent number: 10256028
    Abstract: A buildup board structure incorporating magnetic induction coils and flexible boards is disclosed. The buildup board structure includes at least one first, second and third buildup bodies modular and stackable. Any two adjacent buildup bodies are separated by a covering layer provided with a central hole for electrical insulation. All central holes are aligned. Each buildup body includes a plurality of flexible boards, and each flexible board is embedded with a plurality of magnetic induction coils surrounding the corresponding central hole and connected through connection pads. The first, second and third buildup bodies are easily laminated in any order by any number as desired such that the effect of magnetic induction provided by the magnetic induction coils embedded in the buildup board structure are addable to greatly enhance the overall effect of magnetic induction.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: April 9, 2019
    Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
    Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin
  • Patent number: 10236113
    Abstract: A device includes a printed circuit board (PCB). The device may also include a high voltage coil disposed on the PCB and a low voltage coil disposed on the PCB. Further, a conductive shield forms a three-dimensional enclosure around the high voltage coil and confines an electric field generated by the device to the PCB.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: March 19, 2019
    Assignee: General Electric Company
    Inventors: Alan Carroll Lovell, Mark Eugene Shepard, Andrew David McArthur, Qin Chen, Todd David Greenleaf
  • Patent number: 10236115
    Abstract: An integrated transformer includes a primary winding and a secondary winding each having a spiral planar arrangement coils. A dielectric portion of dielectric material is interposed between the primary winding and the secondary winding. A field plate winding is electrically coupled with the primary winding. The field plate winding includes at least one field plate coil having a first lateral extension greater than a second lateral extension of a primary outer coil of the primary winding. The field plate coil is superimposed in plan view to the primary outer coil of the primary winding.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: March 19, 2019
    Assignee: STMicroelectronics S.r.l.
    Inventors: Vincenzo Palumbo, Gabriella Ghidini, Enzo Carollo, Fabrizio Fausto Renzo Toia
  • Patent number: 10210992
    Abstract: An apparatus of coupled inductors includes a first coil and a second coil arranged in a way that an inter-coil capacitance between the first coil and the second coil can keep electromotive forces induced by a first inductance of the first coil and a second inductance of the second coil about the same. As the current bypasses an unbalanced parasitic capacitor, a compensation capacitor disposed between the two coils can compensate the inter-coil capacitance of the parasitic capacitor. The apparatus of coupled inductors implemented with a specific coil arrangement or disposed with the compensation capacitor can keep the EMFs induced over the two inductances equal in amplitude, which prevents both the differential-mode and common-mode interference from being converted, improving the characteristics of mode conversion and is suitable to be utilized in a PoE system or the like.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: February 19, 2019
    Assignee: CYNTEC CO., LTD.
    Inventor: Chia-Cheng Chuang
  • Patent number: 10210985
    Abstract: A coil component includes a body including coil patterns and a plurality of trenches; and external electrodes electrically connected to the coil patterns. The plurality of trenches include a magnetic material, and at least one edge of a trench disposed outside of an outermost coil pattern among the coil patterns has a same shape as an outside boundary portion of the outermost coil pattern adjacent thereto.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: February 19, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hwan Yang, Seok Il Hong, Young Seuck Yoo
  • Patent number: 10204728
    Abstract: A variable inductance inductor includes an inductor unit having a coil pattern; and at least one inductance controlling unit configured to vary a contact area between the coil pattern and a moveable conductor unit to change a current path.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: February 12, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Mi Ran Hwang, Seong Jong Cheon
  • Patent number: 10199163
    Abstract: A ground-side coil unit is provided with: a magnetic material plate disposed adjacent to a power transmission coil that transmits electric power to a power reception coil in a wireless manner; and a first filter coil disposed facing the power transmission coil with the magnetic material plate interposed therebetween. The first filter coil is disposed in a position where a magnetic flux generated by the first filter coil cancels out a magnetic flux generated by the power transmission coil in the magnetic material plate.
    Type: Grant
    Filed: April 8, 2015
    Date of Patent: February 5, 2019
    Assignee: NISSAN MOTOR CO., LTD.
