Patents Examined by Tu Hoang
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Patent number: 7183891Abstract: A voltage variable material (“VVM”) including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid FR-4 laminate, a polyimide, a polymer or a multilayer PCB via a process such as screen or stencil printing. In one embodiment, the VVM includes two types of conductive particles, one with a core and one without a core. The VVM can also have core-shell type semiconductive particles.Type: GrantFiled: October 5, 2004Date of Patent: February 27, 2007Assignee: Littelfuse, Inc.Inventors: Edwin James Harris, Tushar Vyas, Timothy Pachla, James A. Colby
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Patent number: 7183892Abstract: Chip PTC thermistors that can easily be inspected the soldered portions after it is mounted on a printed circuit board and that can be used in a flow soldering process, and methods of making same. A chip PTC thermistor of the present invention includes: a first main electrode and a first sub-electrode on first surface of a cuboidal form conductive polymer having the PTC characteristics, a second main electrode and a second sub-electrode on a second surface opposite the first surface of the conductive polymer. Between the first sub-electrode and the second sub-electrode, and between the first sub-electrode and the second main electrode are electrically connecting with a first side electrode and a second side electrode, respectively.Type: GrantFiled: July 19, 2004Date of Patent: February 27, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Junji Kojima, Kohichi Morimoto, Takashi Ikeda, Toshiyuki Iwao
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Patent number: 7183893Abstract: A tunneling magnetoresistive stack includes a first ferromagnetic layer, a tunnel barrier layer on the first ferromagnetic layer, and a second ferromagnetic layer on the tunnel barrier layer. The tunneling magnetoresistive stack exhibits a negative exchange coupling between the first ferromagnetic layer and the second ferromagnetic layer indicating that the tunneling magnetoresistive stack has a high quality tunnel barrier layer.Type: GrantFiled: February 4, 2004Date of Patent: February 27, 2007Assignee: Seagate Technology LLCInventors: Peter Hampden Clifton, Eric Walter Singleton, David James Larson, Brian William Karr, Kristin Joy Duxstad
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Patent number: 7180931Abstract: An apparatus and method for controlling an electroslag remelting furnace comprising adjusting electrode drive speed by an amount proportional to a difference between a metric of electrode immersion and a set point, monitoring impedance or voltage, and calculating the metric of electrode immersion depth based upon a predetermined characterization of electrode immersion depth as a function of impedance or voltage.Type: GrantFiled: May 25, 2004Date of Patent: February 20, 2007Assignee: Sandia CorporationInventors: David K. Melgaard, Joseph J. Beaman, Gregory J. Shelmidine
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Patent number: 7180036Abstract: A temperature control system having a re-circulation loop that uses valves to selectively circulate a temperature control fluid through a cooling system, through a heating system, or through a through passage so as to controlling the temperature of the temperature control fluid, which, in turn, controls the temperature of a target. A temperature sensor monitors the target's temperature. A controller controls valve operation in response to the temperature measured by the temperature sensor to obtain a predetermined target temperature. Beneficially, the controller controls the target's temperature according to a predetermined temperature profile. Continuous etching along a predetermined temperature profile is possible.Type: GrantFiled: November 8, 2004Date of Patent: February 20, 2007Assignee: Oriol, Inc.Inventor: Boris Atlas
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Patent number: 7176781Abstract: A resistor formed on a material layer of a semiconductor integrated circuit and a method for forming the resistor. The resistor comprises a region of resistive material with a plurality of conductive contacts or plugs in electrical contact with and extending away from the resistive material. A first and a second interconnect line are formed overlying the plugs and in conductive contact with one or more of the plurality of plugs, such that a portion of the resistive material between the first and the second interconnect lines provides a desired resistance. According to a method of the present invention, the plurality of conductive contacts are formed using a first photolithographic mask and the first and the second interconnect lines are formed using a second photolithographic mask. The desired resistance is changed by modifying the first or the second mask such that one or more dimensions of a region of the resistive material between the first and the second interconnect lines is altered.Type: GrantFiled: September 29, 2004Date of Patent: February 13, 2007Assignee: Agere Systems IncInventors: Daniel Charles Kerr, Roger W. Key, Bradley J. Albers, William A. Russell, Alan Sangone Chen
