Patents Examined by Wael Fabranyl
  • Silicon carbide barrier layers for porous low dielectric constant materials
    Patent number: 6410419
    Abstract: Interconnects in porous dielectric materials are coated with a SiC-containing material to inhibit moisture penetration and retention within the dielectric material. Specifically, SiC coatings doped with boron such as SiC(BN) show particularly good results as barrier layers for dielectric interconnects.
    Type: Grant
    Filed: August 7, 2000
    Date of Patent: June 25, 2002
    Assignee: Agere Systems Guardian Corp.
    Inventors: Sailesh Mansinh Merchant, Sudhanshu Misra, Pradip Kumar Roy