Abstract: A semiconductor package including a package substrate; a first semiconductor chip on the package substrate; a second semiconductor chip on an upper surface of the first semiconductor chip; an insulating layer on surfaces of the first semiconductor chip and the second semiconductor chip; a heat dissipation member on the insulating layer such that the heat dissipation member includes a region on an upper surface of the first semiconductor chip on which the second semiconductor chip is not disposed, and a region on an upper surface of the second semiconductor chip; a molding member on the package substrate and encapsulating the first semiconductor chip, the second semiconductor chip, and the heat dissipation member such that the molding member exposes at least a portion of an upper surface of the heat dissipation member; and a reinforcing member on the heat dissipation member and the molding member.

Abstract: An electronic apparatus that includes a first semiconductor chip mounted on a substrate; a second semiconductor chip mounted on the substrate; a spacer attached to the substrate and situated between the first and second semiconductor chips; a lid mounted on the substrate and enclosing the first and second semiconductor chips and the spacer, the spacer having an adhesive material adhesively attached to the lid; and underfill material underneath the first and second semiconductor chips, underneath the spacer and between the spacer and the first and second semiconductor chips.