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Patent number: 7173512Abstract: A thermistor of which resistance is changed depending on temperature and a secondary battery to which the thermistor is attached are disclosed. The thermistor is attached to an object via a lead which is made of different kinds of materials. The lead is configured so that a part of the lead to be united to the thermistor electrode is mainly made of the same material as the electrode and a part of the lead to be united to the object is mainly made of the same material as the surface of the object. Thus, the thermistor may be simply attached to the object only using the ultrasonic welding, thereby remarkably reducing junction inferiorities.Type: GrantFiled: July 9, 2004Date of Patent: February 6, 2007Assignee: LG Cable, Ltd.Inventors: Chang-Mo Ko, Su-An Choi, Jun-Ku Han, An-Na Lee, Jong-Hwan Lee, Ju-Dam Kim, Jong-Ho Lee, Jong-Seo Yoon
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Patent number: 7173511Abstract: A thermistor, which is to be mounted on a PCB, for protecting other circuit elements is disclosed. Electrode patterns separately formed on both surfaces of a film resistance element are respectively shaped into two parts which are engaged to each other with a non-conductive gap interposed therebetween. Thus, a Tombstone phenomenon caused by asymmetric structure may be fundamentally prevented. Grooves are formed in both sides of the thermistor, and connection portions for electrically connecting the electrodes formed on both surfaces of the thermistor are formed through the inside of the grooves or through the sides except the grooves. Thus, though a crack arises in the connection portion, it is possible to prevent the crack from being propagated to the entire connection portion along the side of the thermistor.Type: GrantFiled: June 1, 2004Date of Patent: February 6, 2007Assignee: LG Cable Ltd.Inventors: Jun-Ku Han, Su-An Choi, Chang-Mo Ko, An-Na Lee, Jong-Hwan Lee, Ju-Dam Kim, Jong-Ho Lee, Dong-Hyun Kim
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Patent number: 7171253Abstract: An apparatus and method for determining a volume of tumor mass destroyed. The present invention includes a temperature probe and a laser probe having a temperature sensor. The laser probe and temperature probe are inserted to measure a temperature of the tumor mass and a temperature of tissue mass surrounding the tumor mass. By determining the volume of tumor mass destroyed, a graphical representation of the volume of tumor mass destroyed is provided whereby real-time visual monitoring of the destruction of the tumor mass is achieved.Type: GrantFiled: February 14, 2005Date of Patent: January 30, 2007Assignee: Kelsey, Inc.Inventor: Kambiz Dowlatshahi
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Patent number: 7170389Abstract: The present invention discloses a method of manufacturing a thin resistor with a moisture barrier by depositing a metal film layer on a substrate and depositing a layer of tantalum pentoxide film overlaying the metal film layer. The present invention also includes a thin film resistor having a substrate; a metal film layer attached to the substrate; and a tantalum pentoxide layer overlaying the metal film layer, the tantalum pentoxide layer providing a barrier to moisture, the tantalum pentoxide layer not overlaid by and oxidation process.Type: GrantFiled: February 19, 2002Date of Patent: January 30, 2007Assignee: Vishay Dale Electronics, Inc.Inventor: Stephen C. Vincent
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Patent number: 7167075Abstract: A dual resistor for eliminating the requirement for two different value resistors. The dual resistor includes a conditioning resistor at a high resistance value and a run resistor at a low resistance value. The run resistor can travel inside the conditioning resistor. The run resistor is capable of being advanced by a drive assembly until an electrical path is completed through the run resistor thereby shorting out the conditioning resistor and allowing the lower resistance run resistor to take over as the current carrier.Type: GrantFiled: December 3, 2004Date of Patent: January 23, 2007Assignee: Jefferson Science Associates, LLCInventors: Timothy Lynn Siggins, Charles W. Murray, Richard L. Walker
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Patent number: 7164343Abstract: A variable potentiometer with a wiper terminal and first and second terminals has relay switches for shorting or for unshorting resistors. When resistance is reduced between the wiper and one of said terminals, resistance is increased between the wiper and another terminal. In one embodiment two strings of resistors with the same nominal values are used between the wiper and the terminals. In another embodiment, a single string of resistors are used and are switched into either the electrical connection between the wiper and the first terminal or between the wiper and the second terminal. When resistance is lowered between the wiper and one of said first or second terminals a first resistor is replaced with a first short circuit and when resistance is increased between said wiper and another of said first and second terminals a second short circuit is replaced with the first resistor.Type: GrantFiled: November 17, 2004Date of Patent: January 16, 2007Assignee: Avistar, Inc.Inventors: Gary Kessler, Michael Garcia, Albert Migliori
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Patent number: 7164342Abstract: The present invention relates to a load sensor and provides a highly accurate load sensor with multi-layered wiring at low costs. It provides crystallized glass and non-crystalline glass which are best for a load sensor, and combines these to form multi-layered wiring, and further, makes a glass layer of composite type as needed, and reduces uneven printing in printing multiple layers with use of hardening type paste.Type: GrantFiled: August 7, 2003Date of Patent: January 16, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Keiichi Nakao, Yukio Mizukami, Hiroaki Ishida, Masaaki Katsumata