    Inventors: Yuji Naruse, Yuusuke Minagawa
  • Patent number: 10199154
    Abstract: A coil component and a method of manufacturing the coil component are provided. The coil component includes a coil part, a body, and an electrode. The coil part includes a support member, a first coil layer disposed on one surface of the support member, and a second coil layer disposed on the first coil layer. The body includes a magnetic material covering the coil part. The electrode is disposed on the body and is connected to the coil part. The first and second coil layers may each include an insulating layer having a pattern in a planar coil shape and a conductor layer disposed in the pattern and including a seed layer and a plating layer. Additionally, seed layers of the first and second coil layers may be disposed differently in the conductor layers of the first and second coil layers.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: February 5, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seok Il Hong, Jae Yeol Choi, Jong Bong Lim, Ju Hwan Yang
  • Patent number: 10199150
    Abstract: The power transmission tower mounted series injection transformer (TMIT) injects impedance and/or voltage on a transmission tower power line. A tension bearing tower uses vertical and horizontal insulators to support and stabilize the TMIT. The TMIT can be much heavier than a transformer device clamped to the high-voltage transmission line. The TMIT is connected in series with the tension bearing tower's jumper allowing it to use a multi-turn transformer. By operating at the line voltage potential, the TMIT does not require the large bushings and oil drums used by sub-station injection transformers.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: February 5, 2019
    Assignee: Smart Wires Inc.
    Inventors: Joe Carrow, Ali Farahani, Haroon Inam, David Munguia, Amrit Iyer, Debrup Das, Arthur Kelley
  • Patent number: 10199952
    Abstract: A quad-T transformer in some embodiments includes a first split winding, a second split winding, and two orthogonal closed-loop windings coupled between the first split winding and the second split winding. Wires can be wound around magnetic cores. A first of the two orthogonal closed-loop windings is coupled to a first portion of each of the first split winding and the second split winding. A second of the two orthogonal closed-loop windings is coupled to a second portion of each of the first split winding and the second split winding. A bi-directional single-phase/three-phase converter includes the quad-T transformer and a Scott-T transformer with an output connected to a three-phase connection. The Scott-T transformer also has a 90-degree input connected to the quad-T transformer and a zero-degree input connected to a single-phase connection.
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: February 5, 2019
    Assignee: The Boeing Company
    Inventors: Suhat Limvorapun, Randy L. Brandt
  • Patent number: 10192673
    Abstract: An inductor includes a body including a coil part therein. The coil part includes a support member and first and second coil patterns respectively formed on an upper surface and a lower surface of the support member, and 1.15?b/a?1.45, where a is a length from a central plane between the upper surface and the lower surface of the support member to an upper surface of the body, and b is a length from the central plane of the support member to a lower surface of the body.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: January 29, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Yoon, Dong Hwan Lee, Young Ghyu Ahn
  • Patent number: 10192951
    Abstract: An inductor element is formed in a multiple layer lead structure including a lead, an insulative layer that insulates leads above and below, and a via provided in the insulative layer and connecting leads above and below wherein lead layers are multiply laminated layers, characterized in that: at least a portion of at least a pair of vertically adjacent leads are coiled leads; the coiled leads are connected in series, wherein current directions of vertically adjacent coiled leads are the same by a via provided on an end portion thereof, and form a serial inductance; and an inter-lead capacitance of the vertically adjacent coiled leads is larger than an inter-lead capacitance between other coiled leads formed in the same lead layer.
    Type: Grant
    Filed: February 5, 2018
    Date of Patent: January 29, 2019
    Assignee: Renesas Electronics Corporation
    Inventors: Kenichiro Hijioka, Akira Tanabe, Yoshihiro Hayashi
  • Patent number: 10186364
    Abstract: An electronic device includes a first planar inductor and a second planar inductor. The first planar inductor includes at least a first ring structure and a second ring structure interconnected electrically for generating a first magnetic field having a first direction and a second magnetic field having a second direction respectively, wherein the first direction is different from the second direction. The second planar inductor includes at least a third ring structure and a fourth ring structure interconnected electrically for generating a third magnetic field having a third direction and a fourth magnetic field having a fourth direction respectively, wherein the third direction is different from the fourth direction. The first ring structure at least partially overlaps the third ring structure to form a first overlap region, and the second ring structure at least partially overlaps the fourth ring structure to form a second overlap region.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: January 22, 2019
    Assignee: Realtek Semiconductor Corp.
