Patents Examined by W. David Walkenhorst
-
Patent number: 6605779Abstract: The present invention protects a thin wire connection from oscillation of a resin protecting an electronic circuit module from vibration, impact, and corrosion. An electronic control unit including an electronic circuit module in which a bare chip is mounted on a circuit board and a case for housing the module, is provided, wherein the case is filled with a potting gel to protect the module. The bare chip, including its wire connection to the circuit board, is sealed in advance with a gelatinous resin having thixotropy prior to hardening. The gelatinous substance cures to form a hardened inner layer which has a penetration that is lower than that of the filled potting gel after hardening, and functions to eliminate or substantially reduce the affect of viscoelastic oscillation of the outer layer on the bare chip and the wire connection.Type: GrantFiled: October 5, 2001Date of Patent: August 12, 2003Assignees: Aisin Aw Co., Ltd., Kyocera CorporationInventors: Hiroki Takata, Kenji Suzuki, Naoto Ogasawara, Toshio Nagata
-
Patent number: 6605778Abstract: A circuit carrier (2) (printed circuit board 2) has two metallic outer layers (13, 14) and at least one metallic intermediate layer (11, 12). Insulating layers (8, 9) are arranged between the outer layers (13, 14) and the intermediate layer (11, 12). A component (3, 5) to be cooled and a cooling element (6, 7) are arranged on the outer layers (13, 14). The cooling element (6, 7) is thermally coupled to the component (3, 5) to be cooled via a heat conducting path. The heat conducting path runs partly in the intermediate layer (11, 12). Heat is transferred transversely in said path.Type: GrantFiled: October 2, 2001Date of Patent: August 12, 2003Assignee: Siemens AktiengesellschaftInventors: Helmut Dörfler, Heiko Mueller, Sebastian Raith
-
Patent number: 6600106Abstract: A telecommunications patch panel including a frame member defining a plurality of connector locations, the frame member including front and rear faces, and a first flange extending outwardly from the rear face including at least two tabs. Also included is a cable management member with first and second legs including notch portions and a cable bar coupled to the first and second legs. The notch portions on the cable management member may be engaged within the tabs located on the frame member so as to detachably couple the cable management member to the frame member.Type: GrantFiled: July 11, 2001Date of Patent: July 29, 2003Assignee: ADC Telecommunications, Inc.Inventors: Craig M. Standish, John David Schmidt
-
Patent number: 6596937Abstract: An electrically continuous conformal EMI protective shield for adhering directly to and conforming with surfaces of a printed circuit board is disclosed. The conformal EMI shield includes a thermally conductive dielectric coating adhering directly to surfaces of the printed circuit board to provide an electrically nonconductive, thermally conductive, contiguous coating that covers all such printed circuit board surfaces. The conformal EMI shield also includes a conductive coating adhering directly to surfaces of the dielectric coating to provide an electrically conductive layer that prevents electromagnetic emissions from passing through the conformal EMI protective shield.Type: GrantFiled: October 9, 2001Date of Patent: July 22, 2003Assignee: Hewlett-Packard Development Company, L.P.Inventor: Paul H. Mazurkiewicz
-
Patent number: 6596936Abstract: A plurality of H-shaped notches are formed on an end of a first shielding plate. Each notch has a pair of protrusions. Each protrusion has hooks on both sides. When a coil spring is fitted into each notch, the coil spring is first compressed so that a pitch thereof becomes narrower. Subsequently, the coil spring is fitted into the notch so that the coil spring encompasses the pair of protrusions. Each hook engages with the coil spring received in the notch, thereby preventing the coil spring from dropping out of the notch.Type: GrantFiled: July 23, 2001Date of Patent: July 22, 2003Assignee: NEC CorporationInventor: Masaru Deguchi
-
Sealing structure for highly moisture-sensitive electronic device element and method for fabrication
Patent number: 6590157Abstract: A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a partial seal (later to be filled) between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.Type: GrantFiled: September 21, 2001Date of Patent: July 8, 2003Assignee: Eastman Kodak CompanyInventors: Michael L. Boroson, John Schmittendorf, Peter G. Bessey, Jeffrey P. Serbicki -
Patent number: 6576839Abstract: A unique bond-ply structure and associated processes for processing of the bond-ply structure and for joining together circuit layer pairs which makes it possible to create a bond-ply having raised structures of conductive material which compensate for shrinkage during sintering thus creating a stress-free and void-free electrically conductive junction between layer-pairs in an interconnect.Type: GrantFiled: March 27, 2001Date of Patent: June 10, 2003Assignee: Honeywell International Inc.Inventors: Richard J. Pommer, Scott Zimmerman, Brad Banister
-
Patent number: 6576845Abstract: A window unit including a transparent window, at least two functional electric elements mounted on the transparent window, each of the functional electric elements being provided with an electrical contact face arranged on the window near the edge of the window, the electrical contact faces being distributed along the edge of the window, a flexible contact element mounted to the window at the edge of the window, having a shape tailored to the edge of the window, connecting the electrical contact faces, and covering the electrical contact faces, at least two conductors insulated from one another and arranged in the flexible contact element, and a circuit element supported by the flexible contact element, wherein the conductors are positioned to make electrical connection with at least one of the electrical contact faces of the functional electric elements covered by the flexible contact element and the circuit element.Type: GrantFiled: October 18, 2002Date of Patent: June 10, 2003Assignee: Saint-Gobain Glass FranceInventors: Ulrich Von Alpen, Martin Englmeier, Detlev Dürkop
