Patents Examined by Ula M Ruddock - Justia Patents Search

Patents Examined by Ula M Ruddock

Method of copper precipitation in lead-free solder, granulation and separation of (CuX)Sncompounds and recovery of tin

Patent number: 8163061

Abstract: A granulation method for granulating a (CuX)6Sn5 compound by passing a composition comprising a (CuX)6Sn5 compound and tin through a multi-perforated plate to granulate the (CuX)6Sn5 compound wherein X represents an element which is solved in Cu but forms a precipitate with Sn.

Type: Grant

Filed: July 20, 2009

Date of Patent: April 24, 2012

Assignee: Nihon Superior Sha Co., Ltd.

Inventor: Tetsuro Nishimura