Abstract: Provided is a coating system allowing on-demand preparation and coating of an ink. The coating system (10) includes an ingredient ink supply portion (20), a first pipe (90a), a stirring tank (50) including an ink stirring mechanism (52), a supply regulator portion (30) regulating the respective amounts of ingredient inks supplied to the stirring tank, a controller portion (70) connected to the supply regulator portion through an electric telecommunication line (80), determining a mixing ratio of the ingredient inks, and controlling operation of the supply regulator portion based on the mixing ratio, and a coating device (100) including an ink transport portion (120) connected to the stirring tank and including an ink discharge portion (130).

Abstract: An organic EL display includes: a first insulating layer on a lower side as well as a second insulating layer on an upper side, the first insulating layer and the second insulating layer being provided to a display region and a peripheral region; a first separation groove provided in the first insulating layer between the display region and the peripheral region; a first conductive layer provided on the first insulating layer in the peripheral region, with a side face and a bottom of the first separation groove in between; a covering section in which at least a part of an end face of the second insulating layer is covered by the organic layer or the second electrode; and a sealing section provided on an outer edge side of the covering section, and formed by laminating the first conductive layer and the second electrode.

Abstract: A light-emitting module which efficiently extracts light emitted from a light-emitting element is provided. Alternatively, a light-emitting module having lower power consumption or improved reliability is provided. A light-emitting module includes a window material having a light-transmitting property, a light-emitting element that emits light transmitted from a light-transmitting layer to the window material, and an optical bonding layer between the window material and the light-transmitting layer. The optical bonding layer includes a thick part overlapping the light-emitting element and a thin part surrounding the thick part. The light-transmitting layer, the optical bonding layer, and the window material are provided in decreasing order of refractive index.

Abstract: A semiconductor device includes: active fins protruding from an active layer and extending in a first direction; a gate structure on the active fins extending in a second direction intersecting the first direction; and a spacer on at least one side of the gate structure, wherein each of the active fins includes a first region and a second region adjacent to the first direction in the first direction, and a width of the first region in the second direction is different from a width of the second region in the second direction.

Abstract: A package includes a first and a second package component. The first package component includes a first metal trace and a second metal trace at the surface of the first package component. The second metal trace is parallel to the first metal trace. The second metal trace includes a narrow metal trace portion having a first width, and a wide metal trace portion having a second width greater than the first width connected to the narrow metal trace portion. The second package component is over the first package component. The second package component includes a metal bump overlapping a portion of the first metal trace, and a conductive connection bonding the metal bump to the first metal trace. The conductive connection contacts a top surface and sidewalls of the first metal trace. The metal bump is neighboring the narrow metal trace portion.

Abstract: A pixel electrode is connected to a drain electrode of TFT via a first aperture formed on a second interlayer insulating film, a second aperture, which includes a bottom portion of the first aperture and is formed on a common electrode, and a third aperture, which is included in the bottom portion of the first aperture and is formed on a first interlayer insulating film and a third interlayer insulating film. The common electrode is connected to a common wiring via a fourth aperture formed on the second interlayer insulating film, and a fifth aperture that is included in a bottom portion of the fourth aperture and is formed on the first interlayer insulating film, and a contact electrode that is formed in the fourth aperture and the fifth aperture.

Abstract: In a method of manufacturing an organic electroluminescent display, a substrate, in which a plurality of pixel areas is defined, is prepared, and first electrodes are formed in the pixel areas. Organic light emitting layers are formed on the first electrodes and a second electrode is formed on the organic light emitting layers. Resonant controllers are formed to control a resonant distance between each of the first electrodes and the second electrode. The resonant controllers are formed by providing solutions to at least two pixel areas, which emit lights having different colors, with a same amount in a one-to-one correspondence, and removing a solvent from the solutions. The solutions have different concentrations from each other.

Abstract: Packaged light emitting diodes (LEDs) and methods of packaging a LED include providing a first lead having a first recess in a bottom surface and a second lead having a second recess in a bottom surface, placing a LED die over a top surface of at least one of the first and the second leads, electrically connecting the LED die to the first lead and to the second lead, forming a package around the LED die that includes an opening in its upper surface exposing at least the LED die, and separating the package containing the LED die, the first lead and the second lead from a lead frame such that the package contains a first castellation and a second castellation in a side surface of the package, such that the castellations expose the leads and/or a first platable metal which is electrically connected to the leads.

Abstract: Provided is a coating system allowing on-demand preparation and coating of an ink. The coating system (10) includes an ingredient ink supply portion (20), a first pipe (90a), a stirring tank (50) including an ink stirring mechanism (52), a supply regulator portion (30) regulating the respective amounts of ingredient inks supplied to the stirring tank, a controller portion (70) connected to the supply regulator portion through an electric telecommunication line (80), determining a mixing ratio of the ingredient inks, and controlling operation of the supply regulator portion based on the mixing ratio, and a coating device (100) including an ink transport portion (120) connected to the stirring tank and including an ink discharge portion (130).

Abstract: An organic light emitting diode display includes: a substrate including a display area configured to display an image and a peripheral area surrounding the display area; a semiconductor layer at the display area on the substrate; a first gate insulating layer covering the semiconductor layer; a first gate wire on the first gate insulating layer; a second gate insulating layer covering the gate wire; a second gate wire on the second gate insulating layer; an interlayer insulating layer covering the second gate wire and having a contact hole, and a plurality of first dummy contact holes; a data wire on the interlayer insulating layer; a passivation layer covering the data wire; and an organic light emitting diode on the passivation layer and coupled to the data wire, wherein the data wire is coupled with the second gate wire through the contact hole in the interlayer insulating layer.

Abstract: There is provided a semiconductor device. The semiconductor device may include multiple contacts plugs, an insulation layer pattern, a metal oxide layer pattern, a metal pattern and a metal line. The contact plugs contact a substrate. The insulation layer pattern is formed between the contact plugs and has a top surface lower than those of the contact plugs. The metal oxide layer pattern is formed on the insulation layer pattern, and has a dielectric constant higher than that of silicon oxide. The metal pattern is formed on the metal oxide layer pattern and contacts sidewalls of the contact plugs. The metal line contacts top surfaces of the contact plugs and the metal pattern and extends thereon.