-
Patent number: 6576846Abstract: A tubular elastic covering (730) for electric components (700), having on the whole predetermined values of mechanical and electric/environmental requirements, in which the mechanical requirements include expandibility and elastic recovery in a radial direction, and electric/environmental requirements comprise resistance to tracking and resistance to solar radiation, characterized in that said covering includes an inner insulating layer (680) and an outer insulating layer (660) coaxial with each other, in superposed relationship and bonded together, made of blends of cross-linked polymeric material, in which the cross-linked blend forming the inner layer has predetermined values of said mechanical requirements and the cross-linked blend forming the outer layer has predetermined values of said electric/environmental requirements.Type: GrantFiled: December 7, 2001Date of Patent: June 10, 2003Assignee: Pirelli Cavi S.p.A.Inventors: Francesco Portas, Ubaldo Vallauri
-
Patent number: 6573447Abstract: An electric device including a housing having a wall (2) made of solidified polymeric material and at least one electric component (5) which is situated inside the housing and is connected via at least one electric line (4) to at least one electric component which is situated outside or inside the housing, the line (4) being configured to be flexible and being at least partially embedded in the wall (2) of the housing during the molding and solidification of the housing.Type: GrantFiled: July 6, 2001Date of Patent: June 3, 2003Assignee: Firma Carl FreudenbergInventors: Günter Trogisch, Peter Schäfer, Stefan Plötz, Martin Quarder
-
Patent number: 6570092Abstract: A wire cable duct includes a grid made up of wires of two different types, namely longitudinal wires which run longitudinally the entire length of the duct and U-shaped transverse wires disposed transversely to the longitudinal wires, from place to place along their length and appropriately attached thereto. The resulting trough-like combination forms three panels, namely a bottom panel and two side panels. The side panels include a longitudinal row of successive planar and substantially rectangular edge meshes which constitute upper parts of the side panels, each of which is defined between two facing flange portions of two consecutive transverse wires, and each of which includes at least one anti-flexing member to limit its flexing about an axis perpendicular to its plane.Type: GrantFiled: January 23, 2001Date of Patent: May 27, 2003Assignee: Krieg & Zivy IndustriesInventor: Stéphane Quertelet
-
Patent number: 6566597Abstract: A pressing machine (10) for combining metal members (16) and plastic members (14) of shield assembles (12) includes a workbench (60), a cylinder (54), a guide device (100), and a pressing device (200). The workbench defines channels (70) for receiving the corresponding plastic members thereon. The pressing device includes two pressing blocks (220) defining cross indentions (228) for receiving protrusions formed in the plastic members to allow the metal members to be downwardly pressed thereby causing the cross cuts defined in the metal member to engage with the cross protrusions of the plastic member, and a pressing bar (222) forming pressing feet (232) for downwardly pressing inclined plates (40) formed in the metal members to allow apertures (42) defined in the inclined plates to engage with projections (24) formed in the tabs (22) of the plastic members.Type: GrantFiled: January 9, 2001Date of Patent: May 20, 2003Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Sheng Ching Lee, Ya Qiang He, Pin Cheng
-
Patent number: 6563042Abstract: An integrated radiating enclosure is disclosed. The enclosure housing is formed from a dielectric material with a radiating element formed on the exterior surface of the housing and a groundplane material formed on the interior of the housing. The groundplane provides EMI shielding for the enclosed electronics. The three antenna elements are directly connected to the circuitry of a transceiver system, thereby integrating the transceiver antenna components directly into the transceiver enclosure.Type: GrantFiled: May 21, 1999Date of Patent: May 13, 2003Assignee: Intel CorporationInventor: Darrell W. Barabash
-
Patent number: 6555742Abstract: An earth ground terminal provides an electroconductive substrate part and an electroconductive spring contact which protrudes integrally from one edge of the substrate part toward the side opposite to the substrate part. Through holes which have undergone a burring process are formed in the aforementioned substrate part. The earth ground terminal is used to prevent electromagnetic inductive interference, high-frequency inductive interference, etc. The earth ground terminal is effective when a printed substrate is grounded by a shield plate or a chassis.Type: GrantFiled: December 23, 1999Date of Patent: April 29, 2003Assignee: Tyco Electronics Logistics AGInventor: Izuru Kumagai
-