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Patent number: 7164341Abstract: A surface-mountable PTC thermistor element includes electrodes disposed on a top surface and a bottom surface of a thermistor element body, in which each of the electrodes is connected with a terminal respectively and each of the terminals is extended downward. An upper terminal is protected from being detached by a reaction force acting against pressing at the time of press-mounting the PTC thermistor element onto a surface of a substrate. A vertical-leg portion of the lower terminal is placed inside the thermistor element body in the radial direction from the outer edge of the thermistor element body. Preferably, the vertical-leg portion of the lower terminal is placed in the vicinity of the center of the thermistor element body.Type: GrantFiled: September 27, 2001Date of Patent: January 16, 2007Assignee: Murata Manufacturing Co., Ltd.Inventors: Takayo Katsuki, Takeo Haga
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Patent number: 7161460Abstract: A switching element provided with a foil construction includes a first supporting foil and a second supporting foil that are kept at a distance from one another via a spacer. The spacer has a recess in at least one active area of the switching element. A contact arrangement includes at least two electrodes and is arranged in the active area of the switching element so that an electrical current between the electrodes is established when both foil layers are pressed together. A structure made of an electrically nonconducting material is placed inside the active area of the switching element and prevents the electrodes from coming into contact in the area of the structure.Type: GrantFiled: August 27, 2002Date of Patent: January 9, 2007Assignee: IEE International Electronics & Engineering S.A.Inventor: Laurent Federspiel
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Patent number: 7161462Abstract: A resistor apparatus for containing broken pieces of an overheated resistor body is provided. The resistor apparatus includes a resistor body and a first and second lead wire electrically connected to opposite sides of the core. A gas permeable containment casing substantially encloses the resistor body and is fixed to the lead wires by fasteners, therefore maintaining the containment casing in a position substantially enclosing the resistor body. In the event that the resistor overheats and the resistor body breaks, the containment casing is maintained in a position to contain any pieces of the overheated resistor that break away, while allowing any gasses to escape, therefore preventing explosion of the containment casing and damage to surrounding apparatuses.Type: GrantFiled: January 6, 2004Date of Patent: January 9, 2007Assignee: Kanthal CorporationInventors: Brian M. Tierney, Gary G. Innocenti
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Patent number: 7161461Abstract: A trim resistor assembly includes a trimmable resistor element embedded within a polymeric housing. The trimmable resistor element includes trimmable resistive film disposed on a nonconductive substrate. Lead wires are connected to contact pads on the substrate. The resistor element and wires are pre-assembled and placed within a mold defining a cavity. The mold includes a pedestal that covers a central region of the substrate that includes the trimmable resistive film. A polymeric material is injected into the cavity to form an integrally molded body that is the polymeric housing. In addition to the trim resistor element and the bare end sections of the wires, the section of the wires that are adjacent the end sections and include the polymeric sheath are also embedded in the housing to strengthen and seal the joint. The pedestal forms an opening in the housing that exposes the resistive film to provide access for trimming the resistance to a desired value.Type: GrantFiled: March 7, 2006Date of Patent: January 9, 2007Assignee: Delphi Technologies, Inc.Inventor: Charles Scott Nelson
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Patent number: 7161459Abstract: In chip electronic components, the application state of conductive paste that makes side electrodes can be optically distinguished in the production of small-sized chip electronic components. The chip electronic component comprises a substrate, and side electrodes disposed at the end portions of the substrate. The lightness of an entire surface of the side electrode is not more than 6 as defined in JIS-Z8721.Type: GrantFiled: September 30, 2005Date of Patent: January 9, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Mitsuru Harada, Kazunori Omoya, Masato Hashimoto, Akio Fukuoka
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Patent number: 7157669Abstract: An electrical domestic appliance containing a main switch for turning the current power supply to the electrical domestic appliance on and off. The main switch having a predetermined turn-on time period during which the main switch must be actuated in order to move from the off-position to the on-position. The main switch predetermined turn-on period can be selected and adjusted by the customer through predetermined time limits.Type: GrantFiled: May 18, 2004Date of Patent: January 2, 2007Assignee: BSH Bosch und Siemens Hausgeraete GmbHInventors: Ursula Calis, Jose Ramon Garcia Jiménez, Thomas Lieb, Hans Seehuber, Bernd Stitzl
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Patent number: 7154374Abstract: Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations.Type: GrantFiled: June 1, 2004Date of Patent: December 26, 2006Assignee: AVX CorporationInventors: Andrew P. Ritter, Robert Heistand, II, John L. Galvagni, Sriram Dattaguru