Abstract: A solenoid system and method can include: providing an energizing voltage to a coil of a solenoid; providing an AC signal superimposed onto the energizing voltage; detecting current through the coil including an AC current amplitude induced by the AC signal and including a DC offset current amplitude; determining the AC current amplitude is a low AC current amplitude based on an armature within the solenoid being in a retracted position or determining the AC current amplitude is a high AC current amplitude based on the armature being in an extended position with the control logic, and where the AC current amplitude is determined utilizing the AC signal for synchronous demodulation; and determining a temperature fault based on the DC offset current amplitude falling below a DC offset current amplitude threshold.

Abstract: A compact fall detection sensor includes a case. A magnet is housed in the case. A reed switch with a pair of reeds are integrally positioned around the central axis of the case at the bottom of the case. In an upright state, the magnet is gravitationally positioned in the longitudinal direction of the reed switch around the central axis of the curved surface of the case, each magnetic pole magnetizing the corresponding reed of the reed switch, allowing one of the reeds to be magnetized to N pole and the other reed to S pole to turn on the switch. When inclined from the upright state, the magnet slides along the curved surface of the case and deviates from the central axis, to position only one of the magnetic poles of the magnet around the central axis to turn off the reed switch.

Abstract: Embodiments are directed to microscale and millimeter scale multi-layer structures (e.g. probe structures for making contact between two electronic components for example in semiconductor wafer and chip and electronic component test applications). Some embodiments of the invention provide structures that include a core and shell on at least one layer where the layer including the shell is formed from at least one core material and at least one shell material wherein the shell material is different from a shell material or a single structural material on at least one of an immediately preceding layer or an immediately succeeding layer and wherein the core material is different from any core material on at least one of an immediately preceding layer or an immediately succeeding layer.

Abstract: A PCB includes a plurality of layers spaced apart in a vertical direction, a first detection pattern and a second detection pattern and pads connected to the first detection pattern and the second detection pattern. The first detection pattern and the second detection pattern are provided in a respective one of a first layer and a second layer adjacent to each other such that the first detection pattern and the second detection pattern are opposed to each other. The pads are provided in an outmost layer. Each of the first detection pattern and the second detection includes at least one main segment extending in at least one of first and second horizontal directions and a diagonal direction. A time domain reflectometry connected to a pair of pads detects a misalignment of the PCB by measuring differential characteristic impedance of the first detection pattern and the second detection pattern.

Abstract: A measurement system and method tests for spurious emissions included in a signal transmitted from a mobile terminal in a shorter time than before. The system includes: a band division unit for dividing the measurement frequency band into a plurality of divided bands; a first spurious measurement control unit which causes a measurement device to measure the spurious emissions of the signal to be measured in each divided band and the peak power of the spear in each divided band; and a first pass/fail determination unit that determines whether or not pass determination criteria is satisfied. The first pass/fail determination unit determines whether the peak power does not exceed the threshold of the pass determination criteria in each divided band. The threshold value of the pass determination criteria is lower than the threshold of the standard determination criteria defined by the 3GPP standard.

Abstract: An inspection apparatus makes an inspection of electrical characteristics of an object to be inspected using a contactor brought into electrical contact with an electrode of the object to be inspected, the inspection apparatus including: a position adjusting unit including the contactor, a position adjusting section that adjusts a tip position of the contactor, and a load detecting section that detects a value of contact load between the contactor and the electrode; a position deriving section that derives an initial position of the contactor in a specific direction based on a relationship between an amount of contact displacement of the contactor in the specific direction and the value of contact load between the contactor and the electrode; and a movement performing section that moves the tip position of the contactor based on the initial position in the specific direction derived by the position deriving section.

Abstract: Apparatus and techniques for an integrated circuit (IC) package to automatically detect, through an input/out pin, external component parameters and parasitics. An example IC package generally includes a pin for coupling to a component external to the IC package, and at least one of a resistance detector, an inductance detector, or a capacitance detector coupled to the pin, and configured to detect at least one of a resistance, an inductance, or a capacitance, respectively, of a lumped parameter model for the component external to the IC package. The resistance detector, inductance detector, or capacitance detector may also be configured to detect parasitics associated with at least one of the component, the pin, or a connection between the component and the pin.

Abstract: In accordance with at least one aspect of this disclosure, a system can include a primary coil wound around a moveable magnetic core, at least one secondary coil wound in one continuous direction and magnetically coupled with the primary coil, and a controller operatively connected to determine a position of the moveable magnetic core and configured to detect a fault across the secondary coil.

Abstract: A system for testing a sensor and a hub is provided. The system includes a testing control device and a sensor testing device. The testing control device is configured to select a testing profile based at least in part on the sensor, and transmit a testing initiation signal based at least in part on the testing profile. The sensor testing device is configured to perform testing of the sensor and the hub in response to the testing initiation signal, the testing including rotating the sensor along at least one axis based at least in part on the testing profile, and transmit test data to the testing control device based at least in part on the testing of the sensor and the hub. The testing control device is configured to receive the test data from the sensor testing device.