Patent number: 6552267Abstract: A flip chip-ball grid array package and a stiffening ring having first and second faces, and grooves formed in at least a one of the first and second faces of the stiffening ring. Providing grooves in at least one of the faces of the stiffening ring imparts of degree of flexibility to the stiffening ring to overcome and accommodate stresses induced in the manufacturing process associated with adhesive curing, solder reflow, chip underfilling and cavity filling, and differences in the coefficient of thermal expansion of the various materials used to construct the assembly. Furthermore, forming grooves in at least one of the faces of the stiffening ring provides increased surface area and therefore improves the heat transfer property of the stiffening ring. At the same time, the stiffening ring provides a sufficient degree of rigidity to the first substrate and to the microelectronic assembly in general to facilitate handling of the microelectronic assembly without damaging the chip or its solder connections.Type: GrantFiled: August 13, 2001Date of Patent: April 22, 2003Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Pei-Haw Tsao, Ken Chen
-
Patent number: 6548763Abstract: The present invention relates to a liquid or pastelike casting composition based on a polymeric matrix resin or on a mixture of such resins for producing self-healing electrical insulators, the casting composition including in uniform distribution a selected hydrophobicizing compound or a mixture of such compounds in encapsulated form. The casting composition includes a thermosettable casting resin system, based preferably on a thermosettable polycondensate, a thermosettable polyadduct, and/or a hybrid form thereof.Type: GrantFiled: June 20, 2001Date of Patent: April 15, 2003Assignee: ABB Research LtdInventors: Uwe Kaltenborn, Jens Rocks
-
Patent number: 6548756Abstract: A packaging and interconnection for connecting a contact structure to an outer component. The packaging and interconnection is formed of a contact structure mounted on a contact substrate, a contact trace formed on the contact substrate and electrically connected to the contact structure at one end and provided with a contact pad at another end, a print circuit board (PBS) pad provided on a PCB board substrate, a conductive lead for electrically connecting an upper surface of the contact pad and the connector, an elastomer provided under contact substrate, and a support structure provided between the contact structure, contact substrate and elastomer. The contact structure is projected from the contact substrate to a free space to allow free movements of at least a horizontal portion and a contact portion thereof.Type: GrantFiled: January 18, 2001Date of Patent: April 15, 2003Assignee: Advantest Corp.Inventors: Mark R. Jones, Theodore A. Khoury
-
Patent number: 6545224Abstract: A wire fixing portion (70) prevents an electric wire (4) from withdrawing from a wire receiving groove (61). The wire fixing portion (70) includes retaining pawls (71), an engagement member (72), etc. The retaining pawl (71) is elastically deformable between a restriction position in which the retaining pawl (71) retains the electric wire (4) to thereby restrict the electric wire from withdrawing from the wire receiving groove (61), and an allowable position in which the electric wire is allowed to withdraw from the wire receiving groove (61). The engagement member (72) engages with the retaining pawls (71) to thereby hold the retaining pawls (71) at the restriction position. When the engagement member engages between the retaining pawls (71), a gap (81) between the pair of the retaining pawls (71) extended upward from the both edges of the wire receiving groove (61) becomes narrower.Type: GrantFiled: October 18, 2001Date of Patent: April 8, 2003Assignee: Yazaki CorporationInventors: Yoshitsugu Sawada, Hiroyuki Suzuki, Takuya Hasegawa
-
Patent number: 6541704Abstract: A housing has second and third bays, where each bay receives equipment therein. The housing also has a plurality of lines traveling therein from a site such as a first bay to the second bay and the third bay. A line routing device is positioned above the second and third bays and routes the lines from the site to the second and third bays. Each line is secured at a common securing point above the second and third bays, and each of the second and third bays has a vertical down-channel at one side thereof. Each line extends from the securing point, through the line routing device, and down one of the down-channels such that the line when positioned to hang in either down-channel hangs substantially the same length within such down-channel.Type: GrantFiled: June 27, 2000Date of Patent: April 1, 2003Assignee: BellSouth Intellectual Property CorporationInventors: David W. Levenson, Glenn M. Mahony
-
Patent number: 6541705Abstract: A management rack for facilitating the routing and organization of a plurality of elongated members. The rack includes a frame, a spanning element having distinct edges thereof attached to the frame at distinct portions thereof, an organizational element disposed on the spanning element for routing and organizing at least some of the plurality of elongated members, a first hinge support disposed in a first location on the frame, a second hinge support disposed in a second location on the frame, and a door having a first hinge for engaging the first hinge support and having a second hinge for engaging the second hinge support whereby the door is rotatable on the hinges between a closed position where the portion of the frame between the first and second hinge supports is substantially covered by the door and thereby generally inaccessible and an open position where the portion of the frame between the first and second hinge supports is substantially uncovered by the door and thereby generally accessible.Type: GrantFiled: July 28, 2000Date of Patent: April 1, 2003Assignee: Panduit Corp.Inventor: Michael J. McGrath