    Inventors: Hsiao-Tsung Yen, Kai-Yi Huang, Yuh-Sheng Jean, Ta-Hsun Yeh
  • Patent number: 10186371
    Abstract: A magnetic field generation apparatus includes a plurality of coplanar inductors disposed to form a planar structure, wherein each of the coplanar inductors is configured to generate a magnetic field having a basis vector that is orthogonal to a basis vector of a magnetic field generated by another one of the coplanar inductors.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: January 22, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Nikolay Nikolaevich Olyunin, Ki Young Kim, Keum Su Song, Mikhail Nikolaevich Makurin
  • Patent number: 10176919
    Abstract: An electrical system (1) for a three-phase alternating current network, comprising a transformer (20U, 20V, 20W) with a primary side (30U, 30V, 30W) and a secondary side for each phase (U, V, W) of the alternating current network; a separate transformer housing (60U, 60V, 60W) for each transformer (20U . . . W); and a switching assembly (100) connected to the transformers (20U . . . W); wherein the primary side (30U . . . W) and/or the secondary side has a main winding (21, 22, 23) and a regulating winding (31, 32, 33) in each phase; the switching assembly (100) is designed such that it can connect each regulating winding (31, 32, 33) with each of the main windings (21, 22, 23); and the switching assembly (100) is arranged in one of the transformer housings (60U . . . W) or in an own switch housing (70).
    Type: Grant
    Filed: December 3, 2014
    Date of Patent: January 8, 2019
    Assignee: MASCHINENFABRIK REINHAUSEN GMBH
    Inventors: Laurenc Kirchner, Matthias Spaeth, Stanislav Sheiko
  • Patent number: 10170236
    Abstract: A coil unit includes: a first case; a second case; a ferrite plate; a coil; a shield member; and a seal member. The ferrite plate, the coil and the shield member are arranged inside an accommodation space. The first case includes a first plate portion, a first circumferential wall portion and a first joint face. The second case includes a second plate portion, a second circumferential wall portion, a second joint face, a protruding portion and a through-hole. At least part of a portion at which the first joint face and the second joint face are joined with each other is located closer to the second plate portion than the ferrite plate. An inner periphery of the second case, which defines the through-hole, includes a large-diameter portion and a small-diameter portion respectively provided at both ends. The seal member is arranged inside the large-diameter portion.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: January 1, 2019
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventor: Taiga Doi
  • Patent number: 10170229
    Abstract: There is provided a chip electronic component including: an insulating substrate; a first coil part disposed on one surface of the insulating substrate; a second coil part disposed on the other surface of the insulating substrate opposing one surface of the insulating substrate; a via connecting the first and second internal coil parts to each other while penetrating through the insulating substrate; first and second via pads disposed on one surface and the other surface of the insulating substrate, respectively, so as to cover the via; and a first dummy pattern disposed in a region of one surface of the insulating substrate adjacent to the first via pad and a second dummy pattern disposed in a region of the other surface of the insulating substrate adjacent to the second via pad.
    Type: Grant
    Filed: April 21, 2015
    Date of Patent: January 1, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin Jeong
  • Patent number: 10163559
    Abstract: A terminal electrode includes a base extending along the outer end face of a flange, a mounting part extending from the base along the bottom face of the flange via a first bending part that covers the edge portion where the outer end face and the bottom face meet, and a wire connection part extending from the base along a substantially horizontal face via a second bending part that covers the edge portion where the outer end face and the substantially horizontal face meet, the wire connection part being electrically connected to an end portion of a wire.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: December 25, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akio Igarashi, Takashi Murakami, Koji Onishi
  • Patent number: 10163563
    Abstract: Provided is a reactor in which an accessory member that is attached to the reactor is integrated with an assembly. The reactor includes an assembly of a coil having a winding portion and a magnetic core and an accessory member that is attached to the assembly. In this reactor, an outer core portion of the magnetic core is made of a composite material obtained by dispersing soft magnetic powder in a resin, the outer core portion protruding from the winding portion, and the accessory member includes an embedded portion that is embedded in the outer core portion and a functional portion that protrudes outward from the outer core portion.
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: December 25, 2018
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Seiji Shitama, Masayuki Kato, Kouji Nishi, Kazuhiro Inaba
  • Patent number: 10148172
    Abstract: A power supply module is disclosed. The power supply module includes: a coil including a coil body and connecting ends; electronic components including at least an integrated circuit chip; a magnetic core which encloses the coil body, wherein at least one side of the magnetic core has a cavity provided therein, and the at least one electronic component is positioned in the cavity; a connector, which abuts against the side of the magnetic core having the cavity therein, covers the surface of the side, and is electronically connected to the coil and the electronic components. The power supply module is able to reduce the damage to the integrated circuit chip, decrease electromagnetic interferences and achieve an excellent cooling effect.
    Type: Grant
    Filed: February 26, 2013
    Date of Patent: December 4, 2018
    Assignee: Sumida Electric (H.K.) Company Limited
    Inventors: Douglas James Malcolm, Yanfei Liu, Guoping Zhang, Zhuo Wu, Hongnian Zhang, Xinliang Luo