Abstract: A system for detecting illicit objects contained in a piece of luggage includes a carriage defining a housing for receiving a piece of luggage and examination means placed at the inlet of the housing such that the introduction of the piece of luggage into the housing induces a relative displacement between the piece of luggage and at least one of the examination means and thus an automatic scanning of the piece of luggage by the examination means.

Abstract: A probe station includes a frame, a platform, a testing equipment, a probe holder and at least one probe. The frame defines an accommodation space. The platform is connected with the frame. The platform has an opening. The opening is communicated with the accommodation space. The testing equipment is at least partially disposed in the accommodation space and is at least partially exposed through the opening. The probe holder is disposed on the platform. The probe is held by the probe holder. The probe holder is configured to control the probe to contact with a device under test disposed on the testing equipment through the opening.

Abstract: A circuit system for measuring an electrical voltage. The circuit system includes a voltage divider, an integrating element and an evaluating unit. The voltage divider receives, at an input, a first signal that represents the electrical voltage to be measured, and has a first switching element and a second switching element, and is capable of assuming a first state, in which the first switching element is conductive and the second switching element is non-conductive, and a second state in which the first switching element is non-conductive and the second switching element is conductive, and outputs a second signal at an output that is situated between the first switching element and the second switching element. The integrating element is designed to receive the second signal and to output a third signal. The evaluating unit being set up to accept and to evaluate the third signal in order to determine a value for the electrical voltage.

Abstract: A system for determining the leakage current of a field effect transistor over temperature includes a metal oxide semiconductor field effect transistor (MOSFET) having first and second current terminals and a control terminal, wherein the first current terminal is coupled to a current measurement device. A switch is coupled to the control terminal and to a voltage source. The switch is configured to apply a voltage between a control terminal and a current terminal of the (MOSFET) responsive to a first signal, and apply approximately zero volts to the control terminal of the (MOSFET) responsive to a second signal.

Abstract: Embodiments relate to a test method for testing an unpopulated printed circuit board. The method can involve the steps of: exposing the unpopulated printed circuit board to temperatures of a reflow soldering process in a first step; and testing the electrical connections of the unpopulated printed circuit board. Embodiments also relate to a test device and a method for producing populated printed circuit boards.

Abstract: A board adapter device includes: a first adapter structure provided with a gold finger matched with a board of a target memory module, a second adapter structure provided with a connector matched with the gold finger, and a signal transmission structure including a first and second transmission module. The first transmission module is for connecting a data signal line, a clock signal line, an address signal line, and a control signal line of the gold finger to corresponding connecting lines of the connector. The second transmission module is configured to, when receiving a power input signal, convert the power input signal into a power output signal matched with a power supply of the target memory module, and transmit the power output signal to a power signal line of the connector.

Abstract: A temperature control system and method for devices under test and an image sensor-testing apparatus having the system are provided. The temperature control method for devices under test mainly comprises the steps of regulating the temperatures of a plurality of devices under test (DUTs) to a specific temperature in a temperature control zone; transferring the plurality of devices under test to a test plate and placing them into a plurality of test slots respectively; and measuring the temperatures of the device under test by the temperature-sensing elements in the test slots, wherein when at least one temperature-sensing element of the temperature-sensing elements detects that the device under test in the test slot corresponding to said at least one temperature-sensing element fails to meet the specific temperature, a temperature control element corresponding to the test slot regulates the temperature of the device under test.

Abstract: A semiconductor test device may include a chamber, a plurality of slots, a plurality of test boards and a plurality of temperature control modules. The slots may be arranged in the chamber. The test boards may be inserted into a part of the slots. The test boards may be configured to receive a plurality of semiconductor devices. The temperature control modules and the test boards may be alternately inserted into other parts of the slots. The temperature control modules may be configured to provide each of the test boards with air having a set temperature.

Abstract: Described herein is an electric injection annealing test device for crystalline silicon photovoltaic solar cells, the test device comprises a dark box, a sample test bench, a temperature control device, a power supply device and an image acquisition device. The sample test bench, the temperature control device, the power supply device and the image acquisition device are located in the dark box; the sample test bench is used to place a solar cell sheet; the temperature control device is used to control a temperature of the solar cell sheet; the power supply device provides a current to the solar cell sheet, the image acquisition device is used to acquire electroluminescence images of the solar cell sheet under different temperatures and current conditions.

Abstract: An embodiment is an automated test equipment (ATE) for testing a device under test (DUT) which is connected to the ATE via a load board. The ATE comprises a stimulus module, a measurement module, a loopback, a first switch, a second switch, and a load board interface. The load board interface comprises a first radio frequency port and a second radio frequency port. The first and second radio frequency ports are configured to be coupled to the respective ports of the load board. The first switch is configured to couple the first radio frequency port to the stimulus module in a first switching state of the first switch and the second switch is configured to couple the second radio frequency port to the measurement module in a first switching state of the second switch.

Abstract: An apparatus includes a tester chassis connected to a chassis electric reference potential for electrostatic discharge grounding of the tester chassis; a thermal head assembly coupled to the tester chassis, the thermal head assembly having a metallic thermal contact surface; and an electrical insulation arrangement disposed between the metallic thermal contact surface and the chassis electric reference potential to electrically insulate the metallic thermal contact from the chassis electric reference potential. An electrolytic corrosion protection system for the apparatus and a cable assembly for the apparatus.